Recent #semiconductor news in the semiconductor industry
12/28/2024, 04:09 AM UTC
三星和SK海力士在EUV光刻技术领域分道扬镳Samsung and SK Hynix Diverge on EUV Lithography Technology!
<p>➀ 韩国两大半导体巨头三星电子和SK海力士在极紫外（EUV）光刻技术上采取了不同的策略。</p><p>➁ 三星专注于提高良率，而SK海力士则专注于长期技术进步。</p><p>➂ 三星已在其华城和平泽工厂购买了30多台EUV光刻机，旨在提高生产效率。</p><p>➃ SK海力士将EUV TF并入未来技术研究院，聚焦于长期技术发展。</p><p>➀ Samsung and SK Hynix, two major South Korean semiconductor companies, are taking different strategies in the EUV lithography technology field.</p><p>➁ Samsung is focusing on improving yields, while SK Hynix is focusing on long-term technological progress.</p><p>➂ Samsung has invested heavily in EUV lithography machines aims to maximize the production efficiency of various materials and components used in EUV lithography equipment.</p><p>➃ SK Hynix has dissolved its EUV TF and integrated it into the Future Technology Research Institute, emphasizing long-term technological progress.</p>
12/27/2024, 11:07 PM UTC
KLA的成长之路，看中国量测The Growth Path of KLA: Insights into China's Measurement Industry
<p>➀ 科磊（KLA）是前道量测设备行业的绝对领导者，提供全 面的检测、量测和数据分析产品及服务。</p><p>➁ 科磊的发展历程中，通过多次关键收购，其业务已扩展到半导体设备的多个领域。</p><p>➂ 中国量测行业目前处于分散状态，许多公司专注于低端AOI，中国需要1-2家强大的公司来与科磊等全球领导者竞争。</p><p>➀ KLA is a dominant player in the front-end measurement equipment industry, providing comprehensive detection, measurement, and data analysis products and services.</p><p>➁ KLA's journey includes several key acquisitions that have expanded its business into various sectors of semiconductor equipment.</p><p>➂ The Chinese measurement industry is currently fragmented, with many companies focusing on low-end AOI, and the country needs 1-2 strong companies to compete with global leaders like KLA.</p>
12/27/2024, 07:48 PM UTC
NVIDIA：对博通风险的现实审视Nvidia: A Reality Check On The Broadcom Risk
1、NVIDIA的“AI之王”地位受到威胁，因为主要客户转向博通定制芯片和系统；2、由于投资者对NVDA未来AI解决方案需求的担忧，NVDA股价下跌；3、怀疑论者可能忽视了NVIDIA的关键优势和保持牛市案例的明智策略。1. Nvidia's 'king of AI' status is threatened as top customers turn to Broadcom for custom chips and systems; 2. NVDA stock has dipped due to investor concerns over future demand for its AI solutions; 3. Skeptics may be overlooking Nvidia's key strengths and strategies that keep the bull case alive.
12/27/2024, 06:42 AM UTC
X-FAB硅晶圆厂：增长强劲且显著低估X-Fab Silicon Foundries: Growing And Significantly Undervalued
1. X-FAB硅晶圆厂是一家在增长行业中拥有悠久盈利历史的老牌公司。2. 即使不考虑未来增长前景，其估值也非常优秀。3. 预计未来几年收入将增长，得益于2023-2025H1的资本支出计划。4. 2026年的EV/FCF比率低于5，2030年为2.4。5. 正向的自由现金流可能会触发回购。1. X-Fab Silicon Foundries is a well-established company in a growing industry with a long history of profitable activity. 2. It has an excellent valuation, even without considering future growth prospects. 3. Revenues are expected to increase in the coming years, supported by the CAPEX program of 2023-2025H1. 4. EV / 2026 FCF is below 5 and for 2030, is 2.4. 5. Positive free cash flow may trigger buybacks.
12/27/2024, 06:05 AM UTC
POET与Globetronics合作，在马来西亚槟城制造光引擎POET engages Globetronics for photonics sub-contract manufacturing
➀ 慧荣科技与Globetronics制造有限公司合作，在马来西亚槟城制造光引擎。 ➁ GMSB将根据慧荣科技的设计组装和测试光引擎。 ➂ 慧荣科技为该项目购买了晶圆级工艺设备，该协议将持续三年。➀ POET Technologies has partnered with Globetronics Manufacturing Sdn Bhd to manufacture optical engines in Penang, Malaysia. ➁ GMSB will assemble and test optical engines based on POET's designs. ➂ POET has purchased wafer-level process equipment for the project, which is set to last for three years.
12/26/2024, 06:45 AM UTC
用于SiC MOSFET保护的TVS二极管TVS Diode For SiC MOSFET Protection
➀ 普立泰科（Littelfuse）推出了一款新的TVS二极管系列，专为汽车应用中的SiC MOSFET栅极驱动器提供保护；➁ 该二极管提供单一组件保护，取代了多个齐纳二极管或TVS组件；➂ 该系列通过AEC-Q101认证，适用于空间受限的汽车设计。➀ Littelfuse has launched a new series of TVS diodes designed to protect SiC MOSFET gate drivers in automotive applications; ➁ The diodes offer single-component protection, replacing multiple Zener diodes or TVS components; ➂ The series is AEC-Q101-qualified and suitable for space-constrained automotive designs.
12/26/2024, 05:41 AM UTC
博通：不支付1万亿美元的价格标签Broadcom: Not Paying The $1 Trillion Price Tag
1、博通的AI和软件市场增长强劲，但由于依赖少数超大规模客户，存在显著的集中风险。2、公司由AI驱动的收入增长强劲，但可能面临利润压力和可扩展性挑战。3、博通的估值似乎过高，前向市盈率为28.3倍，暗示上涨空间有限，可能存在25-30%的泡沫。1. Broadcom's AI and software market growth is strong but faces concentration risk due to reliance on a few hyperscale customers. 2. The company's AI-driven revenue growth is strong but may face margin pressures and scalability challenges. 3. Broadcom's valuation appears stretched, with a forward earnings multiple of 28.3x, suggesting limited upside and potential overvaluation.
12/25/2024, 09:17 AM UTC
AMD：估值不合理AMD: The Valuation Makes No Sense
1. 近期AMD股价跌至120美元以下，尽管投资者情绪负面，但风险回报率仍具吸引力；2. AMD数据中心业务凭借MI300X芯片展现出良好的增长潜力，使其在AI GPU市场中能够与英伟达竞争；3. AMD的市盈率为24.4倍，相较于英伟达有22%的折价，使其在潜在复苏前成为有吸引力的买入对象。1. AMD's shares have dipped below $120 recently, presenting an attractive risk profile despite the creation of negative investor sentiment; 2. AMD's Data Center segment shows promising growth potential with the MI300X chip, positioning it to compete with Nvidia's dominance in the AI GPU market; 3. AMD's valuation at a P/E ratio of 24.4X offers a 22% discount compared to Nvidia, making it an attractive buy before a potential recovery.
12/24/2024, 02:03 PM UTC
汤姆的硬件2024圣诞前夕之夜'Twas The Night Before Tom's Christmas 2024
➀ 圣诞老人计划在美国建立一个晶圆厂以获得CHIPS法案资金；➁ 圣诞老人在本地劳动力和资金延误上遇到挑战；➂ 圣诞老人寻求科技公司和UPS工人的帮助以挽救项目；➃ 圣诞老人的晶圆厂资产被科技公司收购，他准备使用Mac Minis和AI PC来分发礼物。➀ Santa Claus plans to build a US-based fab for CHIPS Act money; ➁ Santa encounters challenges with local labor and delays in funding; ➂ Santa seeks help from tech companies and a UPS worker to save the project; ➃ Santa's fab assets are acquired by tech companies, and he prepares to deliver gifts using Mac Minis and AI PCs.
12/24/2024, 11:00 AM UTC
博通CEO：对收购英特尔没有兴趣，无人提出请求Broadcom has no Interest in buying Intel: CEO says no one asked
➀ 博通CEO黄仁勋否认收购英特尔的可能性；➁ 黄仁勋强调实际可行的交易和没有敌意报价的重要性；➂ 博通专注于为AI数据中心设计定制处理器，以及其在AI基础设施方面的当前投资。➀ Broadcom CEO Hock Tan dismisses the possibility of acquiring Intel; ➁ The CEO emphasizes the importance of actionable deals and the absence of hostile offers; ➂ Broadcom's focus on custom datacenter processors for AI and its current investments in AI infrastructure.
12/24/2024, 09:13 AM UTC
AMD：凭借新AI范式占据有利位置AMD: Well-Positioned To Capitalize On New AI Paradigm
1、AMD已从相对边缘的芯片设计公司转变为数据中心、企业级CPU、GPU和自适应SoC市场的主要参与者；2、AI革命，尤其是OpenAI的o3突破，为AMD基于Zen的EPYC处理器和Instinct GPU加速器带来了显著的未来增长潜力；3、尽管面临来自NVIDIA生态系统和行业周期性的风险，AMD在AI硬件和数据中心领域的加速势头表明其具有强大的增长潜力。1. Advanced Micro Devices has transformed into a major player in the data center, enterprise-grade CPU, GPU, and adaptive SoCs markets; 2. The AI revolution, especially OpenAI's o3 breakthrough, positions AMD's Zen-based EPYC processors and Instinct GPU accelerators for significant future growth; 3. Despite risks from NVIDIA's ecosystem and industry cyclicality, AMD's accelerating momentum in AI hardware and data center segments suggests strong growth potential.
12/24/2024, 01:01 AM UTC
美国半导体销售额将超过20亿美元US semi sales to top $200m
➀ 根据纽约美国通用电气公司电子元件事业部副总裁兼总经理L. Berkley Davis的说法，今年美国电子管和电子管的销售额预计将达到3亿美元，而半导体销售额将超过2亿美元。➁ 这个故事可以追溯到63年前，即1960年1月25日，《电子时报》报道了385百万个接收管、1.8亿个晶体管和1100万个电视显像管的销售额。➂ 包括晶体管和整流器在内的半导体销售额预计将比1960年高出20%。➀ According to Mr. L. Berkley Davis, vice president and general manager of the electronic components division of the American General Electric corporation of New York, the sales of electronic valves and tubes in the USA this year are expected to total £300 million, and semiconductor sales are over £200 million. ➁ The story dates back to 63 years ago, when Electronics Weekly reported on January 25, 1960, about the sales of 385 million receiving tubes, 180 million transistors, and 11 million television picture tubes. ➂ Semiconductor sales, including transistors and rectifiers, are predicted to be 20% higher than in 1960.
12/23/2024, 05:01 PM UTC
芯片贴装工艺显著提升电力电子器件的废热排出效率Die-Attach Process Dramatically Improves Waste-Heat Removal in Power Electronics
➀ 介绍了一种新的芯片贴装工艺；➁ 该工艺承诺将电力器件的冷却效率提高至15倍；➂ 它降低了由传统烧结技术引起的导致故障的应力。➀ A new die-attach process is introduced; ➁ It promises to cool power devices up to 15X more efficiently; ➂ It reduces failure-inducing stresses caused by conventional sintering techniques.
12/23/2024, 03:55 PM UTC
美国参议院发现商务部实施禁令和制裁的努力“不足” — 调查发现机构资金不足，必须依赖芯片制造商自愿遵守US Senate finds Commerce Department’s efforts to enact bans and sanction “inadequate” — investigation finds agency underfunded, must rely on voluntary compliance by chipmakers
➀ 美国参议院常设调查小组发现，商务部因资金不足，对俄罗斯和中国的禁令和制裁执行不力。 ➁ 调查显示，工业和安全局（BIS）缺乏有效执行出口管制的资源，必须依赖芯片制造商自愿遵守。 ➂ 尽管实施制裁，但高科技的美国芯片仍然出现在俄罗斯无人机和导弹中，受制裁的公司也创建了新的实 体来进口美国技术。➀ The U.S. Senate's Permanent Subcommittee on Investigations finds the Department of Commerce's efforts to enforce bans and sanctions against Russia and China inadequate due to underfunding. ➁ The investigation reveals the Bureau of Industry and Security (BIS) lacks resources to effectively enforce export controls and must rely on voluntary compliance from chipmakers. ➂ Despite sanctions, high-tech American chips are still found in Russian drones and missiles, and sanctioned firms create new entities to import American tech.
12/23/2024, 02:50 PM UTC
美国政府调查中国对传统半导体市场的控制，担忧中国供应商充斥市场U.S. gov't launches probe into ongoing China dominance of legacy semiconductor market amid concerns of Chinese vendors flooding the market
➀ 拜登政府已对中国制造的旧款半导体启动正式调查；➁ 调查突显了对中国在该领域不断扩张的主导地位的担忧；➂ 美国商务部对中国的调查可能导致对中国进口的新限制。➀ The Biden administration has launched a formal investigation into Chinese-made legacy semiconductors; ➁ The investigation highlights concerns over China's expanding dominance in this sector; ➂ The U.S. Commerce Department's investigation could lead to new restrictions on Chinese imports.
