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May 1

  • TikTok Confirms Plans to Build €1 Billion Data Centre in Finland

    微信公众号

    ➀ TikTok plans to invest €1 billion in building its first data centre in Finland.

    ➁ The move is part of TikTok's strategy to address data storage for European users on the continent.

    ➂ The company aims to invest €12 billion over 10 years in data security, known as 'Project Clover'.

  • Former ASML Head Scientist Lin Nan Leads China's EUV Breakthrough

    ChinaScience

    ➀ Chinese researchers have developed an EUV light source platform that operates at internationally competitive parameters, a breakthrough for the domestic production of advanced chips;

    ➁ The team, led by Lin Nan, has achieved world-class results in photolithography research using a solid-state laser-driven approach;

    ➂ The platform, based on a solid-state laser, has reached more than half of the conversion efficiency rate of commercially available CO2 laser-driven light sources, surpassing previous international benchmarks.

  • April 1

  • Chips Billionaire Yu Renrong's New Move: New Heng Hui Listed on A-share Market

    Unknown

    ➀ New Heng Hui Electronic Co., Ltd. (New Heng Hui) has been granted the approval for its initial public offering by the China Securities Regulatory Commission, with the company expected to be listed on the A-share market soon.

    ➁ New Heng Hui is the leading enterprise in the field of intelligent card packaging materials globally, focusing on intelligent card packaging materials and packaging and testing services. Its core product, flexible lead frame, is a key material for intelligent card chip packaging, directly affecting the cost and performance of intelligent card modules.

    ➂ Yu Renrong, the controlling shareholder of Shanghai Weil股份 and the largest shareholder of New Heng Hui, acquired New Heng Hui in 2018. New Heng Hui has been listed on the Shanghai Stock Exchange on March 22, 2023.

  • Major Collaboration Announced: Infineon and Innosilicon Partner for GaN Technology

    行家说三代半

    ➀ Infineon and Innosilicon have announced a strategic collaboration for 8-inch GaN wafer manufacturing, potentially reshaping the power semiconductor industry.

    ➁ The partnership aims to enhance GaN power solution performance and supply chain resilience, with a focus on widespread application in consumer electronics, data centers, automotive, and industrial power systems.

    ➂ The collaboration will leverage the manufacturing capacities of both companies, with Innosilicon using Infineon's overseas and vice versa, to expand the GaN product portfolio and market supply capabilities.

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