12/19/2024, 02:11 PM UTC
IDC 2025年半导体趋势预测IDC’s Semiconductor Trends For 2025
➀ 预计内存增长将超过24%，主要由HBM3和HBM3e等高端产品推动，HBM4预计将在2025年下半年推出。非内存预计增长13%，受AI服务器、高端手机IC和WiFi7对先进节点IC的需求驱动。➁ 亚洲-太平洋IC设计市场预计将增长15%，随着库存水平稳定、个人设备需求增加以及AI计算扩展到广泛应用。➂ 台积电在Foundry 1.0和2.0中的市场份额预计将增加，随着2nm和3nm等先进节点的扩张。➃ 预计2nm和3nm的生产将加速，台积电和三星将领先。➄ 预计晶圆代工利用率将增加，2025年是2nm量产的关键年份。➅ 中国的封装和测试市场份额预计将上升，2025年之后FOPLP将快速增长。➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.
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