12/23/2024, 01:26 PM UTC
突发！美国对中国传统芯片动手U.S. Takes Action Against China's Traditional Chip Industry
<p>➀ 拜登-哈里斯政府正在根据《贸易法》301条款调查中国生产成熟制程半导体，以应对所谓的国家安全威胁并减少美国对这些芯片的依赖。</p><p>➁ 美国贸易代表办公室正在发起一项301条款调查，以审查中国将基础半导体作为主导地位的目标及其对美国经济的影响。</p><p>➂ 美国正在投资整个半导体供应链，包括对芯片制造至关重要的上游材料，如碳化硅和晶圆，已促成数十亿美元的私营部门投资。</p><p>➀ The Biden-Harris administration is investigating China's production of mature process semiconductors under the 301 trade law, citing national security threats and reducing U.S. dependence on these chips.</p><p>➁ The U.S. Trade Representative's office is initiating a 301 investigation to review China's targeting of mature semiconductors as a dominant position and its impact on the U.S. economy.</p><p>➂ The U.S. is investing in the entire semiconductor supply chain, including upstream materials like silicon carbide and wafers, with billions of dollars in private sector investments.</p>
12/23/2024, 01:25 PM UTC
突发！美国对中国传统芯片动手U.S. Takes Action Against China's Traditional Chip Industry
<p>➀ 拜登-哈里斯政府正在根据《贸易法》301条款调查中国生产成熟制程半导体，以应对所谓的国家安全威胁并减少美国对这些芯片的依赖。</p><p>➁ 美国贸易代表办公室正在发起一项301条款调查，以审查中国将基础半导体作为主导地位的目标及其对美国经济的影响。</p><p>➂ 美国正在投资整个半导体供应链，包括对芯片制造至关重要的上游材料，如碳化硅和晶圆，已促成数十亿美元的私营部门投资。</p><p>➀ The Biden-Harris administration is investigating China's production of mature process semiconductors under the 301 trade law, citing national security threats and reducing U.S. dependence on these chips.</p><p>➁ The U.S. Trade Representative's office is initiating a 301 investigation to review China's targeting of mature semiconductors as a dominant position and its impact on the U.S. economy.</p><p>➂ The U.S. is investing in the entire semiconductor supply chain, including upstream materials like silicon carbide and wafers, with billions of dollars in private sector investments.</p>
12/23/2024, 12:56 PM UTC
Arm与高通诉讼的后果The Fall-Out From Arm vs Qualcomm
➀ Arm在与高通的诉讼中未能获得禁止高通使用Nuvia设计的基于Arm的核心的裁决；➁ 陪审团未能就Nuvia是否违反了与Arm的许可条款达成一致，Arm有机会就此问题进行重审；➂ 高通律师出示了一份Arm首席执行官撰写的策略文件，其中提出了Arm自行制造芯片的设想，这可能标志着Arm业务模式的重大转变。➀ Arm在诉讼中未能获得其最想要的结果，即禁止高通在PC芯片组中使用Nuvia设计的基于Arm的核心；➁ 虽然陪审团未能就Nuvia是否违反了与Arm的许可条款达成一致意见，但Arm有机会进行重审；➂ 高通律师出示了一份由Arm首席执行官撰写的策略文件，其中设想Arm建造自己的芯片，这可能是Arm业务模式的一个重大转变。
12/23/2024, 11:17 AM UTC
奕斯伟伟大硅片的前世今生：王东升如何再造一个传奇The Legend of Yisiwei: How Wang Dongsheng is Rebuilding a Dynasty
<p>➀ 王东升，被誉为‘中国半导体显示产业之父’的企业家，开启了从‘造屏’到‘造芯’的跨越式征程。</p><p>➁ 2024年，奕斯伟材料以240亿元估值成功递交科创板IPO申请。</p><p>➂ 从CRT显像管到全球第一的液晶面板，从高度依赖进口的硅片到奕斯伟材料的自主突破，中国科技产业发展确实需要领路人打攻坚战。</p><p>➀ Wang Dongsheng, known as the 'Father of China's Semiconductor Display Industry', has embarked on a transformative journey from 'making screens' to 'making chips'.</p><p>➁ Yisiwei Materials successfully submitted an IPO application to the Shanghai Stock Exchange with a valuation of 24 billion yuan in 2024.</p><p>➂ China's technology industry needs leaders to fight a hard battle from CRT tubes to the world's first LCD panels, from highly dependent on imports to Yisiwei Materials' independent breakthrough.</p>
12/23/2024, 11:16 AM UTC
奕斯伟伟大硅片的前世今生：王东升如何再造一个传奇The Legend of Yisiwei: How Wang Dongsheng is Rebuilding a Dynasty
<p>➀ 王东升，被誉为‘中国半导体显示产业之父’的企业家，开启了从‘造屏’到‘造芯’的跨越式征程。</p><p>➁ 2024年，奕斯伟材料以240亿元估值成功递交科创板IPO申请。</p><p>➂ 从CRT显像管到全球第一的液晶面板，从高度依赖进口的硅片到奕斯伟材料的自主突破，中国科技产业发展确实需要领路人打攻坚战。</p><p>➀ Wang Dongsheng, known as the 'Father of China's Semiconductor Display Industry', has embarked on a transformative journey from 'making screens' to 'making chips'.</p><p>➁ Yisiwei Materials successfully submitted an IPO application to the Shanghai Stock Exchange with a valuation of 24 billion yuan in 2024.</p><p>➂ China's technology industry needs leaders to fight a hard battle from CRT tubes to the world's first LCD panels, from highly dependent on imports to Yisiwei Materials' independent breakthrough.</p>
12/23/2024, 09:46 AM UTC
2025年或将成为英伟达的爆发年Why 2025 Could Be A Breakout Year For Nvidia
1. 英伟达股价最近有所回调，为长期投资者提供了机会。2. 谷歌量子计算突破展示了快速的技术进步，这将有利于英伟达在AI GPU市场的领先地位。3. 到2025年，NVDA的自由现金流可能达到1000亿美元/年，通过股息和股票回购为股东带来显著回报。1. Nvidia's shares have corrected recently, presenting an opportunity for long-term investors. 2. Google's quantum computing breakthrough showcases rapid technological progress, benefiting Nvidia's dominant position in the AI GPU market. 3. NVDA's free cash flow could reach $100B/year by 2025, with significant shareholder returns through dividends and stock buybacks.
12/23/2024, 09:28 AM UTC
大科技、中国和初创企业围攻英伟达，但这是一个两年的买入机会（评级上调）Nvidia's Fort Is Sieged By Big Tech, China, And Startups, But It's A Two-Year Buy (Rating Upgrade)
1、英伟达的护城河正受到初创企业、博通、AMD和大型科技企业内部AI芯片的挑战，推理市场正在多元化，初创企业正在获得细分市场的吸引力。2、美国限制和中国推动国内AI芯片的发展，将英伟达2022年的中国收入份额从24.6%削减至2025年的12.2%，削弱了增长前景。3、尽管预计2027年企业价值为5.83万亿美元，但增长放缓和周期性风险可能导致波动；目前的企业价值为3.13万亿美元，目前提供了24.21%的安全边际。1. Nvidia's moat is under pressure from startups, Broadcom, AMD, and Big Tech's in-house AI chips, with inference markets diversifying and startups gaining niche traction. 2. U.S. restrictions and China's push for domestic AI chips cut Nvidia's China revenue share from 24.6% in 2022 to 12.2% in 2025, weakening growth prospects. 3. Despite a $5.83T 2027 EV forecast, slowing growth and cyclical risks could spur volatility; current EV of $3.13T offers a 24.21% margin of safety for now.
12/23/2024, 01:02 AM UTC
埃德嗅到欧洲的机会Ed Sniffs Euro-Wonga
➀ 埃德认为欧盟的‘ECS经纪’是一个鼓励英国技术人才获取欧洲资金的方法；➁ 他已经说服部门为研究人员、发明家、初创企业和中小企业参加这些活动提供预算；➂ 他正在探索斯肯索普量子利用欧洲发展基金的机会。➀ Ed sees the EU's 'ECS Brokerage' as a way to encourage UK techies to access European funds; ➁ He has convinced the Department to allocate a budget for researchers, inventors, startups, and SMEs to attend these events; ➂ He is exploring opportunities for Scunthorpe Quantum to benefit from European development funds.
12/22/2024, 09:12 AM UTC
应用材料新周期开始：我将何时开始买入A New Downcycle Has Started For Applied Materials: Here Is When I'll Start Buying
1、应用材料（AMAT）的股价在不到六个月内下跌了36%；2、作者建议在股价下跌50%-65%后买入像AMAT这样的周期性股票；3、由于历史价格模式，作者认为AMAT在市场低迷期间是周期性投资的强有力候选者。1. Applied Materials (AMAT) has seen a -36% decline in stock price in less than six months; 2. The author suggests a strategy of buying cyclical stocks like AMAT after a 50%-65% decline; 3. The author believes AMAT is a strong candidate for cyclical investing during downturns due to historical price patterns.
12/21/2024, 12:56 PM UTC
安靠科技越南北宁工厂正式投产，自动化节省70%员工Amkor Technology's 11.5 Billion USD Factory in Vietnam's Bac Ninh Officially Launched, Reducing 70% of Employees with Automation
<p>➀ 安靠科技正在越南北宁建设一座价值16亿美元的半导体封装和测试工厂，显示了对市场的信心。</p><p>➁ 北宁新工厂将于2024年10月开始运营，初始产能为设计产能的70%。</p><p>➂ 北宁项目的总投资为16亿美元，完工后年产能预计可达12亿片芯片。</pp>➃ 新工厂的自动化预计将使员工数量从原计划的1万名减少到仅有2800名。</p><p>➄ 工厂采用的先进自动化技术将需要熟练的技术人员来进行操作和维护。</p><p>➅ 越南的战略位置和政府支持正在推动该国半导体行业的发展。</p><p>➀ Amkor Technology is constructing a $1.6 billion semiconductor packaging and testing factory in Bac Ninh, Vietnam, showing confidence in the market.</p><p>➁ The new factory in Bac Ninh will begin operations in October 2024, with an initial capacity of 70% of the designed capacity.</p><p>➂ The total investment for the Bac Ninh project is $1.6 billion, with an annual production capacity of 1.2 billion chips upon completion.</p><p>➃ The automation of the new factory is expected to reduce the number of employees from the originally planned 10,000 to only 2,800.</p><p>➄ The advanced automation technology used in the factory will require skilled technicians for operation and maintenance.</p><p>➅ Vietnam's strategic location and government support are driving the growth of the semiconductor industry in the country.</p>
12/20/2024, 02:18 PM UTC
SK海力士获33亿补贴！SK Hynix Receives 3.3 Billion USD Subsidy!
<p>➀ SK海力士获得美国商务部高达33亿美元的政府补助。</p><p>➁ 该补贴旨在帮助在印第安纳州建立先进的芯片封装工厂和人工智能产品研发设施。</p><p>➂ 该工厂还将建设一条装配线，用于大规模生产下一代高带宽存储（HBM）芯片，这些芯片将装备在训练人工智能系统的图形处理单元（GPU）中。</p><p>➀ SK Hynix has been granted a government subsidy of up to 3.3 billion USD by the US Department of Commerce.</p><p>➁ The subsidy is intended to help establish an advanced chip packaging factory and AI product development facilities in Indiana.</p><p>➂ The factory will also build an assembly line for mass production of next-generation high-bandwidth memory (HBM) chips, which will be equipped in graphics processing units (GPUs) for training AI systems.</p>
12/20/2024, 01:36 PM UTC
这位中国老板，掌控全球半导体关键金属，却鲜为人知This Chinese Boss Rules the Global Semiconductor Critical Metal Market, Yet Remains Little Known
<p>➀ 2019年，一位神秘的中国买家在昆明泛亚有色金属交易所核心资产拍卖中收购了大量稀有金属，当时并未引起太多关注，但多年后这一幕后老板才浮出水面。</p><p>➁ 德国公司Freiberger最近面临客户催单、疯狂囤货的情况，因为中国收紧了镓和锗的出口管制，而该公司几乎完全依赖从中国进口镓。</p><p>➂ 广东先导科技集团的创始人朱世会在重庆万州建立了一个年产150吨、全球单体最大的金属镓生产基地。</p><p>➀ A mysterious Chinese buyer acquired a large amount of rare metals at the 2019 auction of the core assets of the Kunming Non-Ferrous Metals Exchange, which was not widely noticed at the time but became significant later on.</p><p>➁ Freiberger, a German company, is facing intense demand from its clients as China tightens the export controls on gallium and germanium, with the company almost entirely dependent on imports from China for its gallium needs.</p><p>➂ Zhu Shihui, the founder of Guangdong Xiandao Technology Group, has established a 150-ton annual production base for gallium, the largest single-site gallium production base in the world, in Chongqing Wanzhou.</p>
12/20/2024, 01:32 PM UTC
一笔投资亏损近千亿，今年最惨流血上市A Nearly 100 Billion Yuan Investment Loss: The Most Disastrous Listing of the Year
<p>➀ 铠侠，一家知名的NAND闪存巨头，确定了发行价，于12月18日在东京证券交易所上市。IPO价格为每股1455日元，对应公司估值为7840亿日元。</p><p>➁ 铠侠原为 东芝的半导体存储部门。由于债务缠身，2018年东芝被迫将铠侠分拆出售。这笔交易当时引发了激烈的争夺。西部数据、KKR等组成联盟原本已非常接近以174亿美元的价格拿下，但最后时刻被由贝恩资本牵头的联合财团以182亿美元的价格成功截胡。</p><p>➂ 然而，现在看来，铠侠可能成为日本私募股权最惨痛的失败之一。2018年的收购价格为2万亿日元，此次上市的估值缩水了61%。</p><p>➀ Kioxia, a renowned NAND flash giant, has determined its IPO price and listed on the Tokyo Stock Exchange on December 18th, with an IPO price of 1455 yen per share and a company valuation of 7840 billion yen.</p><p>➁ Kioxia, originally a semiconductor storage division of Toshiba, was forced to be split and sold in 2018 due to debt. The transaction sparked fierce competition, and a consortium led by Bain Capital outbid a group led by Western Digital at the last moment with a bid of 182 billion US dollars.</p><p>➂ However, it now appears that Kioxia will become one of the most painful failures in private equity in Japan. The acquisition price in 2018 was 2 trillion yen, and the valuation at the time of listing has shrunk by 61%.</p>
12/20/2024, 01:00 PM UTC
等待已久的抛售：将美光科技股票评级上调至强烈买入Micron Stock: The Sell-Off We've Been Waiting For - Upgrading To Strong Buy
1. 在1QFY25财报发布后，美光科技股价下跌16%，我们将其评级上调至强烈买入；2. 我们认为，终端需求反弹放缓和行业供应过剩已反映在股价和展望中，重置了预期；3. 预计美光将从HBM市场份额的增长以及PC总体市场规模在2025年下半年扩张中受益。1. Micron Technology's stock is upgraded to a strong buy after a 16% drop following 1QFY25 earnings report; 2. We believe the slower end demand rebound and industry oversupply are now reflected in the stock and outlook, resetting expectations; 3. Micron is expected to benefit from share gain in the HBM market and PC TAM expansion towards 2H25.
