<p>➀ The M5 series chips will adopt TSMC’s advanced N3P node, with mass production expected in 2025 and 2026.</p><p>➁ M5 Pro, Max, and Ultra will use server-grade SoIC packaging and 2.5D封装 for improved yields and thermal performance.</p><p>➂ Apple’s PCC infrastructure will accelerate post-high-end M5 chip mass production for better AI inferencing.</p>