Recent #HBM news in the semiconductor industry
HBM（High Bandwidth Memory）是一种高性能内存技术，通过3D堆叠DRAM，实现了超高的数据传输速率。应用于高带宽和低延迟应用领域，如GPU。主要厂家有Hynix、Samsung和Micron等。
12/25/2024, 08:02 AM UTC
SK海力士获得Broadcom大订单：为谷歌、Meta和字节跳动打造AI芯片SK hynix has major HBM order to Broadcom: which is making AI chips for Google, Meta, ByteDance
➀ 据传闻，SK海力士将在2025年向Broadcom交付大量HBM内存订单；➁ Broadcom正在为谷歌、Meta和字节跳动开发新的AI芯片；➂ SK海力士将增加其HBM产能以满足需求。➀ SK hynix is rumored to deliver a significant HBM memory order to Broadcom in 2025; ➁ Broadcom is developing new AI chips for Google, Meta, and ByteDance; ➃ SK hynix will increase its HBM production capacity to meet the demand.
12/24/2024, 02:00 PM UTC
如果我是英特尔CEO，我会怎么做？What would you do if you were the CEO of Intel?
➀ 英特尔在技术宣布中转向更加透明的策略；➁ 英特尔PowerVia与台积电Super Power Rail之间的竞争；➂ 安迪·格鲁夫保持‘适度忧虑’的哲学。➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
12/23/2024, 06:00 PM UTC
消费者内存增长不及AI，Micron业绩预警引发股价下跌Consumer memory slowing more than AI gaining
➀ Micron公布符合预期的收入和每股收益，但提供疲软的业绩指引；➁ 驱动AI的内存需求激增，而消费者内存面临挑战；➂ 市场对Micron股价的担忧，由于AI和消费者内存增长之间的不平衡。➀ Micron reports revenue and EPS in line with expectations but provides weak guidance; ➁ AI-driven memory demand surges, while consumer memory struggles; ➂ Market concerns over Micron's stock due to the imbalance between AI and consumer memory growth.
12/23/2024, 01:02 AM UTC
埃德嗅到欧洲的机会Ed Sniffs Euro-Wonga
➀ 埃德认为欧盟的‘ECS经纪’是一个鼓励英国技术人才获取欧洲资金的方法；➁ 他已经说服部门为研究人员、发明家、初创 企业和中小企业参加这些活动提供预算；➂ 他正在探索斯肯索普量子利用欧洲发展基金的机会。➀ Ed sees the EU's 'ECS Brokerage' as a way to encourage UK techies to access European funds; ➁ He has convinced the Department to allocate a budget for researchers, inventors, startups, and SMEs to attend these events; ➂ He is exploring opportunities for Scunthorpe Quantum to benefit from European development funds.
12/22/2024, 12:34 PM UTC
Copilot+ 笔记本前景堪忧：AI PC '超级周期' 已成泡影，分析师如是说Bad news for Copilot+ laptops: AI PC 'supercycle' is a bust already claims one analyst
➀ 微软的 Copilot+ 笔记本等 AI 笔记本面临不确定的未来；➁ 美光 Q3 收益低于预期；➂ 预计的 AI PC 和智能手机 '超级周期' 并未实现➀ AI laptops like Microsoft's Copilot+ PCs face uncertain future; ➁ Micron's Q3 earnings weaker than expected; ➂ AI PC and smartphone 'supercycle' not materializing as projected
12/20/2024, 03:19 PM UTC
三星电子获得博通的大额HBM订单SK Hynix wins large order for HBM from Broadcom
➀ 三星电子从博通获得了一笔大额的HBM订单；➁ 这些芯片将被用于一家大型科技公司的AI计算芯片；➂ 这笔交易预计将增强三星电子在高性能内存市场的地位。➀ SK Hynix has secured a significant order for HBM from Broadcom; ➁ The chips will be used in an AI computing chip for a major technology company; ➂ The deal is expected to enhance SK Hynix's market position in high-performance memory.