12/20/2024, 06:30 AM UTC
Arm与高通诉讼案进入关键阶段Jury is out in the Arm vs Qualcomm trial
➀ 法庭陪审团在Arm与高通的诉讼案第四天进行审议。➁ 高通律师认为Arm的诉讼旨在破坏其PC芯片设计。➂ Arm律师声称问题是高通在未获得Arm许可的情况下使用Nuvia的设计违反了与Arm的许可协议。➀ The jury is deliberating in the Arm vs Qualcomm lawsuit on the fourth day. ➁ Qualcomm's lawyer argues that Arm's lawsuit aims to destroy its PC chip designs. ➂ Arm's lawyer claims the issue is about Qualcomm's breach of its licensing agreement with Arm by using Nuvia's designs without permission.
12/20/2024, 05:56 AM UTC
高效能FET延长电池寿命Power-Efficient FET For Longer Battery Life
➀ 晶电扩展了第七代MXT LV MOSFETs的生产；➁ MXT LV MOSFETs采用超级短沟道FET（SSCFET）技术；➂ 提高电池供电设备的功率效率和降低热量产生。➀ Magnachip expands production of 7th generation MXT LV MOSFETs; ➁ MXT LV MOSFETs utilize Super Short Channel FET (SSCFET) technology; ➂ Improved power efficiency and reduced heat generation for battery-powered devices.
12/19/2024, 08:39 PM UTC
CXL技术终于在2025年到来CXL is Finally Coming in 2025
➀ 计算表达式链接（CXL）技术预计将在2025年从利基市场转向主流应用；➁ CXL对内存扩展的支持是主要驱动力，现在有各种服务器和内存解决方案可用；➂ CXL 2.0和未来的PCIe/CXL版本将实现更高级的应用，如交换和动态内存分配。➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
12/19/2024, 02:46 PM UTC
美国国防部将中国芯片设备制造商AMEC从军事公司名单中移除U.S. gov't removes China's chip toolmaker AMEC from the list of 'military companies'
➀ 美国国防部已将中国蚀刻和沉积设备制造商AMEC从与中国军方有关联的公司名单中移除。➁ 虽然移除部分限制，但AMEC仍被列入商务部实体清单，限制了其技术开发。➂ AMEC此前在2021年也曾遭遇类似的黑名单，包括2021年1月。➀ The U.S. Department of Defense removes AMEC, a Chinese etching and deposition toolmaker, from the list of companies linked to the Chinese military. ➁ The removal eases some restrictions but AMEC remains on the Commerce Department's Entity List, limiting its technology development. ➂ AMEC has faced similar blacklisting in the past, including in 2021.
12/19/2024, 06:30 AM UTC
Arm与高通诉讼第三天：高通CEO阿蒙作证Third day for Arm vs Qualcomm trial
➀ 高通CEO克里斯蒂亚诺·阿蒙在法庭上作证，称以14亿美元收购Nuvia可以每年节省向Arm支付14亿美元。阿蒙认为，使用Nuvia的核心为PC处理器可以节省Arm的支付，因为预计在PC市场的收入将很高。➁ Arm在法庭上声称，由于未同意将Nuvia的许可证转让给高通，高通必须销毁Nuvia的设计。➂ 阿蒙表示，他最初试图说服Nuvia为高通创建计算核心，但Nuvia拒绝后，他决定收购Nuvia。➀ Qualcomm CEO Cristiano Amon testified in court that buying Nuvia for $1.4 billion could save $1.4 billion a year in payments to Arm. Amon believed using Nuvia's cores for PC processors would save on Arm payments due to expected high revenues in the PC market. ➁ Arm claims in court that Qualcomm must destroy Nuvia's designs due to lack of consent for transferring Nuvia's licenses to Qualcomm. ➂ Amon said he initially tried to persuade Nuvia to create computing cores for Qualcomm but decided to acquire Nuvia when they refused.
12/19/2024, 06:28 AM UTC
Rapidus获得EUV设备Rapidus gets EUV machine
➀ Rapidus已收到一台ASML EUV设备，用于其位于北海道千岁市IIM-1晶圆厂的建设；➁ 这标志着EUV技术在日本首次用于量产；➂ 该TWINSCAN NXE:3800E设备每小时可加工220片晶圆；➃ Rapidus计划在2025年4月开始在IIM-1进行试点硅片生产，采用单片晶圆工艺。➀ Rapidus has received an ASML EUV machine for installation at its IIM-1 foundry in Chitose, Hokkaido; ➁ This marks the first time EUV technology will be used for mass production in Japan; ➂ The TWINSCAN NXE:3800E machine can process 220 wafers an hour; ➃ Rapidus plans to start pilot silicon production at IIM-1 in April 2025 with a single-wafer process.
12/19/2024, 06:11 AM UTC
IDC 2025年半导体趋势预测IDC’s Semiconductor Trends For 2025
➀ 预计内存增长将超过24%，主要由HBM3和HBM3e等高端产品推动，HBM4预计将在2025年下半年推出。非内存预计增长13%，受AI服务器、高端手机IC和WiFi7对先进节点IC的需求驱动。➁ 亚洲-太平洋IC设计市场预计将增长15%，随着库存水平稳定、个人设备需求增加以及AI计算扩展到广泛应用。➂ 台积电在Foundry 1.0和2.0中的市场份额预计将增加，随着2nm和3nm等先进节点的扩张。➃ 预计2nm和3nm的生产将加速，台积电和三星将领先。➄ 预计晶圆代工利用率将增加，2025年是2nm量产的关键年份。➅ 中国的封装和测试市场份额预计将上升，2025年之后FOPLP将快速增长。➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.
12/18/2024, 03:26 PM UTC
AMD 3D V-Cache拆解：Ryzen 7 9800X3D大部分为虚硅AMD 3D V-Cache teardown shows the majority of the Ryzen 7 9800X3D is dummy silicon
➀ AMD的Ryzen 7 9800X3D CPU拆解显示芯片大部分为虚硅，用于结构完整性；➁ 尽管存在虚硅，AMD的3D V-Cache设计仍然表现出色；➂ 英特尔没有计划在主流市场对抗AMD的3D V-Cache技术。➀ AMD's Ryzen 7 9800X3D CPU teardown reveals a significant portion of the chip is dummy silicon for structural integrity; ➁ AMD's 3D V-Cache design shows impressive performance despite the dummy silicon; ➂ Intel has no plans to counter AMD's 3D V-Cache technology in the mainstream segment.
12/18/2024, 12:34 PM UTC
俄罗斯计划开发比ASML更便宜、更易建造的EUV芯片制造工具——国家概述了缩小芯片的新路线图Russia plans EUV chipmaking tools that it says will be cheaper and easier to build than ASML's — country outlines new roadmap to smaller chips
➀ 俄罗斯公布了开发自有EUV光刻机的计划；➁ 这些机器将使用11.2纳米波长的激光，与现有的EUV基础设施不兼容；➂ 开发分为三个阶段，第一阶段专注于基础研究。➀ Russia unveils a plan to develop its own EUV lithography machines; ➁ The machines will use a laser with a 11.2nm wavelength, incompatible with existing EUV infrastructure; ➂ The development is divided into three stages, with the first focusing on foundational research.
12/18/2024, 12:02 PM UTC
高通称其Oryon CPU核心仅使用了1%以下的Arm原始技术——Snapdragon X PC芯片的核心几乎完全定制Qualcomm says its Oryon CPU cores have 1% or less of Arm's original technology — cores in Snapdragon X PC chips are almost entirely custom
➀ 高通Oryon CPU核心使用的Arm技术极低；➁ Oryon核心由Gerard Williams III共同创立的公司Nuvia开发；➂ Arm与高通就Nuvia的架构许可和定制设计存在法律纠纷。➀ Qualcomm's Oryon CPU cores use minimal Arm technology; ➁ Oryon cores are developed by Nuvia, a company co-founded by Gerard Williams III; ➂ Legal dispute between Arm and Qualcomm over Nuvia's architecture licenses and custom designs.
12/18/2024, 11:37 AM UTC
利用生物技术实现可持续能源生产的突破Harnessing Biology for Sustainable Energy Production
➀ 利物浦大学的研究人员开发了一种用于可持续制氢的光驱动混合纳米反应器；➁ 该纳米反应器结合了生物和合成组件以实现高效性能；➂ 该创新可能减少对昂贵贵金属的依赖，并对生物技术过程具有影响。➀ Researchers from the University of Liverpool have developed a light-driven hybrid nanoreactor for sustainable hydrogen production; ➁ The nanoreactor combines biological and synthetic components to achieve high efficiency; ➂ The innovation could reduce reliance on expensive precious metals and has implications for biotechnological processes.
12/18/2024, 11:31 AM UTC
全球晶园与美国政府签订40.6亿美元芯片法案协议，在美国制造300mm晶圆GlobalWafers inks $406 million CHIPS Act deal to make 300mm wafers in the U.S.
➀ 全球晶园与美国政府签署价值40.6亿美元的协议，在美国生产300mm晶圆；➁ 该投资旨在推动国内微电子生产，并实现晶圆生产的本土化；➂ 全球晶园计划在密苏里州和德克萨斯州投资40亿美元，创造约2580个工作岗位。➀ GlobalWafers signs a $406 million deal with the U.S. government to produce 300mm wafers in the U.S.; ➁ The investment aims to boost domestic microelectronics production and localize wafer production; ➂ GlobalWafers plans to invest $4 billion in Missouri and Texas, creating about 2,580 jobs.
12/18/2024, 08:18 AM UTC
Kioxia以58亿美元估值在东京证券交易所上市Kioxia IPOs at $5.8bn valuation
➀ Kioxia在东京证券交易所上市，估值达到58亿美元。由贝恩资本牵头的财团，此前持有Kioxia 56.2%的股份，出售了一小部分股份，持股比例降至50.7%。该财团于2008年为所持股份支付了180亿美元。➁ 在IPO之前，其他主要股东包括东芝（41%）和日本光学产品制造商Hoya（3%），日本政府救援基金INCJ和DBJ控制着Kioxia 16.7%的投票权。➂ Kioxia在NAND市场占有13.8%的份额。➀ Kioxia's IPO on the Tokyo Stock Exchange valued the company at $5.8 billion. The Bain-led consortium, which previously owned 56.2% of Kioxia, sold a small number of shares to reduce its holding to 50.7%. The consortium paid $18 billion for its stake in 2008. ➁ Before the IPO, other significant shareholders included Toshiba (41%) and Hoya (3%). The Japanese government bailout funds INCJ and DBJ controlled 16.7% of the voting rights. ➂ Kioxia holds a 13.8% share of the NAND market.
12/18/2024, 06:28 AM UTC
X-FAB提升其SiC工艺X-FAB upgrades its SiC process
➀ X-FAB硅晶圆厂升级了其XbloX平台，提升了SiC工艺技术，为功率MOSFETs提供更小的单元间距，增加了晶圆上的芯片数量，并改善了导通电阻而不损害可靠性；➁ 新工艺XSICM03现已提供早期访问；➂ XbloX平台通过集成合格的SiC工艺开发模块和模块，简化了上板流程，显著降低了设计风险和产品开发时间。➀ X-FAB Silicon Foundries升级了其XbloX平台，推动了SiC工艺技术，为功率MOSFETs提供更小的单元间距，增加了晶圆上的芯片数量，并改善了导通电阻而不损害可靠性；➁ 新工艺XSICM03现已提供早期访问；➂ XbloX平台通过集成合格的SiC工艺开发模块和模块，简化了上板流程，显著降低了设计风险和产品开发时间。
12/18/2024, 06:26 AM UTC
恩智浦收购Aviva LinksNXP buys Aviva Links
➀ 恩智浦将收购提供车载连接产品的Aviva Links公司。 ➁ 这笔价值2.425亿美元的交易旨在促进高级驾驶辅助系统（ADAS）和车载信息娱乐（IVI）系统的采用。 ➂ Aviva Links的系列支持串行化点对点（SerDes）和基于以太网的连接性，满足软件定义车辆的需求。➀ NXP is acquiring Aviva Links, a provider of in-vehicle connectivity products. ➁ The deal, valued at $242.5 million, aims to enhance the adoption of ADAS and IVI systems. ➂ Aviva Links' portfolio supports SerDes and Ethernet-based connectivity, meeting the needs of software-defined vehicles.
