Logo

SemiVoice

Anysilicon

Anysilicon 是一个全方位、信息丰富的半导体行业资源平台

今天

  • imec to set up €40m chiplet development centre in Germany

    ➀ imec, a leading nanoelectronics and digital technologies research center, is establishing an Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg, Germany.

    ➁ The €40 million center is funded over the next five years.

    ➂ The focus is on advancing automotive chiplet technology, enhancing Germany and Europe's position in this field.

  • Taiwan chipmaker UMC launches US$5 billion wafer fab facility in Singapore; 700 jobs to be created

    ➀ Taiwan's United Microelectronics Corporation (UMC) has launched a new US$5 billion wafer fabrication facility in Singapore;

    ➁ The facility, located in the Pasir Ris Wafer Fab Park, features a 22nm wafer fabrication process;

    ➂ The event was attended by senior Singaporean officials, highlighting the importance of the project.

  • March 27

  • Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

    ➀ Faraday Technology Corporation, a leading provider of ASIC design services, has selected Silvaco's FlexCAN IP for advanced automotive ASIC design.

    ➁ The collaboration aims to enhance the capabilities of automotive systems through the use of advanced semiconductor technology.

    ➂ Silvaco's FlexCAN IP is designed to meet the stringent requirements of automotive applications.

  • Power Semiconductor Giants amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges

    ➀ Power semiconductors, once a rising star with AI chips, are now facing challenges due to a slow EV market;

    ➁ Major players are reducing staff and delaying investments, with over 8,800 layoffs reported;

    ➂ The struggle is further compounded by the emerging competition from China.

  • March 25

  • FuriosaAI Rejects $800 Million Acquisition Offer from Meta, Opts for Independent Growth

    ➀ South Korean AI chip startup FuriosaAI has rejected an $800 million acquisition offer from Meta;

    ➁ The company has chosen to grow independently instead;

    ➂ Discussions between FuriosaAI and Meta have been ongoing since early this year.

  • Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

    ➀ Sarcina Technology has launched an innovative AI platform;

    ➁ The platform aims to provide cost-effective and customizable packaging solutions for AI applications;

    ➂ It utilizes ASE's FOCoS-CL assembly technology and includes an interposer for advanced packaging.

  • March 24

  • TSMC on Track for 2nm Production, Expected to Power Apple’s iPhone 18 in 2026

    ➀ TSMC is making significant strides in its 2nm process technology;

    ➁ The technology is expected to be adopted in Apple's iPhone 18 family;

    ➂ The new iPhone is expected to be released in the second half of 2026.

  • Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process

    ➀ Cadence successfully demonstrates first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry's 5nm automotive process;

    ➁ This milestone highlights Cadence's commitment to high-performance, automotive-grade IP solutions;

    ➂ The solution meets the stringent requirements of next-generation automotive and high-performance computing applications.

  • March 21

  • Zero ASIC launches world’s first open standard eFPGA product

    ➀ Zero ASIC has launched PlatypusTM, the world's first open-standard eFPGA IP product;

    ➁ Platypus features 100% open and standardized FPGA architectures;

    ➂ It also includes 100% open source FPGA bitstream formats.

  • March 20

  • SoftBank to Acquire Ampere Computing for $6.5 Billion, Doubling Down on AI and Arm Technology

    ➀ SoftBank Group has announced the acquisition of Ampere Computing, a Silicon Valley-based startup specializing in Arm-based server chips, for $6.5 billion.

    ➁ The deal is expected to close in the second half of 2025 and represents SoftBank's growing investment in artificial intelligence infrastructure.

    ➂ The acquisition reflects SoftBank's belief in the increasing importance of Arm-based technology in data centers.

  • Sofics and Dolphin Semiconductor Announce Strategic Partnership

    ➀ Sofics, a leading provider of specialized I/O and on-chip electrostatic discharge (ESD) solutions, and Dolphin Semiconductor, a leader in semiconductor IP solutions with a focus on mixed signal IP design, have announced a strategic partnership.

    ➁ The partnership aims to enhance IC designs for customers in key sectors.

    ➂ The collaboration is set to strengthen the capabilities of both companies in the semiconductor industry.

  • March 19

  • KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core

    ➀ KiviCore and CAST have released a new post-quantum cryptographic IP core, the KiviPQC™-KEM ML-KEM Key Encapsulation IP Core;

    ➁ This enables quantum-safe key exchange between two communicating parties;

    ➂ The technology is aimed at enhancing the security of cryptographic solutions in the face of quantum computing threats.

  • Silicon Catalyst announces the 3rd Annual “Arm Silicon Startups Contest”

    ➀ Silicon Catalyst, the world's only incubator dedicated to accelerating semiconductor solutions, has announced the 3rd Annual ‘Arm Silicon Startups Contest’;

    ➁ The contest is in partnership with Arm, known for its high-performance and energy-efficient computing platforms;

    ➂ Silicon Catalyst will organize and administer the contest, which is set to launch today.

  • March 17

  • February 2025 Review – Semiconductor Foundries and OSATs

    ➀ TSMC's revenue in February reached US$7.9 billion, marking an 11% decrease from January but a 43% increase year-over-year.

    ➁ UMC's February revenue was US$552 million, reflecting an unknown change from the previous month.

    ➂ The first two months of 2025 saw a 39% increase in revenue for TSMC compared to the same period in 2024.

  • Cadence Joins Intel Foundry Accelerator Design Services Alliance

    ➀ Cadence has officially joined the Intel Foundry Accelerator Design Services Alliance;

    ➁ This collaboration aims to drive innovation and support advanced chip design;

    ➂ The alliance aims to solidify Intel Foundry's leadership in cutting-edge semiconductor solutions.

