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October 7
- Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range
➀ Creonic updates its Doppler Channel IP core to enhance flexibility and precision for satellite communication simulations;
➁ The expanded model supports L, S, C, and X satellite frequency bands with wider sampling ranges;
➂ Designed to address evolving requirements in next-gen satellite systems and communication standards.
- Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion
➀ Amkor Technology begins construction of a $7 billion advanced semiconductor packaging and testing campus in Arizona, in partnership with the Trump Administration;
➁ The expanded investment adds cleanroom capacity and a second greenfield packaging facility, enhancing production capabilities;
➂ The facility aims to strengthen the U.S. semiconductor supply chain with cutting-edge packaging technologies.
October 6
- AMD signs AI chip-supply deal with OpenAI, gives it option to take a 10% stake
➀ AMD announces a multi-year agreement to supply its Instinct™ MI450 AI accelerators for OpenAI's next-gen AI infrastructure;
➁ OpenAI secures an option to acquire a 10% stake in AMD under specific terms;
➂ The deal strengthens AMD's position in the AI computing market, marking a strategic expansion in its AI capabilities.
- Weebit Nano tapes out embedded ReRAM test chips at onsemi production fab
➀ Weebit Nano successfully taped out embedded ReRAM test chips at onsemi's 300mm production facility in East Fishkill, NY;
➁ The milestone collaboration advances ReRAM technology toward commercial production;
➂ ReRAM aims to enable high-performance, low-power memory solutions for semiconductor applications like IoT and edge computing.
- ASIC North Enters Strategic Channel Partnership with GlobalFoundries
➀ ASIC North partners with GlobalFoundries to offer design services and production support across the semiconductor lifecycle;
➁ The collaboration aims to expand the global reach of GF's specialized semiconductor technologies;
➂ Focus on delivering end-to-end solutions for diverse applications through this strategic alliance.
October 2
- Key ASIC Berhad Signs RM1.11 Million Contract to Jointly Develop AI-Driven, Ultra-Low Power RF Navigation Chip with Middle East Partner
➀ Key ASIC Berhad signs RM1.11 million contract with a Middle Eastern navigation firm to co-develop an AI-driven RF-integrated navigation chip;
➁ The chip targets ultra-low power consumption and advanced navigation accuracy for applications in automotive and IoT sectors;
➂ Collaboration aims to strengthen Key ASIC's presence in AI-optimized semiconductor solutions for global markets.
September 30
- CAST Expands Security IP Portfolio with High Performance SM4 Cipher Core
➀ CAST launches a new SM4 Cipher IP Core for ASIC/FPGA designs, compliant with China's national standard (GB/T 7-2016);
➁ The hardware-optimized core provides high throughput (25 Gbps+ on 7nm) and low latency for cybersecurity applications like VPNs and payment systems;
➂ Enhances data protection with 128-bit security and various operation modes, positioning CAST as a security IP leader for Chinese and global markets.
September 26
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September 24
- Arteris Selected by NanoXplore for Space Applications
➀ Arteris announced that NanoXplore licensed its FlexGen NoC IP to develop radiation-hardened FPGA SoCs for space applications, addressing reliability and performance challenges;
➁ The FlexGen IP enables scalable and high-efficiency system-on-chip designs, critical for spacecraft and satellites requiring radiation tolerance;
➂ This collaboration strengthens Arteris' presence in aerospace semiconductors and supports NanoXplore's expansion of space-grade computing solutions.
- EnSilica and Codasip announce strategic partnership
➀ EnSilica and Codasip establish a strategic partnership to integrate CHERI-based cybersecurity technology;
➁ Focus on enhancing security for automotive, critical infrastructure, defense, and aerospace systems;
➂ Combines EnSilica's ASIC capabilities with Codasip's RISC-V CPU expertise for secure heterogeneous compute platforms.
