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October 8
- Adopting Record Revenue,ADATA Technology Forecasts Bright Future for Storage Industry
➀ ADATA Technology's September revenue hit NT$5.244 billion, up 5.24% month-over-month and 61.18% year-over-year, reaching a new high for a single month in nearly 19 years.
➁ The third quarter revenue reached NT$14.488 billion, up 55.19% year-over-year and 13.33% sequentially, marking the second-highest quarterly revenue in history.
➂ ADATA's Chairman, Chen Li-pai, predicts a severe supply shortage in the fourth quarter of 2025 and a prosperous storage industry in 2026 due to the strong demand from global CSPs and the rapid expansion of AI servers.
- Moor threading: China's Best GPU Aspirant
➀ Moor threading, founded in June 2020, aims to create the best all-function GPU in China.
➁ The company boasts a rich array of technical achievements, including five generations of GPU architecture chips for AI computing, high-performance computing, and more, along with the independently developed large language model MusaChat.
➂ Revenue has surged, growing from less than 50 million yuan in 2022 to 4.38 billion yuan in2024, and surpassing 7 billion yuan in the first half of 2025.
October 1
- The Future of SiC: Set to Replace 80% of Silicon IGBTs in 10 Years
➀ The article discusses the prospects of SiC technology, predicting that it will replace 80% of silicon IGBTs within a decade;
➁ Ant Agarwal, a professor at The Ohio State University, identifies the trend of SiC surpassing silicon IGBTs, emphasizing its applications in electric vehicles, renewable energy inverters, and industrial motor drive systems;
➂ Philippe Godignon, a researcher at the French Atomic Energy and Alternative Energies Commission (CEA), elaborates on the potential applications of SiC beyond power electronics, including in precision sensors, biotechnology, photonics, quantum optics, and high-energy environments like particle accelerators and fusion reactors.
- In-Depth Analysis of BIS Entity List Associated Rules
➀ Background: The traditional 'naming' system has flaws and aims to unify enforcement logic between BIS and OFAC sanctions.
➁ Applicable subjects: Includes entities on the Entity List, Military End User List (MEU List), and DNP entities linked to specific OFAC sanctions under EAR 744.8 clause. Foreign companies directly or indirectly held 50% or more by such entities are automatically subject to corresponding control requirements.
➂ Core rules: The 50% ownership rule states that any foreign company with one or more entities on the list holding 50% or more is subject to the same license requirements, exceptions, and policy review standards. The 'individually or collectively' ownership percentage must be aggregated.
➃ New rules and regulations: The article also discusses the new red flag rules, coordination with other systems, expansion of footnote D (FDP rules), temporary general licenses (TGL), appeal and exemption mechanisms, and the shift of compliance responsibility.
- Hyawei's 7.2Tbps High-Density Optical Engine Technology Based on Silicon Photonics Explained
➀ The H-ONE technology, a high-density optical-interconnect node engine, is presented, achieving a speed of 7.2Tbps with 200Gbps channels and 36 channels integrated, which is equivalent to nine 800G optical modules.
➁ The technology leverages the SiN-SOI platform for passive waveguides, Modulators, and supports low drift coefficient MUX/DeMUX and high-power laser coupling.
➂ Built-in laser technology reduces the number of fiber optic interface arrays and simplifies the difficulty of polarization-maintaining fiber coupling.
- Industrial Bank's 3 Billion Yuan Order for Domestic Servers Awarded to Hygon C86
➀ ICBC has placed a 3 billion yuan order for 2025 Hygon C86 server chips;
➁ Inspur, ZTE, and Lenovo were the main and backup contractors, respectively, all proposals based on Hygon's domestic chips, with a total procurement amount of 3 billion yuan;
➂ This signifies a new phase in the replacement of domestic servers in the financial sector, with domestic general processors becoming the main choice.
- 87 billion USD! AI Chip Unicorn Cerebras Secures New Financing, Valued at 57.7 billion USD
➀ Cerebras Systems, an AI chip unicorn, completed a $1.1 billion (approx. 7.8 billion RMB) G轮融资 on September 30, 2025, valuing the company at $8.1 billion (approx. 57.7 billion RMB).
➁ The company plans to use the financing to expand its AI chip design, packaging, system design, and AI supercomputer innovation, while also increasing its domestic manufacturing capacity and data center capacity in the US to meet the explosive growth in demand for its products and services.
➂ Founded in 2016, Cerebras is self-assessed as the 'fastest AI infrastructure manufacturer in the industry' and the 'fastest inference provider globally'.
- Understanding and Implementing 'Calculation-Electricity Synergy'
➀ Definition of 'Calculation-Electricity Synergy': It involves the coordinated layout of calculation centers and energy production bases to achieve efficient synergy between energy and calculation power.
