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thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻,包括HBM、DRAM和NAND等信息。

May 15

  • ISTE expects revenue increase from PECVD thanks to HBM market growth

    ➀ ISTE anticipates generating revenue in 2024 from plasma-enhanced chemical vapor deposition (PECVD) equipment due to HBM market expansion;

    ➁ The company identifies the current timing as optimal for entering the silicon carbon nitride (SiCN) PECVD equipment market;

    ➂ This aligns with surging demand for advanced packaging technologies driven by HBM's requirements, including 3D IC and through-silicon via (TSV) processes.

  • May 14

  • Samsung to outsource production of photomasks used in memory chip production

    ➀ Samsung plans to outsource photomask production for memory chips, a shift from its previous in-house strategy aimed at preventing technology leaks;

    ➁ The company is evaluating suppliers to manufacture low-end photomasks, indicating potential diversification in its supply chain;

    ➂ This move reflects Samsung's strategic adjustments in semiconductor manufacturing processes amid evolving industry demands and technological complexities.

  • Huawei operating at last 11 semiconductor fabs on DRAM and foundry

    ➀ Huawei operates at least 11 semiconductor fabs, expanding to 20 including R&D facilities;

    ➁ Facilities produce memory chips (including DRAM) and logic chips for IoT/mobile devices;

    ➂ Expansion supports China's semiconductor self-reliance strategy amid US export restrictions

  • May 1

  • Philoptics develop TGV hole inspection kit

    ➀ Philoptics developed an inspection kit for through glass via (TGV) holes to verify proper punching on glass substrates;

    ➁ The equipment generates 2.5D images by capturing side views of holes, enabling precise defect detection;

    ➂ This innovation enhances quality control in advanced semiconductor packaging processes.

  • April 30

  • Samsung aims to get HBM3E passed by Nvidia in June

    ➀ Samsung's HBM3E memory is set to undergo NVIDIA's final quality tests in June for supply approval;

    ➁ The company passed NVIDIA's audit at its Onyang Campus in March, meeting minimum technical requirements;

    ➂ The development marks a critical milestone in Samsung's efforts to supply HBM3E for AI and high-performance computing applications.

  • April 29

  • Sigetronics succeeds in manufacturing MOS controlled thyristor

    ➀ Chipmaker Sigetronics announced the successful manufacturing of MOS Controlled Thyristor (MCT), a semiconductor device for power switching;

    ➁ MCT can control large power and current, making it suitable for high-performance applications;

    ➂ The technology is utilized in military weapon systems and radar equipment due to its robust capabilities.

  • April 25

  • SK Hynix sees profit surge by 158% in first quarter

    ➀ SK Hynix reported Q1 2023 revenue of 17.63 trillion KRW and operating profit of 7.44 trillion KRW, marking its second-highest quarterly performance to date;

    ➁ Both figures slightly trailed the record highs set in the previous quarter;

    ➂ The company achieved a staggering 734% year-over-year increase in operating profit, driven by strong demand for memory solutions amid the AI and HPC boom.

  • April 24

  • SK Hynix verifies CXL 2.0 DDR5 with customer

    ➀ SK Hynix successfully verified its CXL 2.0 DRAM technology with a customer;

    ➁ The new CMM DDR5 96GB module offers 50% higher capacity and 30% wider bandwidth than previous DDR5 versions;

    ➂ Capable of processing 36GB of data per second, enhancing memory performance for advanced computing applications.

  • April 21

  • Hanmi Semiconductor’s TC bonders to Micron ahead in yield rate to Shinkawa’s

    Hanmi Semiconductor’s thermal compression (TC) bonders supplied to Micron for the production of high-bandwidth memory (HBM) have achieved higher yield rates than those supplied by Shinkawa, a Japanese rival, according to TheElec. Hanmi Semiconductor recently recalled its customers’ feedback to confirm the superior performance of its bonders.

  • April 17

  • Hanmi Semiconductor wins order from Micron to supply 50 TC bonders

    ➀ Hanmi Semiconductor has secured a significant order from Micron;

    ➁ The order is for thermal compression (TC) bonders used in HBM production;

    ➂ The deal is likely the reason for the increased TC bonder prices for Hanmi's other customer, SK Hynix.

  • Korea Wafer Holdings to demand 3S Korea open the books

    Korea Wafer Holdings, the largest shareholder of 3S Korea, is planning to send an official demand letter next week. The letter will request the company to open their accounts and certify copies of accounting documents. These documents are sought for a comprehensive review, including those related to financial and operational matters.

  • April 16

  • 3S Korea’s new owner prepare for shakeup after 'mismagement'

    3S Korea's new majority shareholder is preparing for a major reshuffle of the company's executives following allegations of 'mismangement' by the previous largest shareholder. Korea Wafer Holdings, having spent 13.7 billion won on April 1 to acquire a 12% stake in the wafer shipping box manufacturer, is scrutinizing the previous shareholder's management practices.

  • April 15

  • Samsung Foundry keeps fined foundry partner in supply chain

    ➀ Samsung Foundry has named Wethemax as its Design Solution Partner (DSP) earlier this year;

    ➁ TheElec discovered that Wethemax was fined 10 billion won by the foundry last year for malpractice;

    ➂ This is an unusual move for Samsung, known for its strict supplier policies.

  • April 14

  • SK Hynix to increase facility spending by 30% amid HBM demand surge

    SK Hynix has decided to increase its planned CAPEX by 30% this year due to the surge in demand for high-bandwidth memory (HBM). Initially planning to spend 22 trillion won on facility expansion, the company has now increased this to 29 trillion won, according to sources.

  • April 11

  • SK Hynix beats Samsung to becomes top vendor of DRAM for the 1st time

    SK Hynix has become the world's largest vendor of DRAM based on revenue for the first time in its history. According to Counterpoint Research, in the first quarter of this year, SK Hynix held a 36% market share in the DRAM market, followed by Samsung with 34% and Micron with 25%. This milestone marks a significant shift in the DRAM market landscape.

  • April 9

  • E-beam firm SEC eyes HBM, TGV, 4680 battery for future growth

    Electrical beam equipment manufacturer SEC, known for supplying X-ray inspection systems, is more than just an X-Ray equipment maker. The company leverages its e-beam technology to offer non-destructive inspection platforms that are more cost-competitive and flexible in design. SEC CEO Jongh discusses the company's future growth strategies.

  • April 7

  • Korean fab equipment makers see profit jump from HBM, advanced packaging

    South Korean fabs saw a profit increase last year, primarily due to high-bandwidth memory (HBM) and advanced packaging technologies. TheElec analyzed the financial filings of 46 major fab equipment manufacturers in the country.

    Hanmi Semiconductor, one of the companies reviewed, experienced a notable rise in profits.

  • April 1

  • SFA supplies inspection kit for HBM and glass substrates to major chipmaker

    SFA has developed three different kinds of metrology and inspection (MI) machines and has supplied one of them to a major South Korean chipmaker.

    The company has supplied a white light interferometry (WLI)-based height measurement machine to the conglomerate and plans to supply four additional units.

  • Zeus sees revenue jump last year thanks to HBM

    Zeus, a South Korean semiconductor equipment manufacturer, reported revenue of 315.7 billion won last year, a 69% increase from 2023, according to its filings on Monday. It also returned to profitability with an operating income of 39.1 billion won. This growth is attributed to Zeus's timely development of cleaners for high-bandwidth memory.

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