➀ Samsung's ambition to enter the semiconductor foundry market in early 2022 was thwarted by its weaknesses in advanced packaging compared to TSMC.

➁ Samsung has been actively hiring key personnel and investing in advanced packaging technology to catch up with TSMC.

➂ Despite its early advancements in packaging technology, Samsung has struggled to maintain its competitive edge due to lack of investment and market focus.

➀ Intel needs to fill all its fabs to maintain competitiveness in the semiconductor manufacturing field;

➁ TSMC is rapidly expanding its competitive advantage through partnerships with Japan and Europe;

➂ Creating a universal foundry platform alliance would allow other fabs to utilize their manufacturing capabilities, benefiting Intel;

➃ Intel's failed acquisition of Tower Semiconductor due to regulatory hurdles is a missed opportunity;

➄ TSMC's collaboration with Japanese and European companies to build fabs is a strategic move;

➅ Intel needs to transform and consider establishing a universal foundry platform alliance to fill its fabs and packaging facilities.

➀ The M5 series chips will adopt TSMC’s advanced N3P node, with mass production expected in 2025 and 2026.

➁ M5 Pro, Max, and Ultra will use server-grade SoIC packaging and 2.5D封装 for improved yields and thermal performance.

➂ Apple’s PCC infrastructure will accelerate post-high-end M5 chip mass production for better AI inferencing.

➀ Taiwan's semiconductor industry is expected to grow by 16%, with TSMC's growth at 25%, driven by Intel orders, advanced process capacity, and AI orders.

➁ Analysts suggest that the U.S. restrictions on China's mature process may not be as effective as expected, and Taiwan's mature process companies should consider integration for economies of scale.

➂ TSMC's revenue growth rate is estimated to reach 25% in 2025, but the biggest variable is U.S. policy.