12/19/2024, 08:39 PM UTC
CXL技术终于在2025年到来CXL is Finally Coming in 2025
➀ 计算表达式链接（CXL）技术预计将在2025年从利基市场转向主流应用；➁ CXL对内存扩展的支持是主要驱动力，现在有各种服务器和内存解决方案可用；➂ CXL 2.0和未来的PCIe/CXL版 本将实现更高级的应用，如交换和动态内存分配。➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
12/18/2024, 02:00 PM UTC
机器学习与多物理场在3D设计和HBM中的应用ML and Multiphysics Corral 3D and HBM
➀ 3D设计与HBM在先进半导体系统 中至关重要；➁ 大型系统设计需要多芯片封装；➂ 多物理场和机器学习对于优化性能和可靠性至关重要。➀ 3D design with HBM is critical for advanced semiconductor systems; ➁ Large system designs require multi-chiplet integration; ➂ Multiphysics and ML are essential for optimizing performance and reliability.
12/16/2024, 12:20 PM UTC
蔡崇信与埃隆·马斯克联手机器人C.C.Wei and Elon Musk hooking up on robots
➀ 蔡崇信与埃隆·马斯克正在合作开发多功能机器人；➁ 马斯克计划于2026年推出名为Optimus的多功能人形机器人；➂ 蔡崇信强调无人机和人工智能在水资源、电力等公用事业领域的应用的重要性。➀ C.C. Wei and Elon Musk are collaborating on multifunctional robots; ➁ Musk plans to launch a multifunctional humanoid robot named Optimus in 2026; ➂ Wei emphasizes the importance of drones and AI applications in utilities such as water and electricity provision.
12/13/2024, 02:15 PM UTC
英国在塑料电子领域的领先地位UK Leads In Plastic Electronics
➀ 英国在塑料电子领域是全球的领导者；➁ 曼德尔森勋爵强调了为行业制定路线图的重要性，以从尖端技术走向大众市场；➂ 斯旺西大学和威尔士印刷与涂覆中心参与开发使用塑料电子的新产品线。➀ The UK has been a global leader in the Plastic Electronics sector; ➁ Lord Mandelson emphasized the importance of a roadmap for the industry to move from cutting-edge to mass market; ➂ Swansea University and the Welsh Centre for Printing and Coating are involved in developing new product lines using plastic electronics.
12/13/2024, 09:18 AM UTC
利用人工智能实现更好的光伏材料Using AI to Achieve Better Photovoltaic Materials
➀ 卡尔鲁厄理工学院的研究人员通过人工智能和高通量合成找到了新的有机分子，以提高钙钛矿太阳能电池的效率。➁ 开发的策略可以应用于其他材料研究领域，如新型电池材料。➂ 该团队使参考太阳能电池的效率提高了2%，达到26.2%。➀ Researchers at KIT have found new organic molecules to improve the efficiency of perovskite solar cells with the help of AI and high-throughput synthesis. ➁ The strategy developed can be applied to other areas of material research, such as new battery materials. ➂ The team achieved a two percent efficiency increase for a reference solar cell, reaching 26.2 percent.
12/12/2024, 02:00 PM UTC
寓言：牛仔CEO的故事Fable: The Cowboy CEO
➀ 这位CEO以他的十加仑帽子和牛仔靴闻名，创立的公司收购了60多家电信公司，市值一度高达1860亿美元。➁ 在一个季度亏损的情况下，公司报告了138亿美元的净利润。➂ 他从公司借款4.08亿美元来弥补保证金调用，最终违约，并在监狱中度过了13年。➀ The CEO, known for his ten gallon hats and cowboy boots, founded a company that acquired over 60 telecoms companies and had a peak market cap of $186 billion. ➁ In one quarter with a loss, the company reported a net profit of $1.38 billion. ➂ He borrowed $408 million from the company to cover margin calls and defaulted on the debt, spending 13 years in jail.
12/12/2024, 12:17 PM UTC
GMG的THERMAL-XR(R)在电子散热片微型化和效率方面展现潜力GMG's THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and Efficiency
➀ GMG的THERMAL-XR®涂层散热片展示了微型化和效率的潜力；➁ 该技术可以将散热片尺寸减少高达39%，同时保持等效的散热性能；➂ THERMAL-XR®的应用可以提高散热片的效率，实现更小的散热片和更紧凑的PCB组装。➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.