➁ Reasons for 'Calculation-Electricity Synergy': It is driven by the 'double carbon' strategy, the 'East Data West Calculation' project, and the increasing demand for green electricity in the calculation power industry.
➂ Challenges and solutions of 'Calculation-Electricity Synergy': The challenges include the pressure on local power grids, the imbalance between high electricity supply standards and low load operation, and the insufficient supply of green electricity.
➃ Implementation paths of 'Calculation-Electricity Synergy': Promote power balance and consumption, tap into the potential of grid power supply and demand interaction, and improve the reliability and economy of electricity supply and demand.
➄ Representative cases or measures: Technical integration innovation, market mechanism change, infrastructure upgrade, and ecological cultivation and construction.
- US Announces New Export Control Rule Targeting Subsidiaries of Chinese Firms
➀ The US Bureau of Industry and Security (BIS) has introduced a new export control measure affecting subsidiaries of companies on the entity list.
➁ The rule applies restrictions to subsidiaries owned by entities with more than 50% ownership in listed companies.
➂ The purpose is to close loopholes that allow sanctioned companies to evade sanctions by setting up subsidiaries.
➃ This change impacts a wide range of global companies, particularly focusing on China's semiconductor and AI sectors.
August 13
- Decoding AI: AI’s Role in the Climate CrisisThe following article is a translated and edited version of an original Korean contribution from Professor Sujong Jeong of Seoul National University. One of Korea’s leading climate change experts, Jeong has conducted significant research into solutions to the climate crisis. In this article, Jeong shares his thoughts on AI’s impact on climate change. The Climate […] The post Decoding AI: AI’s Role in the Climate Crisis first appeared on SK hynix Newsroom .
May 23
- Chuan on X: Doubts on the Success of OpenAI's Hardware Project Due to Negative Cash Flow
➀ Chuan expresses doubts about the success of OpenAI's hardware project due to its negative cash flow of nearly $5 billion per year;
➁ Ming-Chi Kuo's industry investigation suggests that the new AI hardware device developed by Jony Ive and OpenAI is expected to be mass-produced in 2027;
➂ The device will be assembled and shipped outside of China to reduce geopolitical risks, with Vietnam as the current planned location;
➃ The current prototype is slightly larger than the AI Pin, with an exterior design reminiscent of the iPod Shuffle, but designs and specifications may change before mass production.
May 19
- Ming-Chi Kuo on X: Recent Updates on Nvidia Hardware: HGX B300 NVL8, DGX Spark, and N1X AI PCs/Laptops
➀ Nvidia has transitioned from HGX B300 NVL16 to NVL8 to accommodate faster GPU-to-GPU interconnects for LLMs with sparse MoE architectures like DeepSeek and LLAMA4.
➁ NVL8 and NVL16 both have 16 GPU dies, but NVL8 integrates two GPU dies per package, connected via NV-HBI, offering up to 10 TB/s bandwidth.
➂ The shift to NVL8 will enable Nvidia to predominantly use CoWoS-L packaging, optimizing supply chain management.
➃ DGX Spark uses the GB10 chip, expected to be in mass production around June-July, with end product shipments in August-September.
➄ The N1X is Nvidia’s Windows-on-ARM processor, requiring significant software optimization for laptop use and Windows support, potentially delaying laptops into 2026.
May 10
- The World's First AMD GPU Driven Over USB3: Now Available for Mac, Linux, and Windows
➀ The world's first AMD GPU driven over USB3 is now available for Mac users;
➁ Linux and Windows support is expected to work with the same setup;
➂ The ADT-UT3G is used to connect the GPU to the USB port;
➃ The level of engineering involved in this project is impressive.
May 9
- Nvidia AI Chip Shipments to Malaysia Break New Record: Nearly $3 Billion Worth of GPUs in April
➀ Despite U.S. warnings, Malaysia has been breaking records in chip imports, with nearly $2 billion worth of chips imported in March.
➁ In April, Malaysia imported nearly $3 billion worth of GPUs, setting a new record and showing a trend of triple-digit monthly increases since January 2025.
➂ Malaysia's GPU imports have reached $6.45 billion year-to-date, accounting for around 13% of Nvidia's total revenue in Q1 2024.
May 8
- SemiAnalysis on Neocloud H100/H200 GPUs: customers avoiding multi-year rental contracts
➀ Customers are no longer signing new multi-year rental contracts for Neocloud H100/H200 GPUs;
➁ The mass deployment of Blackwell GPUs starting in Q2 2025 has led to a decline in interest for Hopper rental contracts;
➂ The competition among Neoclouds for the same customers is driving down prices and contract lengths.
