12/31/2024, 03:47 PM UTC
➀ 台积电已开发出共封装光学(CPO)技术;➁ 该技术集成了芯片和光学器件;➂ 目的是缓解GPU(尤其是英伟达GPU)的过热问题。➀ TSMC has developed co-packaged optics (CPO) technology; ➁ The technology integrates a chiplet and an optical device; ➂ It aims to ease overheating in GPUs, particularly Nvidia’s GPUs.
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