➀ LightMatter unveiled its Passage M1000 3D photonic superchip targeting AI applications, emphasizing advancements in photonic computing;

➁ The chip incorporates a 16-wavelength dense wavelength division multiplexing (DWDM) optical link to achieve higher bandwidth density for hyperscalers;

➂ The company highlights its ability to leverage standard single-mode fiber for improved performance in AI infrastructure.

➀ The Hydro4U project, funded by the EU, develops climate-resilient small hydropower solutions in Central Asia, emphasizing affordability, ease of deployment, and adherence to ecological standards;

➁ Two demonstration plants—Francis Container Power Solution (FCPS) in Uzbekistan and Hydroshaft Power Solution (HSPS) in Kyrgyzstan—are implemented using modular and ecocompatible technologies;

➂ Advanced planning tools (GIS, BIM), community engagement, and partnerships aim to enhance energy security and economic opportunities while aligning with sustainability goals.

➀ Fraunhofer ILT showcases innovations in additive manufacturing at Formnext 2025, including high-strength tungsten components for fusion reactors and the SCaRB process for simultaneous coating and surface optimization;

➁ Development of multi-material coatings using EHLA and PEEK polymers offers PFAS-free alternatives, enhancing corrosion and wear resistance;

➂ Integrated printed sensors in metal components enable real-time monitoring, improving maintenance and operational reliability in industries like aerospace and energy

➀ Traditional 2D chips face performance and power limitations in AI/data center applications due to communication bottlenecks and Moore's Law constraints;

➁ Alphawave Semi's 3D UCIe IP on TSMC's SoIC-X (3DFabric platform) achieves 10x better power efficiency and 5x higher density than 2.5D solutions;

➂ The vertical stacking architecture enables disaggregated chiplet designs, overcoming memory bandwidth limitations for next-gen AI/HPC systems.

➀ Researchers at TU Wien, JKU Linz, and Bergakademie Freiberg developed a groundbreaking Silicon-Germanium (SiGe) transistor using modulation-acceptor doping (MAD), which replaces traditional semiconductor doping with a doped oxide layer, eliminating material impurities;

➁ The technology enables 4000x higher conductivity, improved low-temperature performance (critical for quantum chips), reduced energy consumption, and mitigates variability issues in nanoscale transistors;

➂ This advancement addresses challenges in quantum computing integration, where traditional doping fails under extreme cold, and paves the way for faster, energy-efficient nanoelectronics and quantum systems.

➀ Researchers achieved 98% accuracy in quantum gate operations using 3D-printed ion traps, enabling stable qubit performance with reduced fabrication time;

➁ The traps, produced via two-photon polymerization, shorten production time to hours and allow rapid testing of new hybrid planar-3D designs;

➂ The breakthrough supports applications in quantum computing, atomic clocks, and sensors, with findings published in Nature.

➀ The QSolid project, led by Forschungszentrum Jülich and Fraunhofer IZM-ASSID, aims to develop a German quantum computer with superconducting quantum chips and reduced error rates, utilizing an interposer to optimize qubit-electronics connections;

➁ A mid-term prototype with 10 qubits and integrated software was launched in 2025, with plans to scale performance by 2026 through advanced processor designs;

➂ The interposer supports over 10,000 high-density connections, thermal decoupling of components, and ongoing scalability tests, backed by €76.3 million in government funding to strengthen Germany’s quantum research sovereignty.

➀ The Fraunhofer IZM-ASSID, part of the QSolid project with 24 German institutions, is developing a quantum computer using superconducting qubits to reduce error rates, employing an interposer to optimize connections between qubits and control electronics;

➁ The 20x15mm interposer enables over 10,000 ultra-thin wirings and thermally decouples the quantum chip, with ongoing tests to scale its size for higher wiring densities;

➂ Funded by €76.3 million from the German government, QSolid aims to strengthen Germany’s quantum computing competitiveness, targeting industrial applications in chemistry, materials science, and healthcare by 2026.

➀ Anthony Paul Bellezza developed two solderless interconnect processes for advanced ICs, addressing challenges with traditional soldering;

➁ The fusion-based method uses low-temperature bonding (200-400°C) and martensitic substrates to create durable, ultra-low-resistance interconnects with environmental benefits;

➂ A secondary 2D graphene deposition process offers CMOS compatibility but is less durable, making it suitable for consumer electronics requiring frequent upgrades.