May 6
- Ray Wang on X: MediaTek's v7e TPU Project Delayed to Second Half of 2026 and AI Accelerator with ByteDance Poses Geopolitical Risks
➀ Recent rumors suggest a delay in MediaTek's TPU V7e project, which is likely to be confirmed.
➁ The delay is attributed to issues with the compute chip, with Google changing the design and system architecture.
➂ The delay may impact MediaTek's share price and revenue expectations for the project.
➃ MediaTek's TPU V8e project is still moving forward, but it is in an early development stage.
➄ MediaTek is in discussions with ByteDance for a second-generation AI accelerator, but the project is not yet finalized.
May 5
- AI Toys: The New Trend and Chip Solutions
➀ AI toys have become a new trend in the toy market with their unique experience of 'talking and thinking';
➁ The market size of AI toys is expected to reach $18.1 billion in 2024 and grow to $60 billion by 2033;
➂ Key chip manufacturers include Espressif Systems, Allwinner Technology, and Unisoc, offering various solutions for AI toys.
- Compute King on X: xAI's New 'X1' ASIC for LLM Training
➀ xAI's latest ASIC, not the widely known Dojo, is a new chip codenamed 'X1' designed specifically for LLM training.
➁ The chip will be produced using TSMC's most advanced 3nm N3 process, with an initial annual output of about 300,000 chips, of which Broadcom has received the order.
➂ The 'X1' chip is designed to enhance computational efficiency, featuring larger capacity SRAM and a dedicated Data Engine to reduce data movement energy consumption during model training and increase throughput.
May 2
- William Huo Discusses Huawei's 384-GPU Cluster: The Optical Network Revolution
➀ Huawei launched a 384-GPU cluster, focusing on the optical network rather than chips;
➁ Wccftech overlooked the significance of Huawei's optical network technology;
➂ Huawei's optical interconnect strategy surpasses Nvidia and AMD's copper bottlenecks, offering low latency and high bandwidth;
➃ Wccftech's reporting was criticized for lacking depth and ignoring important aspects of Huawei's technology;
➄ Huawei's optical network revolution avoids the expensive InfiniBand tax from Nvidia;
➅ The future of technology lies in optical networks, with Huawei leading the way;
➆ Wccftech's approach to tech journalism was deemed condescending and superficial.
May 1
- TikTok Confirms Plans to Build €1 Billion Data Centre in Finland
➀ TikTok plans to invest €1 billion in building its first data centre in Finland.
➁ The move is part of TikTok's strategy to address data storage for European users on the continent.
➂ The company aims to invest €12 billion over 10 years in data security, known as 'Project Clover'.
- Former ASML Head Scientist Lin Nan Leads China's EUV Breakthrough
➀ Chinese researchers have developed an EUV light source platform that operates at internationally competitive parameters, a breakthrough for the domestic production of advanced chips;
➁ The team, led by Lin Nan, has achieved world-class results in photolithography research using a solid-state laser-driven approach;
➂ The platform, based on a solid-state laser, has reached more than half of the conversion efficiency rate of commercially available CO2 laser-driven light sources, surpassing previous international benchmarks.
- Tariff War to Devastate Global Semiconductor Market: TechInsights Predicts a 34% Shrinkage by 2026
➀ The uncertainty of tariff policies due to the escalating US-China trade tensions is deeply impacting the global semiconductor market.
➁ TechInsights' latest report outlines various scenarios, including a 'base case' with stable tariffs, a 'moderate impact' case with increased tariffs, and an 'extreme impact' case with severe tariffs.
➂ Under the base case, the global semiconductor market is expected to reach approximately $777 billion in 2025 and $844 billion in 2026, with steady growth in data center and AI chip demand.
➃ In the moderate impact case, the market is projected to decline to $736 billion in 2025 and $699 billion in 2026.
➄ The extreme impact case predicts a market size of $696 billion in 2025 and a sharp drop to $557 billion in 2026, with significant impacts on data center construction costs, semiconductor equipment orders, and consumer demand.
- Will Glass Substrates Become Unnecessary with TSMC SoW-X?
➀ Glass substrates are divided into two categories: replacing the core material with glass and replacing the interposer with glass.
➁ The benefits of glass interposers include higher productivity and reduced thickness, solving the challenge of via holes in semiconductor manufacturing.
➂ TSMC's SoW-X does not use FCBGA, instead using a different method for electrical and signal connections.
➃ Glass substrates are not expected to replace all current technologies due to high costs and technical challenges, but will still be needed for certain applications.