12/18/2024, 06:16 AM UTC
构建无厂半导体企业：实用指南Building a Fabless Semiconductor Business: A Practical Guide
➀ “无厂半导体企业”一词在半导体技术领域象征着创新和适应性；➁ 这些企业专注于设计、创新和市场敏捷性，外包制造；➂ 如高通和英伟达等巨头在这一领域取得了显著进展。➀ The term 'fabless semiconductor companies' signifies innovation and adaptability in the semiconductor technology landscape; ➁ These companies focus on design, innovation, and market agility, outsourcing manufacturing; ➂ Giants like Qualcomm and Nvidia have achieved significant strides in this field.
12/18/2024, 01:00 AM UTC
2024年十大最佳半导体公司CEOTen Best CEOs 2024
➀ 本文列出了2024年十大最佳半导体公司CEO，突出了他们在行业中的贡献和领导力；➁ 列出了这些CEO的名字以及他们所在的公司；➂ 文章指出，这些领导者对塑造半导体行业方向和创新发挥了重要作用。➀ The article lists the ten best semiconductor CEOs in 2024, highlighting their contributions and leadership in the industry; ➁ The CEOs are identified, and their respective companies are mentioned; ➂ The article suggests that these leaders have played a significant role in shaping the semiconductor industry's direction and innovation.
12/17/2024, 01:17 PM UTC
2025芯片互连峰会Chiplet Summit 2025
➀ 将您的公司定位为新兴技术领域的领导者；➁ 声称您在预计的580亿美元市场中的份额；➁ 与关键专家和分析师分享您的观点；➂ 展示您的公司如何进行创新➀ Position your company as a leader in emerging technology; ➁ Lay claim to your share of a projected $5.8 billion market; ➂ Share thoughts with key experts and analysts; ➃ Show movers and shakers how your company is innovating
12/17/2024, 12:34 PM UTC
硼在二维纳米结构金膜制备中的作用The Role of Boron in the Creation of 2D Nanostructured Gold Films
➀ 本研究调查了硼层对Ir(111)衬底上金膜的结构和电子性质的影响。 ➁ 结果揭示了独特的二维纳米结构的形成，并表明硼增强了金膜的稳定性和电子性质。 ➂ 这些发现表明，在催化和电子学领域的潜在应用。➀ This study investigates the effects of boron interlayers on the structural and electronic properties of gold films on Ir(111) substrates. ➁ The results reveal the formation of unique 2D nanostructures and indicate that boron enhances the stability and electronic properties of gold films. ➂ The findings suggest potential applications in catalysis and electronics.
12/17/2024, 10:57 AM UTC
联电获得高通重要先进封装订单，挑战台积电行业主导地位UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
➀ 联电在先进封装市场取得重大突破；➁ 该合同用于高性能计算（HPC）应用；➂ 这一胜利挑战了台积电在该领域的长期主导地位。➀ UMC announced a significant breakthrough in the advanced packaging market; ➁ The contract is for high-performance computing (HPC) applications; ➂ The win challenges TSMC's long-standing dominance in the sector.
12/17/2024, 09:40 AM UTC
SureCore与Sarcina合作推出低温IP，助力量子计算sureCore taps Sarcina for cryo packaging
➀ 慧荣科技与萨辛纳合作开发了用于低温环境的定制BGA封装。这种封装专为极低温度操作设计。➁ 慧荣科技旨在通过其CryoMem™系列内存IP，将低温CMOS技术应用于量子计算生态系统。➂ 该合作将帮助量子计算公司设计用于低温环境的控制/接口芯片，从而提升量子计算机的性能和可扩展性。➀ SureCore has developed a custom BGA package for cryogenic temperatures in partnership with Sarcina. This package is designed for extreme low temperature operations. ➁ SureCore aims to make Cryo-CMOS available for the Quantum Computing ecosystem with their CryoMem™ range of memory IP. ➂ The partnership will help QC companies design control/interface chips for cryogenic environments, improving the performance and scalability of quantum computers.
12/17/2024, 09:00 AM UTC
弗劳恩霍夫IAF在APECS试验线上扩展芯片创新技术能力Fraunhofer IAF Expands Technology Capabilities for Chiplet Innovations within the APECS Pilot Line
➀ 弗劳恩霍夫IAF正在增强其在III-V族化合物半导体领域的技术能力，为APECS试验线做出贡献，支持欧盟芯片法案。➁ 该项目将从巴登-符腾堡州经济事务部获得450万欧元的资金。➂ APECS旨在扩大欧洲研发基础设施，并增强半导体竞争力。➀ The Fraunhofer IAF is enhancing its technology capabilities in III-V compound semiconductors for the APECS pilot line, contributing to the EU Chips Act.➁ The project is receiving €4.35 million from Baden-Württemberg's Ministry of Economic Affairs.➂ APECS aims to expand European R&D infrastructure and enhance semiconductor competitiveness.
12/17/2024, 06:50 AM UTC
高通与Arm法庭大战拉开帷幕Qualcomm v Arm court battle gets under way
➀ 高通与Arm的法律大战在特拉华州的一间法庭上拉开帷幕。这场诉讼的核心在于高通与Arm的架构许可是否涵盖了在Nuvia被高通收购之前由Nuvia完成的设计。➁ 如果高通收购Nuvia不被确认，这场纠纷可能导致Arm损失高达5000万美元的营收。➂ Arm首席执行官Rene Haas和高通首席执行官Cristiano Amon预计将提供证词。➀ The Qualcomm vs Arm legal battle began in a Delaware courtroom. The case revolves around whether Qualcomm's architecture license with Arm covers designs done by Nuvia before it was acquired by Qualcomm. ➁ The dispute could cost Arm an estimated $50 million in revenue if Qualcomm's acquisition of Nuvia is not validated. ➂ Arm CEO Rene Haas and Qualcomm CEO Cristiano Amon are expected to give evidence.
12/17/2024, 06:20 AM UTC
中国芯片投资今年不佳Bad year for China chip investment
➀ 2024年前11个月，中国芯片投资新交易数量同比下降35.9%，总资金下降32.4%；➁ 长鑫存储和紫光展锐分别成为最大和第二大投资者，金额分别为14.8亿美元和8.24亿美元；➂ JW Insights指出，由于国内供应链限制，中国在高端计算芯片和高端存储产品的需求激增受到阻碍，而美国在AI基础设施方面进行了大量投资，导致第三季度美国半导体市场超过中国。➀ China experienced a decline in chip investment, with new investment deals dropping by 35.9% year-on-year in the first 11 months of 2024; ➁ The total funding decreased by 32.4%; ➂ ChangXin Memory and Unisoc were the largest and second-largest investors, respectively. JW Insights notes that the US semiconductor market surpassed China's in Q3, driven by massive AI infrastructure investments in the US.
12/17/2024, 06:02 AM UTC
英国半导体产业振兴五点计划Five point plan to boost UK semis
➀ TechWorks提出了一个五点计划，旨在提升英国半导体产业；➁ 计划包括培育全球竞争力芯片公司、扩大生产规模、投资人才培养、建立国家半导体研究院以及增强国内需求；➂ 面临着全球竞争和资金缺口等挑战，但该计划旨在将英国定位为全球科技领域的领导者。➀ TechWorks outlines a five-point plan to enhance the UK's semiconductor industry; ➁ The plan includes growing globally competitive chip companies, scaling up manufacturing, investing in talent development, creating a national semiconductor institute, and enhancing domestic demand; ➂ Challenges include global competition and financial gaps, but the plan aims to position the UK as a leader in the global technology landscape.
12/17/2024, 01:00 AM UTC
1960年美国晶体管月销量平均为一千万US Transistor Sales Average Ten Million A Month
➀ 1960年前10个月，美国制造商每月平均销售晶体管1000万只，价值近900万英镑。这比1959年的每月平均750万只增长了33%。 ➁ 《电子时报》1961年1月25日的一篇报道提到，1960年1月至10月，美国制造商销售了近1.02亿只晶体管，10月份的总销量为1220万只。 ➂ 1960年前10个月美国工厂晶体管销售额达到8800万英镑，全年预计将达到约1亿英镑。➀ During the first 10 months of 1960, US manufacturers averaged 10 million transistors sold per month, totaling nearly £9 million in value. This represented a 33% increase from the monthly average of 7.5 million units in 1959. ➁ The story from Electronics Weekly's January 25, 1961, issue mentioned that US manufacturers sold nearly 102 million transistors between January and October 1960, with an October total of 12.2 million units. ➂ The value of US factory transistor sales in the first 10 months of 1960 was £88 million, with a projection for the full year to reach around £100 million.
12/16/2024, 12:20 PM UTC
蔡崇信与埃隆·马斯克联手机器人C.C.Wei and Elon Musk hooking up on robots
➀ 蔡崇信与埃隆·马斯克正在合作开发多功能机器人；➁ 马斯克计划于2026年 推出名为Optimus的多功能人形机器人；➂ 蔡崇信强调无人机和人工智能在水资源、电力等公用事业领域的应用的重要性。➀ C.C. Wei and Elon Musk are collaborating on multifunctional robots; ➁ Musk plans to launch a multifunctional humanoid robot named Optimus in 2026; ➂ Wei emphasizes the importance of drones and AI applications in utilities such as water and electricity provision.
12/16/2024, 09:44 AM UTC
保持冷静，让利润增长——Broadcom的半导体解决方案业务前景看好Broadcom: Keep Calm And Let Profits Ride
1. Broadcom的半导体解决方案业务因出货量增加，AI引领的增长加速具有长期发展空间。2. VMware正在以超过预期的速度推动利润率扩张。3. 墙街分析师正在上调收入、毛利率和营业利润预期，显示出积极的基本面信号。1. AI-led growth acceleration in Broadcom's semiconductor solutions business has a long runway due to increased shipment volume. 2. VMware is driving strong margin expansion at a faster-than-expected rate. 3. Wall Street analysts are upgrading revenue, gross margins, and operating profit estimates, indicating bullish fundamental signs.
12/16/2024, 06:48 AM UTC
欧洲芯片创新：APECS试点线在欧盟芯片法案框架下启动运营European Chiplet Innovation: APECS Pilot Line Starts Operation under the EU Chips Act
➀ APECS试点线标志着加强欧洲半导体制造能力和芯片创新的重要一步。➁ 旨在提高技术韧性、跨境合作和全球竞争力。➂ 该线将为行业参与者、中小企业和初创企业提供先进技术的访问，为欧洲半导体供应链奠定坚实基础。➂ APECS专注于将研究与创新发展中的异构集成和先进封装相结合。➀ The APECS pilot line marks a significant step in strengthening Europe's semiconductor manufacturing and chiplet innovation. ➁ It aims to enhance technological resilience, cross-border collaboration, and global competitiveness. ➂ The line will provide advanced technology access to industry players, SMEs, and startups, establishing a strong foundation for European semiconductor supply chains. ➃ APECS focuses on bridging research with innovative developments in heterogeneous integration and advanced packaging.
12/16/2024, 06:47 AM UTC
欧洲芯片创新：启动欧盟芯片法案下的APECS试点线Chiplet Innovations for Europe: Launch of APECS Pilot Line under the EU Chips Act
➀ APECS试点线作为欧盟芯片法案的重要组成部分，旨在推进芯片创新并提升欧洲半导体制造能力。➁ 该试点线将为大型企业、中小企业和初创公司提供进入尖端技术的低门槛途径，确保安全的半导体价值链。➂ APECS项目由芯片联合体和比利时、德国、芬兰、法国、希腊、奥地利、葡萄牙和西班牙的国家资金共同资助，总资金为7.3亿欧元，为期4.5年。➀ The APECS pilot line, a key part of the EU Chips Act, is launched to advance chiplet innovations and enhance European semiconductor manufacturing capabilities. ➁ The pilot line will provide low-barrier access to cutting-edge technologies for large companies, SMEs, and startups, ensuring secure and resilient semiconductor value chains. ➂ The APECS project is co-financed by the Chips Joint Undertaking and national funds from Belgium, Germany, Finland, France, Greece, Austria, Portugal, and Spain, with a total funding of 730 million euros over 4.5 years.
12/16/2024, 06:31 AM UTC
政府组织半导体代表团访问韩国Government running semiconductor trip to Korea
➀ 科学创新与技术部（DSIT）正在组织半导体研究人员和组织前往韩国的代表团。此次访问旨在确定英国和韩国之间的合作研究和创新机会。➁ 程序将包括参观韩国半导体组织、与利益相关者网络化以及与专家的研讨会。➂ DSIT邀请对半导体研究感兴趣的利益相关者申请，尤其是在异构集成和先进封装、宽带隙材料、未来电信和先进智能网络技术等领域。➀ The Department for Science, Innovation and Technology (DSIT) is organizing a mission to Korea for semiconductor researchers and organizations. The visit aims to identify collaborative research and innovation opportunities between the UK and Korea. ➁ The program will include visits to Korean semiconductor organizations, networking with stakeholders, and workshops with experts. ➂ The DSIT invites applications from stakeholders interested in semiconductor research, particularly in areas like heterogeneous integration and advanced packaging, wide band gap materials, future telecommunication, and advanced smart network technologies.