12/10/2024, 06:20 AM UTC
SEMI：半导体制造设备销售额达到1130亿美元，创历史新高Equipment sales hit record $113bn, says SEMI
➀ SEMI预测2024年半导体制造设备销售额将同比增长6.5%，达到1130亿美元，预计2025年为1210亿美元，2026年为1390亿美元。➁晶圆厂设备（WFE）部门预计将增长5.4%，达到1010亿美元，受DRAM、HBM和中国推动。➂后端设备销售预计将激增，测试设备销售在2025年增长14.7%，在2026年增长18.6%。➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 6.5% year-on-year to $113 billion in 2024, with projections of $121 billion for 2025 and $139 billion for 2026. ➁ The wafer fab equipment (WFE) segment is expected to grow 5.4% to $101 billion in 2024, driven by DRAM, HBM, and China. ➂ Back-end equipment sales are projected to surge, with test equipment sales increasing 14.7% in 2025 and 18.6% in 2026.
12/09/2024, 03:51 PM UTC
英特尔Arc B580在早期基准测试中与RTX 4060和RX 7600交锋 —— B580在OpenCL和Vulkan工作负载中比A580快30%Intel Arc B580 trades blows with the RTX 4060 and RX 7600 in early benchmarks — B580 beats A580 by up to 30% in OpenCL and Vulkan workloads
➀ 英特尔Arc B580在早期基准测试中比其前代产品A580快30%以上；➁ 基准测试在OpenCL和Vulkan API上完成；➂ Arc B580的价格低于RTX 4060，但性能快10%。➀ Intel's Arc B580 outperforms its predecessor, A580, by up to 30% in early benchmarks; ➁ The benchmarks were conducted across the OpenCL and Vulkan APIs; ➂ The Arc B580 is 10% faster than the RTX 4060 at a lower price point.
12/09/2024, 06:02 AM UTC
Farnell年终促销Farnell end-of-year sale
➀ 慧荣科技全球宣布在EMEA地区推出测试与工具（T&T）产品的年终促销活动；➁ 该促销活动包括广泛测试与工具产品的显著折扣；➂ 促销活动将于2025年1月31日结束。➀ Farnell Global has announced end-of-year offers on Test & Tools (T&T) products across the EMEA; ➁ The sale includes significant discounts on a wide range of T&T products; ➂ The promotional period ends on January 31, 2025.
12/07/2024, 03:35 PM UTC
博通推出专为AI和HPC设计的巨无霸3.5D XDSiP平台——6000mm²堆叠硅芯片，配备12个HBM模块Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
➀ 博通推出了专为AI和HPC设计的3.5D XDSiP平台；➁ 该平台采用台积电的CoWoS和其他先进封装技术；➂ 平台支持最多6000mm²的3D堆叠硅芯片和12个HBM模块的系统封装，预计2026年推出。➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.
12/06/2024, 01:23 PM UTC
被暗杀的联合健康CEO涉嫌使用AI拒绝患病者保险Assassinated UnitedHealthcare CEO allegedly used AI to deny sick people coverage
➀ 一项集体诉讼指控联合健康保险公司使用一个有缺陷的算法拒绝患者保险，由两名现已去世的个人提起。➁ 联合健康保险公司首席执行官布 莱恩·汤普森本周在曼哈顿中城被杀，嫌疑人目前仍在逃。➂ 诉讼声称联合健康保险公司促使员工使用一个错误率约为90%的算法来拒绝保险。➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
12/05/2024, 08:53 AM UTC
首个可编程连接模块First Programmable Connectivity Module
➀ 本文讨论了首个可编程连接模块，这是电子行业的一项重大发展；➁ 可能探讨了其功能和潜在应用；➂ 该模块可能与连接技术方面的进步有关，影响游戏、人工智能和汽车等各个领域。➀ The article discusses the first programmable connectivity module, a significant development in the electronics industry; ➁ It likely explores its features and potential applications; ➂ The module could be related to advancements in connectivity technology, impacting various sectors such as gaming, AI, and automotive.