➀ Fraunhofer IZM and Akhetonics collaborate on the SPOC project to develop an all-optical quantum processor using advanced packaging technologies like thin-glass interposers and photonic wire bonding;

➁ Optical processors leverage photons for higher bandwidth, energy efficiency (up to 60x improvement), and scalability compared to traditional electronic systems;

➂ The SPOC project, funded by Investitionsbank Berlin, aims to deliver the first fully optical quantum processor by 2026 through iterative testing and hybrid material integration.

➀ Fraunhofer IZM and Akhetonics collaborate on developing a scalable all-optical quantum processor using light-based data processing, which promises 60x energy savings and higher bandwidth compared to electronic systems;

➁ The project employs advanced packaging technologies like glass-based interposers and photonic wire bonding, enhancing component integration efficiency by 50% and targeting miniaturization;

➂ Funded by Investitionsbank Berlin with €400,000, the SPOC initiative (2024-2026) aims to create a fully optical quantum computing platform through hybrid integration of optical materials.

➀ TSMC doubled its Arizona internship program to over 200 students, targeting talent for its advanced 4nm and future 2nm fabs;

➀ The U.S. government's $6.6B CHIPS Act supports TSMC’s third Arizona fab, aiming to create 6,000 jobs and onshore advanced chip production;

➂ Partnerships with ASU, Amkor’s $2B packaging facility, and state-funded apprenticeships strengthen the U.S. semiconductor ecosystem.

➀ ETH Zürich students created a rotating multi-metal 3D printer that processes multiple metals simultaneously, drastically reducing production time;

➀ The machine, designed for aerospace and industrial applications (e.g., rocket nozzles, turbines), uses a rotating platform for continuous printing and precise gas flow control;

➂ ETH filed a patent for this innovation, which aims to scale for larger components and broader use in fields like e-mobility and aviation.

➀ Fraunhofer FEP advances building-integrated photovoltaics (BIPV) using Nano-Imprint Lithography, enabling seamless solar module integration into facades without compromising aesthetics or efficiency.

➀ Decorative films on ETFE substrates achieve up to 80% efficiency of standard modules, with plasma treatments enhancing adhesion and weather resistance.

➂ Future steps include testing additional designs, colors, and long-term durability to boost BIPV adoption in architecture.

➀ Researchers from imec and Ghent University achieved a 120-layer stack of silicon and silicon-germanium (Si/Ge) using advanced epitaxial deposition, overcoming lattice mismatch challenges through carbon doping and temperature control.

➁ This breakthrough enables 3D DRAM development, allowing vertical stacking for higher memory density without increasing chip size, potentially revolutionizing storage capacity.

➂ The technology also benefits 3D transistors, quantum computing, and aligns with Samsung's 3D DRAM roadmap and next-gen architectures like GAAFET and CFET.

➀ Researchers at Chemnitz University of Technology developed millimeter-sized Smartlet microrobots with integrated electronics, sensors, and optocommunication, enabling autonomous movement and coordination in aqueous environments;

➀ The microrobots use an origami-inspired manufacturing approach to self-fold into 3D structures, powered by photovoltaics and controlled by embedded silicon chiplets, achieving decentralized control without external systems;

➀ Potential applications include environmental monitoring, medical diagnostics, and adaptive robotic systems, with future goals to expand sensory capabilities and evolve toward collective, organism-like behaviors.

➀ Part 2 introduces cutting-edge EDA tools for engineers to manage increasing chip complexities;

➁ Focuses on solutions for larger chip designs, tighter process nodes, and accelerated development timelines;

➂ Emphasizes maintaining quality standards while overcoming scaling challenges in semiconductor engineering.

➀ Chiplets enable modular integration of multiple silicon dies, improving compute performance and reducing manufacturing costs for complex SoCs and processors;

➁ They support heterogeneous design flexibility by combining different process nodes and materials to optimize power, performance, and area;

➂ Chiplet architectures address semiconductor scaling challenges while meeting demands for AI, HPC, and advanced packaging solutions.

➀ The video provides an update on the current status of the VITA 100 standards;

➁ It outlines the future roadmap for these standards;

➂ Viewers need to log in to access the content.

➀ The Sensor Application Center (SappZ) at OTH Regensburg celebrated its 15th anniversary, focusing on applied sensor research and technology transfer to SMEs;

➁ Innovations include 3D printing, AI-driven gas sensors (PreSEDA project), and miniaturized oil monitoring systems (microSPIN), leveraging AI for real-time analysis;

➂ The center has secured €15 million in funding, spawned five startups, and earned awards, reinforcing its role as a hub for regional innovation.