12/16/2024, 05:40 AM UTC
国产大硅片龙头IPO获受理！拟募资49亿China's Domestic Giant Silicon Wafer Leader's IPO Application Accepted, Seeking to Raise 4.9 Billion Yuan
<p>➀ 西安奕斯伟材料，国内大硅片龙头企业，科创板IPO申请已获受理。</p><p>➁ 公司是国内最大的12英寸硅片制造商，其产能和月均出货量在全球的占比分别约为7%和4%。</p><p>➂ 成立于2016年，西安奕斯伟已成为国内主流存储IDM厂商的全球硅片供应商中采购占比第一或第二大的战略级供应商。</p><p>➀ Xi'an Yishuiwei Materials, a leading domestic silicon wafer manufacturer, has had its IPO application accepted on the Science and Technology Innovation Board.</p><p>➁ The company is the largest 12-inch silicon wafer manufacturer in mainland China, with a global market share of about 7% in terms of production capacity and 4% in monthly shipments.</p><p>➂ Established in 2016, Xi'an Yishuiwei has become a strategic supplier to major global silicon wafer suppliers, providing silicon wafers to most of the domestic leading logic wafer fabs.</p>
12/15/2024, 11:20 PM UTC
AI芯片-ASIC时刻！谁是中国的博通？AI Chip - ASIC Moment: Who is China's Broadcom?
<p>➀ 目前中国尚未出现能与博通在AI芯片ASIC领域完全匹敌的企业；</p><p>➁ 博通作为全球领先的半导体和基础设施软件解决方案提供商，在AI领域取得了显著成就；</p><p>➂ 百度、苹果和AMD通过自主研发技术发展壮大，而博通则专注于并购成为科技巨头。</p><p>➀ China currently lacks a company that can fully match Broadcom in the AI chip ASIC field;</p><p>➁ Broadcom, as a global leader in semiconductor and infrastructure software solutions, has made significant achievements in AI;</p><p>➂ Baidu, Apple, and AMD have grown through self-developed technology, while Broadcom has focused on acquisition to become a tech giant.</p>
12/15/2024, 03:06 AM UTC
2nm，胜负已分？2nm, The Winner Has Already Been Decided?
<p>➀ 2nm晶圆代工的竞争已经清晰，台积电凭借其先进技术和强大的客户需求取得了胜利。</p><p>➁ 台积电在2nm技术方面取得了显著里程碑，包括成功的试生产和高良率。</p><p>➂ 苹果和AMD预计将成为台积电2nm技术的首批客户，苹果的A20 Pro和M5芯片将在此工艺上生产。</p><p>➃ 英特尔和英伟达也将转向台积电以利用其2nm技术，英特尔的新款台式机芯片和英伟达的Rubin Next平台预计将在TSMC的N2工艺上生产。</p><p>➄ 三星在2nm技术方面面临挑战，包括良率问题和可能失去自己的客户给台积电。</p><p>➅ 英特尔的2nm技术，称为18A，面临延误和良率挑战，对其与台积电竞争的能力表示担忧。</p><p>➆ 日本半导体公司Rapidus正在开发2nm技术，但面临当前市场的重大挑战。</p><p>➇ 台积电在2nm技术方面的崛起引发了对其定价能力和对半导体行业潜在影响的担忧。</p><p>➀ The competition in 2nm wafer fabrication has become a clear victory for TSMC, with its advanced technology and strong customer demand.</p><p>➁ TSMC has achieved significant milestones in 2nm technology, including successful trial production and high yields.</p><p>➂ Apple and AMD are expected to be among the first customers for TSMC's 2nm technology, with Apple's A20 Pro and M5 chips set to be produced on this process.</p><p>➃ Intel and NVIDIA are also turning to TSMC for its 2nm technology, with Intel's Nova Lake desktop chips and NVIDIA's Rubin Next platform expected to be produced on TSMC's N2 process.</p><p>➄ Samsung faces challenges in 2nm technology, including yield issues and the potential loss of its own customers to TSMC.</p><p>➅ Intel's 2nm technology, known as 18A, faces delays and yield challenges, with concerns about its ability to compete with TSMC.</p><p>➆ Rapidus, a Japanese semiconductor company, is working on 2nm technology but faces significant challenges in the current market.</p><p>➇ The rise of TSMC in 2nm technology raises concerns about pricing power and the potential impact on the semiconductor industry.</p>
12/15/2024, 12:05 AM UTC
半导体行业2024年第三季度财报汇总：英伟达、台积电、三星、博通等45家企业Semiconductor Industry Q3 2024 Earnings Summary: Nvidia, TSMC, Samsung, Broadcom, and More
<p>➀ 英伟达第三季度营收为350.62亿美元，同比增长17%，环比增长94%，净利润为193.09亿美元，同比增长16%，环比增长109%。</p><p>➁ 台积电第三季度营收为新台币7596.9亿元，同比增长39%，净利润为新台币3252.6亿元，同比增长54.2%。</p><p>➂ 三星电子第三季度营业利润为9.1834万亿韩元，同比增长277.37%，销售额和净利润分别同比增长17.35%和72.84%。</p><p>➀ Nvidia reported a Q3 revenue of $35.062 billion, up 17% YoY and 94% QoQ, with a net profit of $19.309 billion, up 16% YoY and 109% QoQ.</p><p>➁ TSMC's Q3 revenue was NT$759.69 billion, up 39% YoY, with a net profit of NT$325.26 billion, up 54.2% YoY.</p><p>➂ Samsung Electronics posted a Q3 operating profit of 9.1834 trillion KRW, up 277.37% YoY, with sales and net profit up by 17.35% and 72.84% YoY, respectively.</p>
12/14/2024, 12:46 PM UTC
台积电在IEDM 2024上详细披露其尖端2nm工艺节点——功耗降低35%，性能提升15%TSMC shares deep-dive details about its cutting edge 2nm process node at IEDM 2024 — 35 percent less power, or 15% more performance
➀ 台积电在IEDM 2024上公布了其N2（2nm级）制造工艺的详细信息；➁ 新工艺承诺在相同电压下实现24至35%的功耗降低或15%的性能提升；➂ 关键进展包括GAA纳米片晶体管和N2 NanoFlex设计技术的协同优化。➀ TSMC unveiled details about its N2 (2nm-class) fabrication process at IEDM 2024; ➁ The new process promises a 24 to 35% power reduction or a 15% performance improvement at the same voltage; ➂ Key advancements include GAA nanosheet transistors and N2 NanoFlex design-technology co-optimization.
12/14/2024, 05:01 AM UTC
Ayar Labs 完成1.55亿美元D轮融资，AMD、Intel、NVIDIA等参与Ayar Labs Closes a $155M Series D from AMD Intel NVIDIA and More
➀ 慧荣科技完成1.55亿美元D轮融资；➁ AMD、Intel、NVIDIA等公司参与投资；➂ 公司专注于高速光I/O互连技术。➀ Ayar Labs has closed a $155M Series D round; ➁ AMD, Intel, NVIDIA, and others participated; ➂ The company is focused on high-speed optical I/O interconnect technology.
12/13/2024, 02:15 PM UTC
英国在塑料电子领域的领先地位UK Leads In Plastic Electronics
➀ 英国在塑料电子领域是全球的领导者；➁ 曼德尔森勋爵强调了为行业制定路线图的重要性，以从尖端技术走向大众市场；➂ 斯旺西大学和威尔士印刷与涂覆中心参与开发使用塑料电子的新产品线。➀ The UK has been a global leader in the Plastic Electronics sector; ➁ Lord Mandelson emphasized the importance of a roadmap for the industry to move from cutting-edge to mass market; ➂ Swansea University and the Welsh Centre for Printing and Coating are involved in developing new product lines using plastic electronics.
12/13/2024, 09:18 AM UTC
利用人工智能实现更好的光伏材料Using AI to Achieve Better Photovoltaic Materials
➀ 卡尔鲁厄理工学院的研究人员通过人工智能和高通量合成找到了新的有机分子，以提高钙钛矿太阳能电池的效率。➁ 开发的策略可以应用于其他材料研究领域，如新型电池材料。➂ 该团队使参考太阳能电池的效率提高了2%，达到26.2%。➀ Researchers at KIT have found new organic molecules to improve the efficiency of perovskite solar cells with the help of AI and high-throughput synthesis. ➁ The strategy developed can be applied to other areas of material research, such as new battery materials. ➂ The team achieved a two percent efficiency increase for a reference solar cell, reaching 26.2 percent.
12/13/2024, 06:28 AM UTC
二维目的地：在CMOS条件下沉积的石墨烯IC互连Graphene IC interconnects deposited in CMOS conditions
➀ 二维目的地，一家位于米尔皮塔斯的初创公司，由石墨烯发明者、诺贝尔奖得主康斯坦丁·诺沃赛洛夫担任首席科学家，已经开发出用于CMOS工艺的IC石墨烯互连。➁ 该公司的掺杂石墨烯薄片具有比铜高100倍的电流密度。➂ 二维目的地使用压力辅助直接沉积技术和层间掺杂技术来实现高电流密度。➀ Destination 2D, a Milpitas startup with Konstantin Novoselov as its chief scientist, has developed graphene interconnects for ICs using a CMOS process. ➁ The company's doped graphene sheets have current densities 100 times denser than copper. ➂ Destination 2D uses a pressure-assisted direct deposition technique and intercalation doping to achieve high current densities.
12/13/2024, 06:26 AM UTC
imec提出基于IGZO通道的3D CCD，用于CXL缓冲存储器Imec proposes 3D CCD with IGZO channel for CXL buffer memory
➀ imec提出一种基于IGZO通道的3D集成CCD，用于CXL缓冲存储器；➁ 该存储器在平面概念结构上运行，存储容量为142位；➂ imec预计3D CCD内存密度将超越DRAM限制，到2030年，其比特密度可能比2D DRAM高五倍。➀ Imec proposes a 3D integrated CCD with IGZO channel for CXL buffer memory; ➁ The memory operates on a planar proof-of-concept structure with a storage capacity of 142 bits; ➂ Imec expects the 3D CCD memory density to scale beyond DRAM limits, with potential for five times more bit density than 2D DRAM by 2030.
12/13/2024, 05:45 AM UTC
ASML收购Mapper的背后故事：中美俄荷四方暗斗The Behind Story of ASML's Acquisition of Mapper: The Quadrilateral Struggle Between China, the US, Russia, and the Netherlands
<p>➀ 一名具有俄罗斯背景的前ASML员工因涉嫌窃取ASML和Mapper Lithography的微芯片手册等文件被荷兰政府拘留，引发各方关注；</p><p>➁ Mapper公司专注于电子束光刻，2019年被ASML收购，引发了美国、荷兰、中国和俄罗斯之间的权力斗争；</p><p>➂ Mapper的技术具有高分辨率和低成本，曾被视为EUV光刻机的竞争对手，但由于速度慢、效率低，未能得到广泛应用；</p><p>➃ Mapper得到了俄罗斯投资基金RUSNANO的投资，帮助在莫斯科建立工厂生产必要的部件，但后来面临财务困难，寻求中国合作伙伴；</p><p>➄ 美国国防部对Mapper的技术感兴趣，但未能达成协议，导致Mapper破产，ASML收购了它；</p><p>➅ ASML收购了Mapper的技术和专利，但关闭了电子束光刻产品线，而Mapper的俄罗斯工厂被RUSNANO收购并继续运营；</p><p>➆ 俄罗斯和中国正在继续开发自己的电子束光刻技术，以满足半导体制造的需求。</p><p>➀ A former ASML employee with a Russian background was detained by the Dutch government for allegedly stealing chip-making manuals and other files from ASML and Mapper Lithography, sparking concerns from all sides;</p><p>➁ Mapper, a firm specializing in electron-beam lithography, was acquired by ASML in 2019, leading to a power struggle among the US, the Netherlands, China, and Russia;</p><p>➂ Mapper's technology, with high resolution and low cost, was considered a competitor to EUV lithography machines, but failed to gain widespread adoption due to its slow speed and low efficiency;</p><p>➃ Mapper received investment from RUSNANO, a Russian investment fund, which helped establish a factory in Moscow to produce necessary parts, but later faced financial difficulties and sought Chinese partners;</p><p>➄ The US Department of Defense was interested in Mapper's technology but failed to secure a deal, leading to Mapper's bankruptcy and ASML's acquisition;</p><p>➅ ASML acquired Mapper's technology and patents, but closed its electron-beam lithography product line, while Mapper's Russian factory was acquired by RUSNANO and continues to operate;</p><p>➆ Russia and China are continuing to develop their own electron-beam lithography technologies to meet their semiconductor manufacturing needs.</p>
12/13/2024, 04:03 AM UTC
英特尔高管称分拆制造部门是一个“开放问题”Intel executive says spinning off manufacturing unit is an 'open question'
➀ 英特尔联席CEO米歇尔·约翰斯顿·霍尔特豪斯和戴维·津斯纳对于分拆英特尔晶圆代工部门持有不同意见；➁ 英特尔正专注于使其18A工艺技术取得成功；➂ 英特尔已收到多个对其18A技术的提案。➀ Michelle Johnston Holthaus and David Zinsner, co-CEOs of Intel, have differing opinions on spinning off the Intel Foundry division; ➁ Intel is focused on making its 18A process technology successful; ➂ Intel has received several requests for proposals (RFPs) for its 18A technology.
