12/17/2024, 10:57 AM UTC
联电获得高通重要先进封装订单，挑战台积电行业主导地位UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
➀ 联电在先进封装市场取得重大突破；➁ 该合同用于高性能计算（HPC）应用；➂ 这一胜利挑战了台积电在该领域的长期主导地位。➀ UMC announced a significant breakthrough in the advanced packaging market; ➁ The contract is for high-performance computing (HPC) applications; ➂ The win challenges TSMC's long-standing dominance in the sector.---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