September 18
- Historic Deal: Nvidia and Intel Join Forces to Reshape AI and Computing
➀ NVIDIA announced a $5 billion investment in Intel, acquiring a 4–5% stake at $23.28 per share, marking a historic partnership between the longtime rivals;
➁ The collaboration aims to jointly reshape the future of AI and advanced computing architectures, signaling a strategic alignment in semiconductor innovation;
➂ Analysts suggest the deal could redefine competitive dynamics in the chip industry while accelerating breakthroughs in AI-driven technologies.
September 9
- Global Semiconductor Sales Increase 20.6% Year-to-Year in July
➀ Global semiconductor sales reached $62.1 billion in July 2025, marking a 20.6% year-on-year increase and a 3.6% month-on-month growth;
➁ The Semiconductor Industry Association (SIA) reported sustained demand across sectors, particularly in automotive and computing applications;
➂ The data highlights the industry's continued recovery and expansion amid evolving market dynamics.
- 2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%, Says TrendForce
➀ Global foundry revenue hit a record $41.7B in 2Q25, up 14.6% QoQ, driven by China's consumer subsidies and early inventory buildup;
➁ TSMC dominated with 70% market share as capacity utilization and wafer shipments surged;
➂ TrendForce highlights stronger H2 demand from new smartphone/PC launches and AI server deployments.
September 5
- OpenAI Moves Into Chip Design With Broadcom as Mass Production Targeted for 2026
➀ OpenAI collaborates with Broadcom to develop its first custom AI chip ("XPU"), targeting mass production by 2026;
➁ The move aims to reduce reliance on NVIDIA's GPUs and strengthen control over AI infrastructure;
➂ The chip design combines Broadcom's semiconductor expertise with OpenAI's AI optimization requirements.
August 27
- Presto Engineering Announces New VP Sales & Marketing to Accelerate Growth in Turnkey ASIC Services
➀ Presto Engineering appoints Frédéric Valentin as VP of Sales & Marketing to strengthen its global expansion strategy;
➁ The appointment reflects the company's commitment to supporting OEMs with custom ASIC solutions;
➂ Focus areas include enhancing turnkey services for ASIC design, testing, and production.
August 21
- CEO Talk: Hiram Prasanna Samuel, Struent Semiconductors
➀ Hiram Prasanna Samuel, CEO of Struent Semiconductors, has over two decades of experience in the semiconductor industry;
➁ Struent focuses on delivering semiconductor innovations and solutions for High-Performance Computing (HPC) applications;
➂ The company is expanding its global footprint to address emerging technological challenges.
August 20
- Cirrus Logic and GlobalFoundries Expand Strategic Investment to Advance Next-Generation Mixed-Signal Semiconductor Manufacturing in the U.S.
➀ Cirrus Logic and GlobalFoundries expand partnership to accelerate next-gen mixed-signal semiconductor development;
➁ Focus on advanced audio solutions and U.S.-based manufacturing innovation;
➂ Collaboration aims to enhance process technologies and production capacity for high-performance chips.
August 11
- Global Semiconductor Market show continued growth in Q2 2025
➀ World Semiconductor Trade Statistics (WSTS) confirmed the global semiconductor market growth forecast through 2026;
➁ The global semiconductor market reached $346 billion in the first half of 2025, marking an 18.9% year-over-year increase;
➂ Growth was primarily driven by strong gains in the Logic segment.
August 7
- GlobalFoundries Q2 2025 Performance: Strategic Repositioning Amid Weak Consumer Demand
➀ Semiconductor demand shifts toward automotive, industrial AI, and communication infrastructure, while consumer electronics (e.g., smartphones) show slow recovery;
➁ GlobalFoundries pivots manufacturing and IP capabilities to prioritize high-value segments like automotive, datacenters, and industrial computing;
➂ Strategic repositioning targets sustainable growth by capitalizing on automotive electrification and industrial AI applications amid market changes.