12/13/2024, 02:10 AM UTC
江苏今年首个半导体IPO，两大设备龙头持股Jiangsu's First Semiconductor IPO This Year Surges 568%: Two Equipment Leaders Hold Shares
<p>➀ 先锋精密，江苏半导体设备核心零部件供应商，成功登陆科创板，首日交易大涨534%。</p><p>➁ 这家公司是今年江苏唯一登陆科创板的企业，也是自4月新“国九条”和6月证监会“科创板八条”出台以来，全国唯一当年过会、当年上市的企业。</p><p>➂ 先锋精密已实现多种关键工艺零部件国产化自主可控，具备完善的工艺配套能力，是国内少数已量产供应7nm及以下国产刻蚀设备关键零部件的供应商，直接与国际厂商竞争。</p><p>➀ Pioneer Precision, a core component supplier for Jiangsu's semiconductor equipment, was successfully listed on the Science and Technology Innovation Board, with a surge of 534% on the first day of trading.</p><p>➁ This is the only company in Jiangsu to be listed on the Science and Technology Innovation Board this year and the only company in the country to pass and be listed on the Science and Technology Innovation Board in the same year since the introduction of the new 'national nine articles' in April and the 'eight articles' by the China Securities Regulatory Commission in June.</p><p>➂ Pioneer Precision has achieved localization and autonomy in a variety of key process components and has the capability to provide complete process support. It is one of the few domestic suppliers that can mass-produce and supply key components for etching equipment with 7nm and below domestic technology, directly competing with international manufacturers.</p>
12/13/2024, 01:00 AM UTC
半导体行业的产量之谜：揭秘英特尔和台积电的产量挑战Yield
➀ 半导体行业的产量曾经是高度保密的秘密，但现在随着英特尔和台积电低产量指控的出现，这一秘密已被公开讨论。➁ 根据最近的消息，英特尔18A的产量为10%，而台积电的2nm工艺的产量为60%。➂ 英特尔首席执行官帕特·格尔辛格认为，产量并不是衡量工 艺成熟度的标准，他建议使用缺陷密度作为更好的指标。➀ The semiconductor industry's closely guarded secret, yield, is now being discussed openly, following allegations of low yields from Intel and TSMC. ➁ Intel's 18A has a 10% yield, while TSMC's 2nm process has a 60% yield, according to recent reports. ➂ Pat Gelsinger, CEO of Intel, argues that yield is not a measure of process maturity and suggests defect density as a better indicator.
12/12/2024, 02:00 PM UTC
寓言：牛仔CEO的故事Fable: The Cowboy CEO
➀ 这位CEO以他的十加仑帽子和牛仔靴闻名，创立的公司收购了60多家电信公司，市值一度高达1860亿美元。➁ 在一个季度亏损的情况下，公司报告了138亿美元的净利润。➂ 他从公司借款4.08亿美元来弥补保证金调用，最终违约，并在监狱中度过了13年。➀ The CEO, known for his ten gallon hats and cowboy boots, founded a company that acquired over 60 telecoms companies and had a peak market cap of $186 billion. ➁ In one quarter with a loss, the company reported a net profit of $1.38 billion. ➂ He borrowed $408 million from the company to cover margin calls and defaulted on the debt, spending 13 years in jail.
12/12/2024, 12:17 PM UTC
GMG的THERMAL-XR(R)在电子散热片微型化和效率方面展现潜力GMG's THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and Efficiency
➀ GMG的THERMAL-XR®涂层散热片展示了微型化和效率的潜力；➁ 该技术可以将散热片尺寸减少高达39%，同时保持等效的散热性能；➂ THERMAL-XR®的应用可以提高散热片的效率，实现更小的散热片和更紧凑的PCB组装。➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.
12/12/2024, 12:16 PM UTC
华为坚持使用7nm工艺打造最新处理器，中国芯片进步停滞不前Huawei sticks to 7nm for latest processor as China's chip advancements stall
➀ 尽管中国半导体进步停滞，华为仍坚持使用7nm工艺生产最新处理器；➁ 华为Mate 70 Pro搭载的HiSilicon Kirin 9020处理器采用SMIC的7nm级技术；➂ 华为依赖SMIC的技术可能导致其5nm生产技术的采用推迟到2026年。➀ Huawei sticks to 7nm for its latest processor despite China's stagnation in semiconductor advancements; ➁ The Huawei Mate 70 Pro uses the HiSilicon Kirin 9020 processor with SMIC's 7nm-class technology; ➂ Huawei's reliance on SMIC's technology may delay the adoption of 5nm production until 2026.
12/12/2024, 11:42 AM UTC
安徽首富曹仁贤投资院士加持的半导体公司阿基米德安徽首富曹仁贤投资院士加持的半导体公司阿基米德
<p>➀ 安徽首富曹仁贤最近投资了合肥阿基米德半导体有限公司，这是一家获得两位院士支持的功率半导体芯片公司。</p><p>➁ 阿基米德在创立之初就获得了合肥的大力支持，并在2021年完成了高达3亿元的天使轮融资。</p><p>➂ 阳光电源及其关联投资机构对阿基米德进行了投资，其中阳光电源的关联投资机构仁发投资成为公司第三大股东。</p><p>➀ Anhui's richest man, Cao Renxian, recently invested in Akiydemi Semiconductor, a power semiconductor chip company in Hefei, supported by two academicians.</p><p>➁ Akiydemi has received strong support from Hefei and completed a 300 million yuan angel round in 2021.</p><p>➂ SunPower, a leading solar inverter company, has invested in Akiydemi, with SunPower's affiliated investment fund, Renfa Investment, becoming the third largest shareholder.</p>
12/12/2024, 06:27 AM UTC
Ayar Labs融资1.55亿美元，AI基础设施光学I/O技术引领者Ayar Labs raises $155m
➀ 光学I/O专家Ayar Labs筹集了1.55亿美元，公司总资金达到3.7亿美元，估值超过10亿美元。➁ 本轮融资由Advent Global Opportunities和Light Street Capital领导，AMD Ventures、Intel Capital、Nvidia、3M Ventures和Autopilot等参与。➂ Ayar Labs开发了封装式光学I/O技术，以提升AI基础设施的效率和性能。➀ Ayar Labs, an optical I/O specialist, has raised $155 million, bringing its total funding to $370 million and valuing the company over $1 billion.➁ The round was led by Advent Global Opportunities and Light Street Capital, with participation from AMD Ventures, Intel Capital, Nvidia, 3M Ventures, and Autopilot, among others.➂ Ayar Labs has developed in-package optical I/O technology to enhance AI infrastructure efficiency and performance.
12/11/2024, 09:44 AM UTC
CEA-Leti展示与22纳米FD-SOI节点兼容的嵌入式FeRAM平台CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22 nm FD-SOI Node
➀ CEA-Leti展示了可扩展的HfZrO2基FeRAM平台，该平台集成在22纳米FD-SOI节点的后端工艺中，这是铁电存储技术的一项重大进步，提高了嵌入式应用的扩展性，并将FeRAM定位为先进节点具有竞争力的存储解决方案。 ➁ 当前的嵌入式FeRAM产品使用钙钛矿材料，这些材料与CMOS不兼容且无法扩展到130纳米以上。新的基于HfO2的薄膜与CMOS兼容且可扩展，为嵌入式FeRAM提供了新的可能性。 ➂ 该技术预计将使嵌入式系统（如物联网、移动设备和边缘计算）中的内存解决方案更快、更节能且成本效益更高。➀ CEA-Leti has demonstrated a scalable hafnia-zirconia-based FeRAM platform integrated into the 22 nm FD-SOI node's BEOL. This is a significant advance in ferroelectric memory technology, improving scalability for embedded applications and positioning FeRAM as a competitive memory solution for advanced nodes. ➁ Current embedded FeRAM products use perovskite materials that are not CMOS compatible and cannot scale beyond 130 nm. The new HfO2-based thin films are CMOS compatible and scalable, offering new possibilities for embedded FeRAM. ➂ The technology is expected to enable faster, more energy-efficient, and cost-effective memory solutions in embedded systems like IoT, mobile devices, and edge computing.
12/11/2024, 08:04 AM UTC
Rapidus与Synopsys推出缩短设计周期的方案Rapidus and Synopsys deliver shortened design cycle
➀ Rapidus与Synopsys合作，采用新方法缩短集成电路设计周期；➁ 该方法旨在减少重新表征的需求，并加速设计迭代；➂ Synopsys将开发先进的设计流程，并在Rapidus的2nm GAA工艺上启用广泛的IP组合。➀ Rapidus and Synopsys collaborate to shorten the IC design cycle with a new approach; ➁ The approach aims to reduce the need for re-characterization and accelerate design iterations; ➂ Synopsys will develop advanced design flows and enable a broad IP portfolio on Rapidus’ 2nm GAA process.
12/11/2024, 06:11 AM UTC
2023-2029年半导体激光器市场年复合增长率达9%，增长至50亿美元以上9% CAGR 2023-29 for semiconductor lasers
半导体激光器市场预计将从2023年到2029年以9%的复合年增长率增长，从31亿美元增长到超过50亿美元。增长动力包括激光应用的扩展、向能源效率、紧凑尺寸和精度的转变，以及与SOI(2)、SiN(3)、InP(4)和TFLN(5)等多技术平台的集成。电信和基础设施是最大的市场，而消费者市场预计将以1%的复合年增长率增长，到2029年达到17.5亿美元。由于2022-2024年期间光学传感应用的量下降，消费者市场增长较为温和，而汽车领域，尤其是中国市场，预计将实现显著扩张。The semiconductor laser market is expected to grow at a CAGR of 9% from 2023 to 2029, expanding from $3.1 billion to over $5 billion. Growth is driven by the expansion of laser applications, shifts towards energy efficiency, compact size, and precision, and integration with multiple technology platforms. The telecom and infrastructure segment is the largest market, while the consumer market is expected to grow at a 1% CAGR to reach $1.75 billion in 2029. Moderate growth in the consumer segment is due to the decline in optical sensing applications, while significant expansion in the automotive segment is anticipated, especially in China.
12/11/2024, 01:19 AM UTC
十大晶圆供应商Top Ten Wafer Vendors
➀ 本文列出了十大最大的半导体晶圆生产商。 ➁ 其中包括信越化学、SUMCO、Globalwafers等公司。 ➂ 信息由PCBAA提供。➀ The article lists the top ten largest producers of semiconductor wafers. ➁ It highlights companies such as Shin-Etsu, Sumco, Globalwafers, and others. ➂ It is noted that the information is provided by the PCBAA.
12/11/2024, 12:06 AM UTC
马来西亚的“半导体时代”终于来了吗？Has Malaysia's 'Semiconductor Era' Finally Arrived?
<p>➀ 马来西亚在半导体产业中一直扮演着角色，主要专注于芯片组装、封装和测试等后端任务；</p><p>➁ 该国正在寻求成为全球集成电路设计和制造的中心，政府计划对半导体产业投资1070亿美元；</p><p>➂ 惠普、英飞凌等大型公司已在马来西亚投资，中国芯片公司也在考虑在那里设立业务。</p><p>➀ Malaysia has historically been involved in the semiconductor industry, focusing on backend tasks such as chip assembly, packaging, and testing;</p><p>➁ The country is seeking to become a global center for integrated circuit design and manufacturing, with a government plan to invest $107 billion in the semiconductor industry;</p><p>➂ Major companies like Intel and Infineon have invested in Malaysia, and Chinese chip companies are considering setting up operations there.</p>
12/10/2024, 06:07 PM UTC
中国对英伟达开出10亿美元反垄断罚单——英伟达收购迈络思交易被北京审查Nvidia could face massive $1 billion fine over antitrust violations in China — Nvidia's Mellanox acquisition is in Beijing's crosshairs
➀ 中国国家市场监督管理总局（SAMR）正在调查英伟达2019年收购迈络思技术公司；➁ 英伟达可能面临高达10.3亿美元的罚款；➂ 该调查是中国对美国半导体技术出口控制的反击行动的一部分。➀ China's State Administration for Market Regulation (SAMR) is investigating Nvidia over its 2019 acquisition of Mellanox Technologies; ➁ Nvidia faces a potential fine of up to $1.03 billion; ➂ The probe is part of China's retaliation against U.S. export controls on semiconductor technology.
12/10/2024, 05:49 PM UTC
泛林集团推出Dextro：用于晶圆厂维护的协作机器人Lam Research unveils Dextro, a maintenance robot for fabs
➀ 泛林集团推出了Dextro协作机器人，用于晶圆厂的维护；➁ Dextro提高了设备维护的准确性和效率；➂ 该协作机器人旨在减少错误并提高半导体制造业的生产力。➀ Lam Research unveils Dextro, a collaborative robot for fab maintenance; ➁ Dextro improves accuracy and efficiency in equipment maintenance; ➂ The cobot is designed to reduce errors and enhance productivity in semiconductor manufacturing.
12/10/2024, 11:00 AM UTC
Tower半导体荣获Semtech颁发的制造卓越与合作伙伴奖Tower Semiconductor Awarded by Semtech for Manufacturing Excellence and Partnership
1. Tower半导体因在2024财年执行晶圆出货方面的制造卓越与合作伙伴关系而获得Semtech的认可。2. 该奖项突出了Tower在需求前所未有的SiGe集成电路（IC）期间，在其最先进的SiGe平台上成功扩大高容量产品的能力。3. Tower和Semtech在先进光纤解决方案方面有着长期的合作历史，在AI和数据中心应用的SiGe产品中占据了显著的市场份额。1. Tower Semiconductor has been recognized by Semtech for its Manufacturing Excellence and Partnership in executing wafer shipments in CY2024. 2. The award highlights Tower's ability to scale high-volume products on its advanced SiGe platform during unprecedented demand for SiGe ICs. 3. Tower and Semtech have a long-standing collaboration on advanced optical fiber solutions, holding a significant market share in SiGe products for AI and data center applications.
12/10/2024, 09:08 AM UTC
台积电11月收入同比增长34%TSMC November revenues up 34% y-o-y
➀ 台积电11月收入同比增长34%，达到85.2亿美元；➁ 2024年1月至11月期间收入同比增长31.8%，达到850亿美元。➀ TSMC reported a 34% year-over-year increase in November revenues to reach US$8.52 billion; ➁ The revenue for the period from January to November 2024 increased by 31.8% year-over-year to US$85 billion.
