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May 1

  • Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports

    ➀ Worldwide silicon wafer shipments grew 2.2% YoY to 2,896 million square inches (MSI) in Q1 2025;

    ➁ Shipments declined 9.0% quarter-over-quarter compared to Q4 2024;

    ➂ SEMI Silicon Manufacturers Group (SMG) released the quarterly analysis of silicon wafer industry trends.

  • April 29

  • The Future of Semiconductors: A Deep Dive with Scott Bulbrook

    ➀ The article presents an interview with Scott Bulbrook, President of DA-Integrated, discussing the company's role in the semiconductor industry;

    ➁ DA-Integrated was founded to address gaps in test development services for advanced Application-Specific Integrated Circuits (ASICs);

    ➂ The company's vision has evolved to adapt to changing demands, focusing on cutting-edge semiconductor testing solutions.

  • April 28

  • UCIe™ — Universal Chiplet Interconnect Express

    ➀ UCIe drives modern chip design with high-bandwidth data transfer, thermal efficiency, and reduced leakage;

    ➁ Integrates bioinspired advancements, system co-optimization, and 3D packaging to transform AI, HPC, and consumer electronics;

    ➂ Advances optical I/O to push technological boundaries in semiconductor innovation.

  • Premier ASIC and SoC Design Partner Rebrands as Aion Silicon

    ➀ Aion Silicon (formerly Sondrel) rebrands to focus on advanced SoC and ASIC solutions;

    ➁ Leverages decades of expertise to address complex semiconductor development challenges;

    ➂ Introduces new leadership team and vision to enhance customer-centric chip design services.

  • April 25

  • Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions

    ➀ Certus Semiconductor has announced an official partnership with TSMC to join the TSMC Intellectual Property (IP) Alliance program;

    ➁ The program is a key element of the TSMC Open Innovation Platform® (OIP);

    ➂ The partnership aims to enhance custom I/O and ESD solutions for the semiconductor industry.

  • Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge

    ➀ QuickLogic's eFPGA IP is now integrated into Faraday's FlashKit™-22RRAM SoC development platform;

    ➁ The collaboration provides designers with unmatched flexibility and adaptability;

    ➂ The integration aims to enhance IoT edge solutions.

  • TSMC Unveils Next-Generation A14 Process at North America Technology Symposium

    ➀ TSMC unveiled its next-generation logic process technology, A14, at the North America Technology Symposium;

    ➁ A14 represents a significant advancement over TSMC's N2 process;

    ➂ It is designed to enhance AI transformation with faster computing and improved power efficiency.

  • April 23

  • KeyASIC Partners with AnySilicon to Expand Global Reach and Drive Lead Generation

    ➀ KeyASIC, a leading ASIC design services company, has partnered with AnySilicon;

    ➁ The collaboration aims to expand KeyASIC's marketing reach;

    ➂ Access to AnySilicon's extensive network of potential customers seeking ASIC design solutions is provided.

  • April 22

  • The Ultimate Guide to GaN HEMT

    ➀ The transition from silicon-based components to GaN technology is reshaping the electronics industry;

    ➁ GaN HEMTs provide superior efficiency and improved thermal management over traditional semiconductors;

    ➂ This guide is tailored for engineers and enthusiasts in modern electronics.

  • AMS verification: Ultimate Guide

    ➀ In the fast-evolving field of electronic design, ensuring the correct operation of complex mixed-signal designs is more critical than ever.

    ➁ Mixed-signal verification, or AMS verification, is at the core of this challenge, bridging the gap between analog and digital designs in a more digital world.

    ➂ As these technologies become more complex, understanding AMS verification becomes increasingly important.

  • April 17

  • The Ultimate Guide to DFN Package

    ➀ The DFN (Dual Flat No-leads) and QFN (Quad Flat No-leads) packages are gaining popularity in high-performance applications due to their compact size and advanced circuitry support.

    ➁ These packages are used in a wide range of applications, from consumer electronics to automotive systems.

    ➂ Understanding their specifications can significantly enhance design strategies and product development.

  • April 15

  • Vertex Growth announces commitment of €10M investment in Dolphin Semiconductor to accelerate growth strategy

    ➀ Vertex Growth, a Singapore-based growth-stage venture capital fund, has announced a €10M investment in Dolphin Semiconductor;

    ➁ The investment aims to support and accelerate the growth strategy of Dolphin Semiconductor;

    ➂ Dolphin Semiconductor is a leading provider of semiconductor IP solutions specializing in mixed-signal IP design.

  • April 14

  • GSME Secures $18 Million Growth Investment

    ➀ GS Microelectronics (GSME) has secured $18 million in growth investment;

    ➁ The investment is from a consortium of strategic partners and technology funds;

    ➂ The funds will be used to fuel GSME's growth plans including portfolio diversification and global service expansion.

  • Omni Design Technologies Offers 3nm, Single Core-voltage Supply Rail Process, Voltage and Temperature (PVT) Monitor

    ➀ Omni Design Technologies announced the availability of its high-precision PVT monitor;

    ➁ The ODT-PVT-ULP-001C-3 integrates seamlessly with a single core-voltage supply and a digital interface;

    ➂ The monitor supports 3nm technology and single core-voltage supply rail process.

  • April 9

  • Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production

    ➀ Hailo, a pioneering chipmaker of edge AI processors, has selected Avnet ASIC as its silicon channel partner for future chip production.

    ➁ Avnet ASIC is a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica.

    ➂ The collaboration is for future chips to be produced using TSMC's silicon technology.

  • CEO Talk: Bharath Desareddy, CEO of SmartSoC Solutions

    ➀ Tell me a bit about your background? How did you first get started with SmartSoC Solutions?

    ➁ After completing my education in engineering, I started my career in the semiconductor industry, working on silicon design and implementation.

    ➃ Over the years, I gained...

  • April 8

  • Cyient Announces the Launch of Semiconductor Subsidiary

    ➀ Cyient, a global engineering and technology solutions provider, has launched its fully owned semiconductor subsidiary, Cyient Semiconductors.

    ➁ The move aims to strengthen Cyient's commitment to innovation and excellence in the global semiconductor market.

    ➂ Cyient Semiconductors will leverage Cyient's expertise in semiconductor design.

  • April 1

  • imec to set up €40m chiplet development centre in Germany

    ➀ imec, a leading nanoelectronics and digital technologies research center, is establishing an Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg, Germany.

    ➁ The €40 million center is funded over the next five years.

    ➂ The focus is on advancing automotive chiplet technology, enhancing Germany and Europe's position in this field.

  • Taiwan chipmaker UMC launches US$5 billion wafer fab facility in Singapore; 700 jobs to be created

    ➀ Taiwan's United Microelectronics Corporation (UMC) has launched a new US$5 billion wafer fabrication facility in Singapore;

    ➁ The facility, located in the Pasir Ris Wafer Fab Park, features a 22nm wafer fabrication process;

    ➂ The event was attended by senior Singaporean officials, highlighting the importance of the project.

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