12/02/2024, 06:00 PM UTC
Breker如何帮助解决RISC-V认证问题How Breker is Helping to Solve the RISC-V Certification Problem
➀ RISC-V核心的兴起和认证的挑战；➁ Breker验证系统在认证过程中的作用；➂ 认证RISC-V ISA实现的复杂性以及RISC-V国际组织的努力。➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
11/23/2024, 10:19 AM UTC
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11/21/2024, 07:37 AM UTC
YEST将为SK海力士提 供用于HBM生产的eFurnaceYEST to supply eFurnace used in HBM production to SK Hynix
➀ YEST宣布将为SK海力士提供价值111.6亿韩元的eFurnace；➁ 该eFurnace用于净化晶圆并提高其电学特性；➂ 预计SK海力士将使用该设备进行HBM生产。➀ YEST announced that it will supply 11.16 billion won worth of eFurnace to SK Hynix; ➁ The eFurnace is used for purifying wafers and enhancing their electrical properties; ➂ SK Hynix is expected to use the equipment in HBM production.
11/05/2024, 10:32 AM UTC
SK海力士将在2025年初提供HBM3E 16H样品SK Hynix to provide HBM3E 16H samples in early 2025
➀ SK海力士计划在2025年初提供其第五代高带宽内存（HBM）HBM3E 16H的样品；➁ HBM3E 16H采用16片堆叠的DRAM芯片，并将继续使用大规模再流成型技术；➂ SK海力士首席执行官Kwak Noh-jung在SK集团主办的活动上宣布了这一消息。➀ SK Hynix is scheduled to provide samples of its Gen 5 HBM, HBM3E 16H, in early 2025; ➁ The HBM3E 16H features 16 stacked DRAM dies and will utilize mass reflow molding technology; ➂ SK Hynix CEO Kwak Noh-jung announced this at an event hosted by SK Group.
11/01/2024, 02:44 AM UTC
三星提升关键HBM供应，暗示与台积电合作[News] Samsung Advances Key HBM Supply, Hints at TSMC Partnership
➀ 三星电子在第三季度财报中宣布，尽管利润大幅下降，但盈利情况超出预期。➁ 公司强调其在高带宽内存（HBM）供应方面的进步。➂ 三星暗示可能将与台积电进行合作，表明在半导体行业中进行战略布局的意图。➀ Samsung Electronics reported a better-than-expected profit in its third-quarter earnings, despite a significant decline in profits. ➁ The company highlighted its advancement in high-bandwidth memory (HBM) supply. ➂ Samsung hinted at a potential partnership with TSMC, indicating a strategic move in the semiconductor industry.
10/31/2024, 07:08 AM UTC
三星芯片部门第三季度利润下降40%，销售额创新高[News] Samsung’s Chip Division Sees 40% Profit Drop in Q3 as Sales Hit Record High
➀ 三星芯片部门2024年第三季度利润下降40%；➁ 尽管如此，销售额达到历史新高；➂ 强调了对HBM进展和先进节点良率问题的担忧。➀ Samsung's chip division experienced a 40% profit decline in Q3 2024; ➁ Despite this, sales reached a record high; ➂ Concerns over HBM progress and yield issues on advanced nodes were highlighted.
10/26/2024, 10:31 AM UTC
SK海力士发布2024年第三季度财报：利润创新高，AI内存、HBM和eSSD需求爆炸性增长SK hynix posts record-high Q3 2024 profit, sales of 'explosive' demand of AI memory, HBM, eSSDs
➀ SK海力士2024年第三季度利润创纪录新高；➁ AI内存、HBM和eSSD销量呈现爆炸性增长；➂ SK海力士巩固了其在全球AI内存技术提供商中的领先地位。➀ SK hynix posts record-high Q3 2024 profit; ➁ Sales of AI memory, HBM, and eSSDs see 'explosive' demand; ➂ SK hynix solidifies its position as the world's No.1 AI memory technology provider.