August 6
- X-FAB Q2 2025 Performance: Solid Results, Upside Potential
➀ X-FAB delivered solid Q2 2025 results, capitalizing on rising demand for analog/mixed-signal technologies in automotive, industrial, and medical sectors;
➁ The company differentiates itself by avoiding the digital node race, focusing instead on specialty process technologies for power efficiency and reliability;
➂ Strategic positioning in critical growth areas strengthens its potential against larger foundries pursuing advanced nodes.
- Codasip looks to Silicon Creations’ PLL to drive RISC-V Automotive Safety-Critical Core
➀ Silicon Creations' low-area PLL technology integrates with Codasip's test chip for evaluating L31AS dual-core CPU and crypto accelerator;
➁ Collaboration advances automotive safety-critical systems using RISC-V cores and analog IP;
➂ PLL's compact design addresses space-sensitive automotive applications while ensuring reliability
August 5
- Global Semiconductor Sales Increase 7.8% from Q1 to Q2; Month-to-Month Sales Tick Up 1.5% in June
➀ Global semiconductor sales reached $179.7 billion in Q2 2025, a 7.8% quarter-over-quarter increase;
➁ June 2025 sales totaled $59.9 billion, reflecting a 19.6% year-over-year and 1.5% month-over-month growth;
➂ The Semiconductor Industry Association (SIA) attributed the growth to sustained demand and market resilience amid global challenges.
- Global Semiconductor Sales Increase 7.8% from Q1 to Q2; Month-to-Month Sales Tick Up 1.5% in June
➀ Global semiconductor sales reached $179.7 billion in Q2 2025, marking a 7.8% increase compared to Q1;
➁ June 2025 sales rose to $59.9 billion, up 19.6% year-over-year and 1.5% month-over-month;
➂ The growth reflects strong market recovery and demand across sectors like automotive and high-performance computing (HPC).
- TSMC Terminates Employees in Wake of Alleged 2 nm Trade-Secret Breach
➀ TSMC detected suspicious activities on August 5, 2025, potentially involving leaks of 2nm process trade secrets through routine monitoring systems;
➁ The company initiated internal investigations and legal measures after identifying unauthorized access to proprietary data;
➂ TSMC terminated employees linked to the incident, reinforcing its commitment to intellectual property protection amid advanced semiconductor development.
July 31
- Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support
➀ Creonic GmbH launches Version 6.0 of its DVB-S2X Demodulator IP core, enhancing configurability and technical performance;
➁ Key updates include expanded bitwidth and Annex M support for satellite communication applications;
➂ Strengthens Creonic's position as a leader in advanced communications IP solutions.
July 30
- Silvaco to Acquire Mixel, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions
➀ Silvaco Group (NASDAQ: SVCO) signs definitive agreement to acquire Mixel Group through an all-stock transaction;
➁ Mixel will operate as Silvaco’s Connectivity IP business unit post-acquisition, retaining existing leadership;
➂ Acquisition aims to combine Silvaco’s EDA software with Mixel’s mixed-signal IP for advanced timing closure solutions.
July 24
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June 27
- VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
➀ VeriSilicon launched ZSP5000 DSP series IPs based on fifth-generation architecture for computer vision and embedded AI;
➁ The series features scalable, energy-efficient design targeting edge intelligence devices;
➂ Combined with AI software ecosystem partnerships, it enhances efficiency in automotive/industrial edge computing.
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
➀ Arteris won the 'AI Engineering Innovation Award' at the 2025 AI Breakthrough Awards for its system IP technology;
➁ The company was recognized for accelerating AI chip design and SoC creation to meet growing compute demands;
➂ This award highlights Arteris' leadership in enabling AI hardware advancements through interconnect solutions.
June 26
- Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology
➀ Sofics announces silicon validation of its IP on TSMC's 2nm technology, achieving exceptional power, performance, and area (PPA) metrics near physical limits;
➁ The IP focuses on built-in robustness for advanced integrated circuits, addressing demanding requirements in next-generation semiconductor designs;
➂ Implementation leverages TSMC's nanosheet transistor architecture, positioning the technology for cutting-edge applications.