12/10/2024, 06:20 AM UTC
SEMI：半导体制造设备销售额达到1130亿美元，创历史新高Equipment sales hit record $113bn, says SEMI
➀ SEMI预测2024年半导体制造设备销售额将同比增长6.5%，达到1130亿美元，预计2025年为1210亿美元，2026年为1390亿美元。➁晶圆厂设备（WFE）部门预计将增长5.4%，达到1010亿美元，受DRAM、HBM和中国推动。➂后端设备销售预计将激增，测试设备销售在2025年增长14.7%，在2026年增长18.6%。➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 6.5% year-on-year to $113 billion in 2024, with projections of $121 billion for 2025 and $139 billion for 2026. ➁ The wafer fab equipment (WFE) segment is expected to grow 5.4% to $101 billion in 2024, driven by DRAM, HBM, and China. ➂ Back-end equipment sales are projected to surge, with test equipment sales increasing 14.7% in 2025 and 18.6% in 2026.
12/09/2024, 10:12 PM UTC
具 有平坦线绕组的屏蔽功率电感器特点：低DCR与扁平外形Shielded Power Inductors Feature Low DCR with Flat Wire
➀ 欧姆龙推出了一系列新型低矮式屏蔽功率电感器；➁ 这些电感器采用平坦线绕组，提高了效率并减小了尺寸；➂ 改进的设计有助于整体性能的提升。➀ Bourns introduces a new series of low-profile shielded power inductors; ➁ The inductors use flat wire windings for enhanced efficiency and reduced size; ➂ The improved design contributes to better overall performance.
12/09/2024, 03:51 PM UTC
英特尔Arc B580在早期基准测试中与RTX 4060和RX 7600交锋 —— B580在OpenCL和Vulkan工作负载中比A580快30%Intel Arc B580 trades blows with the RTX 4060 and RX 7600 in early benchmarks — B580 beats A580 by up to 30% in OpenCL and Vulkan workloads
➀ 英特尔Arc B580在早期基准测试中比其前代产品A580快30%以上；➁ 基准测试在OpenCL和Vulkan API上完成；➂ Arc B580的价格低于RTX 4060，但性能快10%。➀ Intel's Arc B580 outperforms its predecessor, A580, by up to 30% in early benchmarks; ➁ The benchmarks were conducted across the OpenCL and Vulkan APIs; ➂ The Arc B580 is 10% faster than the RTX 4060 at a lower price point.
12/09/2024, 11:21 AM UTC
莫里斯·张谈英特尔、Gelsinger和三星Morris Chang on Intel, Gelsinger and Samsung
➀ 莫里斯·张对英特尔寻找新战略和CEO表示评论，并表达了他对Gelsinger对台积电态度的看法。 ➁ 张讨论了三星的技术挑战和韩国的政治动荡。 ➂ 他回答了有关英特尔咨询请求的问题，以及Gelsinger的言论导致台积电取消对英特尔的折扣。➀ Morris Chang comments on Intel's search for a new strategy and CEO, expressing his views on Pat Gelsinger's attitude towards TSMC. ➁ Chang discusses Samsung's technological challenges and South Korea's political turmoil. ➂ He addresses questions about Intel's consultancy requests and TSMC's cancellation of a discount for Intel due to Gelsinger's remarks.
12/09/2024, 09:27 AM UTC
芯片切片市场预计到2035年将达到4110亿美元Chiplet Market set to Reach $411 Billion by 2035
➀ 家研智库的新报告预测，芯片切片市场到2035年将达到4110亿美元；➁ 该技术通过模块化和高效的SoC设计替代品，正在变革半导体行业；➂ 报告强调了芯片切片技术的变革潜力。➀ HomeResearch's new report predicts the chiplet market will grow to $411 billion by 2035; ➁ The technology is revolutionizing the semiconductor industry with modular and efficient SoC design alternatives; ➂ The report highlights the transformative potential of chiplet technology.
12/09/2024, 09:15 AM UTC
SkyWater宣布拟议的CHIPS资金，以增强国内半导体生产和能力SkyWater Announces Proposed CHIPS Funding to Enhance Domestic Semiconductor Production and Capabilities
➀ SkyWater Technology与CHIPS for America计划签署了初步备忘录；➁ 该备忘录价值高达1600万美元；➂ 拟议的资金旨在增强国内半导体生产和能力。➀ SkyWater Technology has signed a PMT with the CHIPS for America program; ➁ The PMT is valued at up to $16 million; ➂ The proposed funding aims to enhance domestic semiconductor production and capabilities.
12/09/2024, 06:33 AM UTC
深度解读：拜登绝唱版芯片制裁方案的重点In-Depth Analysis: The Key Points of Biden's Final Chip Sanctions Plan
<p>➀ 美国商务部已对设备、软件以及HBM实施新的管制，将140家中国半导体企业列入“实体名单”。</p><p>➁ 此次制裁是历次制裁的集大成者，用美国商务部长雷门多的话说，“集创新与全面于一体”。</p><p>➂ 制裁细则包括限制美国、日本、欧洲之外区域的关键设备、芯片或技术的转移，以及将半导体相关软件及“软件秘钥”列入限制。</p><p>➀ The U.S. Department of Commerce has imposed new restrictions on equipment, software, and HBM, listing 140 Chinese semiconductor companies on the 'Entity List'.</p><p>➁ The sanctions are a culmination of previous measures, with the U.S. Commerce Secretary describing it as 'comprehensive and innovative'.</p><p>➂ The details of the sanctions include restrictions on the transfer of key equipment, chips, or technology outside of the U.S., Japan, and Europe, and the inclusion of semiconductor-related software and 'software keys' in the restrictions.</p>
12/09/2024, 06:30 AM UTC
英国原子能署和布里斯托尔大学开发出首枚碳-14钻石电池UKAEA and Bristol University make first carbon-14 diamond battery
➀ 英国原子能署和布里斯托尔大学的研究人员共同开发出世界上首个碳-14钻石电池；➁ 该电池利用放射性同位素碳-14产生，具有数千年的潜在寿命；➂ 该技术可应用于医疗设备和极端环境，提供数十年的连续电源。➀ Scientists and engineers from UKAEA and the University of Bristol have created the world's first carbon-14 diamond battery; ➁ The battery leverages the radioactive isotope carbon-14 to produce a diamond battery with a potential lifespan of thousands of years; ➂ The technology could be used in medical devices and extreme environments, providing continuous power for decades.
12/09/2024, 06:26 AM UTC
10月半导体销售额同比增长22.1%October semi sales up 22.1% y-o-y
➀ 10月半导体销售额同比增长22.1%，环比增长2.8%；➁ 由SIA支持的WSTS行业预测现在预计全球年销售额将同比增长19.0%；➂ 预计2024年的销售额总额为6269亿美元，预计2025年将增长至6972亿美元。➀ October semiconductor sales were up 22.1% year-on-year and 2.8% month-on-month; ➁ A new WSTS industry forecast, endorsed by SIA, now projects annual global sales will increase 19.0% year-to-year; ➂ The forecasted sales total for 2024 is $626.9 billion, with an expected increase to $697.2 billion in 2025.
12/09/2024, 06:02 AM UTC
Farnell年终促销Farnell end-of-year sale
➀ 慧荣科技全球宣布在EMEA地区推出测试与工具（T&T）产品的年终促销活动；➁ 该促销 活动包括广泛测试与工具产品的显著折扣；➂ 促销活动将于2025年1月31日结束。➀ Farnell Global has announced end-of-year offers on Test & Tools (T&T) products across the EMEA; ➁ The sale includes significant discounts on a wide range of T&T products; ➂ The promotional period ends on January 31, 2025.
12/09/2024, 05:42 AM UTC
POET Technologies：在AI数据中心革命中的高风险高回报POET Technologies: High Risk, High Reward In The AI Data Center Revolution
1. POET Technologies股价从1美元飙升至5.13美元，得益于其创新的光学解决方案和AI数据中心网络的潜力；2. 尽管面临财务挑战，POET的资金确保了到2026年的发展空间，潜在股价目标为6美元和7美元；3. 与富士康、立讯精密和三菱的最近合作凸显了POET在半导体领域的增长势头。1. POET Technologies has surged from $1 to $5.13, driven by its innovative optical solutions and potential in AI data center networking; 2. Despite financial challenges, POET's funding ensures runway through 2026, with potential stock targets of $6 and $7; 3. Recent partnerships with Foxconn, Luxshare, and Mitsubishi highlight POET's growing traction in the semiconductor space.
12/09/2024, 02:31 AM UTC
芯片公司，悄然崛起Marvell: The Quiet Rise of a Semiconductor Giant
<p>➀ Marvell在发布2025财年第三季度财报后，市值首次突破1000亿美元；</p><p>➁ Marvell的定制芯片（ASIC）业务是其强劲增长的核心动力之一，过去25年设计了超过2000款定制芯片；</p><p>➂ Marvell的定制AI芯片服务成为其主要收入来源，与重要合作伙伴建立了显著的合作关系，并计划占据数据中心400亿美元定制芯片市场的20%份额；</p><p>➃ Marvell的互联业务快速增长，包括PAM4 SerDes技术和光互连解决方案的进步；</p><p>➄ Marvell的3nm光学DSP和5nm PCIe重定时器产品预计将推动未来的增长；</p><p>➅ Marvell的51.2T以太网交换机Teralynx 10旨在数据中心环境中提供低功耗和高性能；</p><p>➆ Marvell对AI和数据中心技术的关注预计将继续推动增长和市场资本化。</p><p>➀ Marvell's market capitalization surpassed $100 billion for the first time after releasing its Q3 fiscal year 2025 financial results;</p><p>➁ Marvell's ASIC business is a key driver of its growth, with over 2,000 custom chips designed over 25 years;</p><p>➂ Marvell's custom AI chip services are becoming a major revenue source, with significant partnerships and a goal of capturing 20% of the $40 billion custom chip market in data centers;</p><p>➃ Marvell's interconnect business is growing rapidly, with advancements in PAM4 SerDes technology and optical interconnect solutions;</p><p>➄ Marvell's 3nm optical DSP and 5nm PCIe retimer products are set to drive future growth;</p><p>➅ Marvell's 51.2T Ethernet switch, Teralynx 10, is designed for low power and high performance in data center environments;</p><p>➆ Marvell's focus on AI and data center technologies is expected to continue driving growth and market capitalization.</p>
12/08/2024, 06:04 AM UTC
ASML：因其巨大的垄断地位而成为最具买入潜力的股票之一ASML: One Of The Strongest Buys Due To Its Huge Monopoly
1. ASML是全球最重要的公司之一，目前的市盈率与2022年低点相当。2. ASML在半导体行业拥有巨大的垄断地位，这得益于其技术优势、供应链控制和数据。3. 需要考虑的风险包括中国/台湾问题和技术颠覆，但认为收益将远大于风险。1. ASML is a crucial company in the world, trading at a P/E multiple in line with their 2022 lows. 2. ASML has a significant monopoly in the semiconductor industry due to technical advantage, supply chain ownership, and data. 3. There are risks to consider, such as China/Taiwan and technological disruption, but the rewards are believed to outweigh these risks.
12/07/2024, 03:35 PM UTC
博通推出专为AI和HPC设计的巨无霸3.5D XDSiP平台——6000mm²堆叠硅芯片，配备12个HBM模块Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
➀ 博通推出了专为AI和HPC设计的3.5D XDSiP平台；➁ 该平台采用台积电的CoWoS和其他先进封装技术；➂ 平台支持最多6000mm²的3D堆叠硅芯片和12个HBM模块的系统封装，预计2026年推出。➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.
12/06/2024, 04:58 PM UTC
中国对特朗普10%关税提案反制，国内产品降价20%——北京政策将负面影响芯片制造商，包括英伟达和英特尔China fires back at Trump’s 10% tariff proposal with a 20% price cut on domestic products — Beijing's policy will negatively affect chipmakers, including Nvidia and Intel
➀ 中国对特朗普的10%关税提案作出回应，对国内产品降价20%；➁ 北京的政策可能对英伟达和英特尔等芯片制造商产生负面影响；➂ 中国行业协会呼吁减少对美国芯片的依赖。➀ China responds to Trump's 10% tariff proposal with a 20% price cut on domestic products; ➁ Beijing's policy may negatively impact chipmakers such as Nvidia and Intel; ➂ Chinese industry associations call for reduced reliance on American chips.
12/06/2024, 04:20 PM UTC
尽管面临制裁，中国公司仍不愿采用本土芯片——国内解决方案技术落后太多Chinese companies are reportedly reluctant to adopt homegrown chips — domestic solutions are technologically too far behind
➀ 尽管面临美国制裁和中国本土化生产努力，中国公司仍然不愿意采用本土芯片；➁ 这种犹豫源于技术限制、可靠的外国替代品可用性以及缺乏政府要求；➂ AI和高性能计算领域尤其具有挑战性，对先进技术的访问受限，本土替代品在竞争中难以立足。➀ Despite U.S. sanctions and China's localization efforts, Chinese companies remain reluctant to adopt domestic chips; ➁ The reluctance stems from technological limitations, availability of reliable foreign alternatives, and lack of government requirements; ➂ AI and HPC sectors are particularly challenging, with limited access to advanced technologies and domestic alternatives struggling to compete.
12/06/2024, 11:55 AM UTC
全球晶圆厂获得950万美元联邦资金，推进GaN芯片制造GlobalFoundries GaN Chip Manufacturing Advances with $9.5 Million U.S. Federal Funding
➀ 全球晶圆厂获得950万美元联邦资金；➁ 资金用于 硅基氮化镓半导体制造；➂ 目标是接近大规模生产氮化镓芯片。➀ GlobalFoundries receives $9.5 million in federal funding; ➁ The funding is for GaN on silicon semiconductor manufacturing; ➂ The goal is to move closer to large-scale production of GaN chips.