10/24/2024, 12:00 PM UTC
谷歌或采用台积电N3E工艺替代2nm制造Tensor G6[News] Google Reportedly Adopts TSMC’s N3P Process instead of 2nm for Tensor G6
➀ 据传闻，谷歌将采用台积电的N3E工艺制造Tensor G5；➁ 报告还明确指出，谷歌没有选择为Tensor G6使用2nm技术；➂ 这一举措可能影响AI和智能手机芯片市场的竞争。➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
10/16/2024, 01:00 PM UTC
移动LLM不只是技术。实际应用案例才是关键Mobile LLMs Aren’t Just About Technology. Realistic Use Cases Matter
➀ 谷歌正在探索在移动设备上运行大型语言模型（LLM）的可行性；➁ 谷歌在移动设备上优化LLM的技术；➂ 移动设备上LLM实际应用案例的重要性➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
10/02/2024, 08:46 PM UTC
SK海力士向ASMPT订购TC bonding机SK Hynix places order for TC bonders to ASMPT
➀ SK海力士向ASMPT订购了大量热压缩 bonding 机；➁ 这些设备将用于生产其最新迭代的高带宽内存 HBM3E 12H；➂ 订单包括超过 30 台设备。➀ SK Hynix has placed a significant order for thermal compression bonders from ASMPT; ➁ The equipment is for the production of HBM3E 12H, SK Hynix's newest high-bandwidth memory; ➂ The order includes over 30 units of the equipment.
10/02/2024, 08:27 AM UTC
Rambus详解HBM4内存控制器：高达10Gb/s速度，每堆栈64GB容量Rambus details HBM4 memory controller: up to 10Gb/s, 2.56TB/sec bandwidth, 64GB per stack
➀ Rambus发布了新的HBM4内存控制器，速度高达10Gb/s，带宽为2.56TB/sec；➁ HBM4的带宽比HBM3E快33%，比HBM3快两倍；➂ 预计SK hynix和三星将在2025年底大规模生产HBM4内存。➀ Rambus details its new HBM4 memory controller with speeds up to 10Gb/s and bandwidth of 2.56TB/sec; ➁ HBM4 offers 33% faster bandwidth than HBM3E and twice the speed of HBM3; ➂ SK hynix and Samsung are expected to mass produce HBM4 memory by the end of 2025.
08/20/2024, 12:39 AM UTC
三星下一代HBM4将于2025年底进入大规模生产，为下一代AI GPU准备就绪Samsung's next-gen HBM4 to enter mass production by the end of 2025, ready for next-gen AI GPUs
➀ 三星预计将在2024年第四季度完成下一代HBM4内存的设计。➁ HBM4的大规模生产计划于2025年第四季度进行，目标是为英伟达的下一代Rubin R100 AI GPU提供支持。➂ AI行业的需求正在推动HBM内存的增长，SK海力士和三星 正在大力投资生产能力。➀ Samsung is expected to tape-out its next-generation HBM4 memory in Q4 2024. ➁ Mass production of HBM4 is scheduled for Q4 2025, targeting NVIDIA's next-gen Rubin R100 AI GPU. ➂ The AI industry's demand is driving the growth of HBM memory, with SK hynix and Samsung investing heavily in production capabilities.
08/12/2024, 03:17 AM UTC
韩国芯片出口至台湾激增225%，SK海力士HBM内存称霸South Korea chip exports to Taiwan surge 225% year-over-year, SK hynix HBM memory is king
➀ 2025年上半年，韩国内存芯片出口至台湾激增225%。➁ 这一激增主要归因于AI GPU中HBM内存的高需求。➂ 台湾超越越南和美国，成为韩国内存芯片的第三大进口地。➀ South Korea's memory chip exports to Taiwan surged 225% in the first half of 2025. ➁ The surge is due to the high demand for HBM memory in AI GPUs. ➂ Taiwan became the third-largest importer of South Korean memory chips, surpassing Vietnam and the United States.
07/26/2024, 08:51 AM UTC
SK海力士六年来首次实现盈利，HBM技术助力SK Hynix records profit in 6 years backed by HBM
1、SK海力士在2023年第二季度实现了六年来的最高营业利润。2、该公司报告收入为16.42万亿韩元，营业利润为5.46万亿韩元。3、该季度的净利润为4.12万亿韩元。1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.