  • March 14

  • InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

    ➀ InPsytech, a provider of high-performance semiconductor IP solutions, joins the Intel Foundry Accelerator IP Alliance;

    ➁ The collaboration aims to enhance HPC, AI, and automotive applications;

    ➂ InPsytech's advanced IP offerings will be integrated into the Intel Foundry ecosystem.

  • March 13

  • CAST and Shikino High-Tech Partner to Expand Silicon IP Offerings and Market Reach

    ➀ CAST, a leading provider of silicon IP solutions, and Shikino High-Tech Co., Ltd., a Japanese company specializing in semiconductor design, imaging, sensing, and testing technologies, have announced a strategic partnership.

    ➁ The partnership aims to expand both companies’ reach and offerings in the global semiconductor market.

    ➂ The collaboration is focused on enhancing the availability of silicon IP offerings.

  • March 10

  • Logic Fruit Technologies Releases High-Speed Interface IPs Stack for Advanced Computing

    ➀ Logic Fruit Technologies has released a new High-Speed Interface IP stack;

    ➁ The stack includes PCIe Gen6 Controller IP, PCIe Gen6 PHY IP, and CXL 3 Controller IP;

    ➂ The solutions ensure seamless data transfer and reliability for advanced computing applications.

  • PCIM Expo & Conference 2025

    ➀ The PCIM Europe Expo & Conference in Nuremberg, Germany, is the premier international event for power electronics, intelligent motion, renewable energy, and energy management.

    ➁ As the leading forum for industry and academia, PCIM Europe drives innovation across the entire value chain.

    ➂ It has been the established home of power electronics for decades.

  • 4Q24 Global Top 10 Foundries Set New Revenue Record, TSMC Leads in Advanced Process Nodes, Says TrendForce

    ➀ TrendForce's research indicates a polarized trend in the global foundry industry in 4Q24;

    ➁ Advanced process nodes are benefiting from strong demand in AI servers, flagship smartphone application processors, and new PC platforms;

    ➂ This demand has helped to counterbalance the slowdown in mature process demand, leading to a new revenue record for the top 10 foundries;

    ➃ TSMC leads in advanced process nodes.

  • March 7

  • Onsemi Proposes $6.9 Billion Acquisition of Allegro MicroSystems

    Onsemi has proposed an acquisition of Allegro MicroSystems for $6.9 billion, offering $35.10 per share in cash.

  • March 6

  • EnSilica Secures €2.13 Million European Space Agency Development Contract

    EnSilica plc, a leading mixed signal ASICs chip maker, has secured a €2.13 million development contract from the European Space Agency's NAVISP Element 2. The project is part of the European Space Agency's Navigation Innovation and Support Programme.

  • Elevating CT technology: photon counting and cost-efficient sensor modules from ams OSRAM

    ➀ With two new sensor modules, ams OSRAM showcases its dedication to Computed Tomography (CT);

    ➁ The sensor modules are at the core of cutting-edge diagnostic imaging technology, supporting a variety of clinical applications from oncology to cardiovascular treatments;

    ➂ These modules aim to ensure precise patient outcomes and improve diagnostic accuracy.

  • EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM

    ➀ Weebit Nano and Nanoveu Limited collaborate with EMASS on an ultra-low-power edge AI demonstration;

    ➁ The demonstration uses ReRAM technology;

    ➂ Weebit is a developer and licensor of advanced memory technologies;

    ➃ EMASS is a pioneer in ultra-low-power AI computing.

  • Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme

    ➀ Pragmatic Semiconductor introduces the Pragmatic FlexIC Platform Gen 3, a next-generation mixed-signal flexible ASIC design platform;

    ➁ The platform offers a 10x digital power and 3x digital area improvement compared to the previous generation;

    ➂ The platform includes a process design kit (PDK) compatible with standard electronic design tools.

  • AONDevices Partners with Faraday to Enhance Production Capabilities

    ➀ AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, has announced a strategic partnership with Faraday Technology Corporation.

    ➁ The collaboration aims to enhance AONDevices' production capabilities for its advanced AI processors.

    ➂ Faraday Technology brings its comprehensive manufacturing expertise to the partnership.

  • March 3

  • CAST Releases First Commercial SNOW-V Stream Cipher IP Core

    ➀ CAST today announced a new IP core that implements the SNOW-V stream cipher algorithm;

    ➁ The core is designed to meet the security and performance demands of modern communication systems;

    ➂ It is available for ASICs or FPGAs and is believed to be the first commercial offering of its kind.

  • February 27

  • VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs

    ➀ VeriSilicon has launched its new AI-based AI-NR and AI-SR series of image processing IPs;

    ➁ The series includes AINR1000 and AINR2000 for intelligent noise reduction, and AISR1000 and AISR2000 for advanced super resolution;

    ➂ These IPs offer cost-effective, highly efficient, and PPA-optimized implementations.

  • Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications

    ➀ Dolphin Semiconductor has announced a collaboration with Ingenic, a key player in high-performance SoC design in China.

    ➁ The company will provide Low Dropout (LDO) regulators in TSMC 22nm technology for camera applications.

    ➂ This collaboration reinforces Dolphin Semiconductor's position as a trusted partner in power management IP solutions.

  • SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips

    ➀ SkyWater Technology has entered into an agreement with Infineon Technologies AG to purchase Infineon's 200 mm fab in Austin, Texas, known as Fab 25.

    ➁ The acquisition includes a corresponding long-term supply agreement.

    ➂ SkyWater plans to operate the fab as a foundry to expand U.S. foundry capacity for foundational chips.

  • SemiVoice 是您的半导体新闻聚合器,探索海内外各大网站半导体精选新闻,并实时更新。在这里方便随时了解最新趋势、市场洞察和专家分析。
    📧 [email protected]
    © 2025