April 26
- Control of Wafer Scanners: Methods and Developments
➀ The paper highlights control design aspects of wafer scanners in the semiconductor industry;
➁ Discusses challenges in control design to meet increasing demands on accuracy and speed;
➂ Covers mechatronic systems including light source generation, optical and metrology systems, and reticle and wafer stage systems;
➃ Addresses control challenges such as rejection of high-frequency aliasing disturbances, large-scale state reconstruction, vibration control, and thermal modeling.
April 1
- Chips Billionaire Yu Renrong's New Move: New Heng Hui Listed on A-share Market
➀ New Heng Hui Electronic Co., Ltd. (New Heng Hui) has been granted the approval for its initial public offering by the China Securities Regulatory Commission, with the company expected to be listed on the A-share market soon.
➁ New Heng Hui is the leading enterprise in the field of intelligent card packaging materials globally, focusing on intelligent card packaging materials and packaging and testing services. Its core product, flexible lead frame, is a key material for intelligent card chip packaging, directly affecting the cost and performance of intelligent card modules.
➂ Yu Renrong, the controlling shareholder of Shanghai Weil股份 and the largest shareholder of New Heng Hui, acquired New Heng Hui in 2018. New Heng Hui has been listed on the Shanghai Stock Exchange on March 22, 2023.
- Major Collaboration Announced: Infineon and Innosilicon Partner for GaN Technology
➀ Infineon and Innosilicon have announced a strategic collaboration for 8-inch GaN wafer manufacturing, potentially reshaping the power semiconductor industry.
➁ The partnership aims to enhance GaN power solution performance and supply chain resilience, with a focus on widespread application in consumer electronics, data centers, automotive, and industrial power systems.
➂ The collaboration will leverage the manufacturing capacities of both companies, with Innosilicon using Infineon's overseas and vice versa, to expand the GaN product portfolio and market supply capabilities.
- GlobalFoundries and UMC Merger Speculation: UMC Responds
➀ GlobalFoundries has been in contact with UMC regarding a potential merger, exploring a partnership two years ago but without progress.
➁ The proposed merger aims to create a larger wafer fabrication company, ensuring the supply of mature process chips in the US and investing in R&D.
➂ UMC and GlobalFoundries rank fourth and fifth in the wafer fabrication market with 5.5% and 4.7% shares respectively in Q4 2024.
➃ The combined revenue would reach $3.7 billion, potentially surpassing Samsung to become the second-largest wafer foundry after TSMC.
➄ Both companies have complementary process technologies and a production footprint across three continents.
➅ The merger faces challenges such as antitrust reviews by regulatory departments and handling agreements with Intel.
➆ UMC responded to the rumors by stating that there are no ongoing merger cases.
March 31
- Texas Instruments Announces Layoffs!
➀ Texas Instruments announced layoffs after receiving a $1.61 billion chip subsidy;
➁ The layoffs are part of a reform measure to support long-term operational plans, including job cuts at a factory near Tampa Bay Highway;
➂ Texas Instruments did not disclose the number of employees laid off, but said the figure was below the WARN Act notification threshold;
➃ The company received $9 billion for its Texas business and $7 billion for its Utah business as part of the $16.1 billion funding from the U.S. Department of Commerce;
➄ Despite the layoffs, Texas Instruments maintains its plan to build a second factory in Utah, but market concerns persist over the weakness of the analog chip market;
➅ Texas Instruments' fourth-quarter revenue was $4.01 billion, down about 2% year-on-year, and net profit was $1.205 billion, down 12% year-on-year;
➆ The company's embedded processing business revenue declined 18% year-on-year to $613 million, while other departments' revenue increased 7.3% year-on-year to $220 million.
- Jiang Shangyi: Intel is Now a 'Minor Player', Should Merge with Established Chip Technology Companies
➀ Jiang Shangyi, former Co-CEO of TSMC, openly discussed Intel's chip manufacturing challenges in a speech in Taiwan.
➁ He suggested that Intel should adopt mature chip manufacturing processes to compete, as it is far behind TSMC and unable to catch up.
➂ Jiang believes that Intel, once the 'king' of the chip industry, is now a 'minor player' and should merge with a company specializing in mass production of mature chip technology.
March 26
- Investing in Shanghai Chip Unicorn: 200 Million Yuan!
➀ Shanghai Yachuang Electronics Group Co., Ltd. plans to up to 200 million yuan in Shanghai Analog Semiconductor Technology Co., Ltd.;
➁ Yachuang Electronics has been focusing on the automotive, industrial, and power sectors, and is a well-known domestic agent and provider of automotive entertainment navigation solutions;
➂ Analog Semiconductor, founded in 2018, specializes in chip design for automotive intelligent driving linear products, and data converters, mainly targeting industrial and automotive markets.