07/17/2024, 07:31 AM UTC
Genesem 为 SK Hynix 提供用于HBM混合键合工艺的新设备Genesem supplies new kits for use in hybrid bonding process in HBM to SK Hynix
1、半导体封装公司 Genesem 已向 SK Hynix 提供下一代混合键合设备。2、该设备用于生产高带宽内存（HBM）。3、两台设备已安装在 SK Hynix 的试验工厂中，用于测试。1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.
06/28/2024, 07:22 AM UTC
美光公司2025年前高带宽内存产能已售罄Micron sells out HBM capacity up to 2025
1、美光宣布其高带宽内存（HBM）生产能力直至2025年已全部预订完毕。2、此前，SK海力士也表示其HBM产能已售罄至明年。3、美光报告称，3月至5月的最新财季营收为68.11亿美元，呈现增长态势。1. Micron announced that its High Bandwidth Memory (HBM) production capacity is fully booked until 2025. 2. This follows SK Hynix's earlier statement that its HBM capacity is sold out until next year. 3. Micron reported a revenue of $6.811 billion for the fiscal quarter from March to May, marking an increase.
06/21/2024, 12:02 AM UTC
SK海力士加速HBM开发：HBM4将于2025年推出，HBM4E将于2026年推出SK hynix speeds up HBM development: HBM4 in 2025 and HBM4E now coming in 2026
1. SK海力士正在加速HBM4和HBM4E内存的开发，原计划分别于2026年和2027年开始量产。2. 现在，HBM4定于2025年开始量产，HBM4E将于2026年开始量产，与NVIDIA加速的AI加速器发布周期相一致。3. 与世界上最快的内存HBM3E相比，下一代HBM4提供了40%的带宽增加和70%的功耗降低。1. SK hynix is accelerating the development of HBM4 and HBM4E memory, originally planned for mass production in 2026 and 2027 respectively. 2. Now, HBM4 is set for mass production in 2025, and HBM4E will enter mass production in 2026, aligning with NVIDIA's accelerated AI accelerator release cycle. 3. The next-generation HBM4 offers a 40% increase in bandwidth and a 70% reduction in power consumption compared to HBM3E, which is the fastest memory in the world.
06/20/2024, 12:48 AM UTC
美光科技在美国扩建HBM生产线，并考虑在马来西亚生产HBMMicron expands HBM production with new lines in the US, also considers Malaysia HBM production
1. 美光科技正在美国建设新的先进HBM测试生产线；2. 该公司也在首次考虑在马来西亚制造HBM芯片；3. 美光的目标是到2025年将其HBM市场份额增加两倍，目标是达到20%多的百分比范围。1. Micron Technology is building new test production lines for advanced HBM in the US; 2. The company is also considering HBM manufacturing in Malaysia for the first time; 3. Micron aims to triple its market share for HBM by 2025, targeting a 'mid-20' percentage range.
06/11/2024, 09:02 AM UTC
三星认为混合键合对于制造16层高带宽内存（HBM）是必要的Samsung maintains hybrid bonding needed for HBM 16H
1、三星在其最新论文中强调了混合键合对于制造16层高带宽内存（HBM）的必要性。2、该论文在2024年IEEE第74届电子元件与技术会议（在科罗拉多州举行）上发表，讨论了D2W（芯片到晶圆）铜键合技术。1. Samsung has emphasized the necessity of hybrid bonding for the production of a 16-stack High Bandwidth Memory (HBM) in a recent paper. 2. The paper was presented at the 2024 IEEE 74th Electronic Components and Technology Conference in Colorado, discussing D2W (die to wafer) copper bonding.
05/14/2024, 07:23 AM UTC
SK海力士计划于2026年制造HBM4E。SK Hynix aims to manufacture HBM4E in 2026
SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee
05/07/2024, 08:00 AM UTC
三星采用双轨道方法开发HBM内存。Samsung takes two-track approach to HBM development
Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration
05/03/2024, 07:18 AM UTC
SK Hynix expects HBM revenue to hit mid-$10 billion within year
SK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp
05/02/2024, 03:00 PM UTC
SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest of 2024, and even most of 2025 has already sold out as well. SK hynix currently produces various types of HBM memory for customers like Amazon, AMD, Facebook, Google (Broadcom), Intel, Microsoft, and, of course, NVIDIA. The latter is an especially prolific consumer of HBM3 and HBM3E memory for its H100/H200/GH200 accelerators, as NVIDIA is also working to fill what remains an insatiable (and unmet) demand for its accelerators. As a result, HBM memory orders, which are already placed months in advance, are now backlogging well into 2025 as chip vendors look to secure supplies of the memory stacks critical to their success. This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron regarding its HBM3E production. But of the two announcements, SK hynix's is arguably the most significant yet, as the South Korean firm's HBM production capacity is far greater than Micron's. So while things were merely "interesting" with the smallest of the Big Three memory manufacturers being sold out into 2025, things are taking a more concerning (and constrained) outlook now that SK hynix is as well. SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's share on HBM memory market is between 4% and 6%. Since HBM supply of both companies is sold out through the most of 2025, we're likely looking at a scenario where over 50% of the industry's total HBM3/HBM3E supply for the coming quarters is already sold out. This leaves Samsung as the only me
04/25/2024, 06:21 PM UTC
根据HBM销售数据，SK海力士实现盈利能力恢复SK Hynix returns to profitability on back of HBM sales
SK Hynix has beat market estimates on its latest earnings on the back of rising prices of memory chip prices and strong sales of high-bandwidth memory (HBM).The South Korean chip giant said on Thursday that it recorded 12.42 trillion won in revenue and 2.88 trillion won in operating income in the fi
04/04/2024, 07:16 PM UTC
Samsung's new HBM development team to have 400 employees
Samsung is forming a team of around 400 employees to work on high bandwidth memory (HBM) alone, TheElec has learned.Last month, TheElec reported that the South Korean company planning to convert its task force for HBM into a permanent office.The new HBM development team will be under the direct supe ... ... http://thelec.net/news/articleView.html?idxno=4785
03/04/2024, 01:28 PM UTC
Samsung considers applying MUF to server DRAM
Samsung was considering applying molded underfill (MUF) in its next-generation DRAM, TheElec has learned.The tech giant used thermal compression non-conductive film (TC NCF) in its existing registered dual in-line memory module (RDIMM).But Samsung recently tested a mass reflow (MR) MUF process to 3- ... ... http://thelec.net/news/articleView.html?idxno=4746
03/04/2024, 01:28 PM UTC
Samsung introduces HBM3E amid fierce competition over HBM dominance
Samsung on Tuesday unveiled its Gen 5 HBM, HBM3E, which sports 12 stacks of DRAM modules compared to 8 offered by rival Micron's which was announced hours prior and has started mass production.The South Korean tech giant’s announcement indicates that the competition over the dominance of HMB, or hig ... ... http://thelec.net/news/articleView.html?idxno=4744
08/22/2023, 08:00 PM UTC
SK Hynix gives HBM3E sample to customer
SK Hynix said on Monday that it has given a sample of its HBM3E to a customer.High bandwidth memory connects DRAM vertically to increase their speed and is currently in high demand from AI applications.HBM3E is an expansion of HBM3 with a further increased speed of 1.15TB per second.The South Korean ... ... http://thelec.net/news/articleView.html?idxno=4627 这是一种名为MR-MUF的先进封装工艺，它在最新的内存芯片中应用。该工艺涉及在芯片垂直堆叠时注入液体保护材料用于散热。
07/28/2023, 03:11 PM UTC
12-layer or higher HBM to require hybrid bonding, SK Hynix says
Even in high bandwidth memory (HBM) hybrid bonding may be needed to pack in more layers within the confines of the package.This is according to SK Hynix Wafer Bonding Head Kang Ji-ho, who said during a local chip conference hosted by TheElec that HBM with 12-layer or higher can face problems in heig ... ... http://thelec.net/news/articleView.html?idxno=4605