12/06/2024, 11:51 AM UTC
全球半导体销售额在2024年10月同比增长22.1%；预计2024年全年销售额将增长19.0%Global Semiconductor Sales Increase 22.1% Year-to-Year in October; Annual Sales Projected to Increase 19.0% in 2024
➀ 2024年10月，全球半导体销售额达到599亿美元，同比增长22.1%；➁ 预计2024年全年销售额将增长19.0%；➂ 该月度销售额数据由世界半导体贸易统计编制。➀ Global semiconductor sales reached $56.9 billion in October 2024, a year-on-year increase of 22.1%; ➁ The annual sales projection for 2024 is an increase of 19.0%; ➂ Monthly sales data is compiled by the World Semiconductor Trade Statistics.
12/06/2024, 08:03 AM UTC
EV Group宣布扩大管理团队以应对持续增长EV Group Announces Management Board Expansion In Light Of Unabated Growth
➀ EV Group宣布扩大管理团队，以进一步增强在半导体行业的地位。➁ Alexander Rank担任执行企业职能总监，负责财务、采购和人力资源。➂ EV Group近年来持续增长，持续投资于研发和生产能力，并最近开设了其制造VI工厂。➀ EV Group announced the expansion of its management board to further strengthen its position in the semiconductor industry. ➁ Alexander Rank joins as Executive Corporate Functions Director, responsible for finance, purchasing, and human resources. ➂ EVG has seen consistent growth, investing in development and production capacities, and has recently opened its Manufacturing VI facility.
12/06/2024, 06:23 AM UTC
2024年第三季度晶圆厂收入增长27%：AI需求推动行业增长，成熟节点竞争加剧Q3 foundry revenues up 27% y-o-y
➀ 2024年第三季度晶圆厂收入同比增长27%，主要得益于强劲的AI需求和中国的复苏；➁ 台积电表现超出预期，先进节点利用率高；➂ 非AI半 导体复苏缓慢，预计到2025年成熟节点晶圆厂竞争将加剧。➀ The foundry revenue grew 27% YoY and 11% QoQ in Q3 2024, driven by strong AI demand and China's recovery; ➁ TSMC's performance exceeded expectations with high utilization rates at leading-edge nodes; ➃ The recovery of non-AI semiconductors remained slow, and mature-node foundry competition is expected to intensify in 2025.
12/05/2024, 04:00 PM UTC
台积电限制导致中国芯片设计公司裁员：7nm节点访问受限可能让150名员工失业Jobs eviscerated at Chinese Arm chip design firm in wake of restrictions from TSMC — lack of access to 7nm node could cause 150 employees to be laid off
➀ 中国服务器CPU设计公司宏芯微电子可能因台积电对7nm节点访问的限制而裁员至一半；➁ 这次裁员是台积电决定切断中国半导体公司对其先进节点（包括从7nm到即将推出的2nm工艺）的访问的结果；➂ 这一情况凸显了在国际贸易紧张和出口管制背景下，中国芯片设计者面临的挑战。➀ Hongjun Microelectronics, a Chinese server CPU designer, may lay off up to half of its workforce due to restrictions from TSMC on access to the 7nm node; ➁ The layoffs are a result of TSMC's decision to cut off Chinese semiconductor companies from its advanced nodes, which includes the 7nm to 2nm process; ➂ The situation highlights the challenges faced by Chinese chip designers in the wake of international trade tensions and export controls.
12/05/2024, 03:37 PM UTC
科学家研发出世界上首个碳-14钻石电池，使用寿命可达5000年——该设备通过放射性衰变产生低功率Scientists develop the world’s first carbon-14 diamond battery, offering a 5,000-year lifespan — the device uses radioactive decay to generate low power levels
➀ 科学家研发出世界上首个碳-14钻石电池；➁ 电池的潜在使用寿命可达5000年；➂ 该技术可以使设备无需更换电池即可使用数千年。➀ Scientists have developed the world's first carbon-14 diamond battery; ➁ The battery has a potential lifespan of 5,000 years; ➂ The technology could power devices for thousands of years without replacement.
12/05/2024, 10:01 AM UTC
超200亿！新增5个SiC相关项目进展Over 200B Investment in 5 New SiC Projects
<p>➀ 最近宣布了5个新的碳化硅相关项目，投资总额超过2000亿元人民币；</p><p>➁ 印度Tarq半导体和HCL的Vama Sundari Investments将投资276.5亿 元人民币在印度耶伊达地区建设两家半导体制造工厂；</p><p>➂ 上海弗昂元科技有限公司将投资1.15亿元人民币建设一个SiC模块封装设备研发生产项目；</p><p>➃ 华芯邦在海南省海口市投资建设SiC芯片先进封装工艺产线；</p><p>➄ Powerex获得了来自美国《芯片与科学法案》的2000万元人民币补助，用于扩建SiC模块等封装产线；</p><p>➅ 贺利氏在江苏省常熟市开业了一家陶瓷基板工厂。</p><p>➀ Five new SiC-related projects have been announced with an investment exceeding 200 billion yuan;</p><p>➁ Tarq Semiconductors and HCL's Vama Sundari Investments are investing 27.65 billion yuan in two semiconductor manufacturing factories in Yeadon, India;</p><p>➂ Shanghai Fuanyuan Technology Co., Ltd. is investing 115 million yuan in a SiC module packaging equipment R&D and production project;</p><p>➃ Huaxin邦 is investing in a SiC chip advanced packaging process line in Haikou, Hainan Province;</p><p>➄ Powerex has received 2 million yuan in subsidies from the U.S. Chips and Science Act to expand SiC module production lines;</p><p>➅ Heraeus has opened a ceramic substrate factory in Changshu, Jiangsu Province.</p>
12/05/2024, 09:39 AM UTC
ICsense入选GlobalFoundries官方设计合作伙伴网络ASIC supplier ICsense selected for GlobalFoundries’ official design partner network
➀ TDK集团子公司ICsense被选为GlobalFoundries的正式设计合作伙伴；➁ 该合作旨在为ASIC供应商提供更便捷的GlobalFoundries半导体代工服务；➂ 此合作属于GlobalFoundries的GlobalSolutions生态系统的一部分。➀ ICsense, a TDK Group Company, has been selected as a formal design partner of GlobalFoundries; ➁ The partnership is aimed at improving access to GlobalFoundries' semiconductor foundry services for ASIC suppliers; ➂ The collaboration is part of GlobalFoundries' GlobalSolutions ecosystem.
12/05/2024, 09:30 AM UTC
先进工艺与中国政策推动2024年第三季度全球前十大晶圆代工营收创历史新高，TrendForce报告显示Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce
➀ TrendForce最新报告显示，2024年第三季度全球前十大晶圆代工营收创下历史新高；➁ 尽管整体经济状况没有显著改善，但新款智能手机和PC/笔记本电脑的发布以及人工智能服务器相关的高性能计算（HPC）的强劲需求推动了收入增长；➂ 报告突出了先进工艺和中国政策对全球市场的影响。➀ TrendForce's latest report indicates a record high for the global top 10 foundry revenue in 3Q24; ➁ Despite the overall economic situation not improving significantly, new smartphone and PC/notebook launches, along with strong demand for AI server-related HPC, contributed to the revenue growth; ➂ The report highlights the impact of advanced processes and Chinese policies on the global market.
12/05/2024, 08:53 AM UTC
首个可编程连接模块First Programmable Connectivity Module
➀ 本文讨论了首个可编程连接模块，这是电子行业的一项重大发展；➁ 可能探讨了其功能和潜在应用；➂ 该模块可能与连接技术方面的进步有关，影响游戏、人工智能和汽车等各个领域。➀ The article discusses the first programmable connectivity module, a significant development in the electronics industry; ➁ It likely explores its features and potential applications; ➂ The module could be related to advancements in connectivity technology, impacting various sectors such as gaming, AI, and automotive.
12/05/2024, 07:24 AM UTC
专为最苛刻AI工作负载打造的3nm互联平台3nm Interconnected Platform For Most Demanding AI Workloads
➀ Marvell推出Ara平台，一款3nm、1.6Tbps PAM4互连解决方案，用于满足AI带宽需求；➁ 该平台面向数据中心、云提供商和AI企业设计，旨在通过可扩展、高性能的解决方案提升AI基础设施；➂ Ara平台采用先进的3nm技术降低功耗，非常适合扩展AI应用和大规模计算。➀ Marvell introduces the Ara platform, a 3nm, 1.6Tbps PAM4 interconnect solution for AI bandwidth demand; ➁ The platform is designed for data centers, cloud providers, and AI enterprises, aiming to enhance AI infrastructure with scalable, high-performance solutions; ➂ The Ara platform uses advanced 3nm technology to reduce power consumption, making it ideal for scaling AI applications and large-scale computing.
12/05/2024, 02:34 AM UTC
台积电2nm吊打对手的武器TSMC's 2nm Technology Dominates Rivals with Its Weapons
<p>➀ 文章讨论了英特尔18A工艺和台积电N2工艺的SRAM密度，突出了台积电N2在SRAM密度和GAA技术方面的优势。</p><p>➁ 预计台积电的2nm工艺将在2025年推出，包括关键技术如GAA晶体管和背面电源供应网络。</p><p>➂ 制造2nm技术的挑战，包括GAA晶体管的复杂性和对极紫外光(EUV)工具的依赖，也被提及。</p><p>➀ The article discusses the SRAM density of Intel's 18A process and TSMC's N2 process, highlighting the advantages of TSMC's N2 in terms of SRAM density and GAA technology.</p><p>➁ TSMC's 2nm process is expected to be introduced in 2025, with key technologies including GAA transistors and backside power supply networks.</p><p>➂ The challenges of manufacturing 2nm technology, including the complexity of GAA transistors and the dependency on EUV tools, are also addressed.</p>
12/04/2024, 01:44 PM UTC
又一巨头大裁员！Another Major Corporation Lays Off Thousands!
<p>➀ 半导体制造商Analog Devices（ADI）在2024年全球和本地均进行了裁员，涉及数千人。</p><p>➁ 截至2024年11月2日，ADI拥有约24000名员工，比2023年10月28日的全球员工数量减少了2000人，降幅约为8%。</p><p>➂ ADI公布第四季度营收为24.43亿美元，2024财年营收为94.3亿美元，较上年同期下降23%。公司预计2025财年第一季度营收为23.5亿美元。</p><p>➀ Analog Devices (ADI), a semiconductor manufacturer based in Massachusetts, has laid off thousands of employees globally and locally in 2024.</p><p>➁ As of November 2, 2024, ADI had approximately 24,000 employees, a decrease of 2,000 from the previous global employee count as of October 28, 2023, representing an 8% decrease.</p><p>➂ ADI's revenue for the fourth quarter was $2.443 billion, and for the fiscal year 2024, it was $9.43 billion, down 23% from the previous year. ADI expects revenue of $2.35 billion for the first quarter of fiscal year 2025.</p>
12/04/2024, 01:43 PM UTC
合肥50亿半导体项目停止：毫无希望重启Hefei's 5 Billion Yuan Semiconductor Project Halted: No Hope of Resumption
<p>➀ 合肥12英寸MEMS制造线项目，初始投资51亿元，因外部因素已暂停。</p><p>➁ 该项目最初为框架协议，尚未建设或启动，不会影响公司。</p><p>➂ 目前没有重启项目的希望。</p><p>➀ Hefei's 12-inch MEMS manufacturing line project, with an initial investment of 5.1 billion yuan, has been halted due to external factors.</p><p>➁ The project was initially a framework agreement and has not yet been constructed or launched, and it will not affect the company.</p><p>➂ There is currently no hope of restarting the project.</p>
12/04/2024, 11:22 AM UTC
VSMC在新加坡举行300mm晶圆厂奠基仪式VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
➀ VSMC，由联华电子股份有限公司和恩智浦半导体公司合资成立，在新加坡举行了其新300mm晶圆制造工厂的奠基仪式；➁ 该工厂位于新加坡淡滨尼；➂ 该合资企业成立于2024年9月。➀ VSMC, a joint venture between Vanguard International Semiconductor Corporation and NXP Semiconductors, held a groundbreaking ceremony for its new 300mm wafer manufacturing facility in Singapore; ➁ The facility is located in Tampines, Singapore; ➂ The joint venture was formed in September 2024.
12/04/2024, 09:00 AM UTC
虚拟现实半导体制造培训设施：英国联盟打造500,000英镑资助项目Virtual reality semiconductor fabrication training facility
➀ 英国联盟获得50万英镑的Innovate UK资助，建立虚拟现实半导体制造培训设施（VRSFT）；➁ 该设施利用虚拟现实和增强现实技术培训半导体行业员工，解决对专家的需求增长；➂ VRSFT将提供一个现代制造设施的沉浸式虚拟模型，让学员能够与真实的设备和流程进行交互。➀ A UK consortium is establishing the Virtual Reality Semiconductor Fabrication Training Facility (VRSFT) with a £500,000 Innovate UK grant; ➁ The facility aims to train staff in the semiconductor industry with virtual reality and augmented reality, addressing the growing demand for experts; ➂ VRSFT will provide an immersive virtual model of a modern fabrication facility, allowing trainees to interact with realistic representations of equipment and processes.
12/04/2024, 06:18 AM UTC
X-FAB提供110nm BCD-on-SOI上的闪存IP和EEPROMX-FAB supplying Flash IP + EEPROM on 110nm BCD-on-SOI
➀ X-FAB在其110nm BCD-on-SOI平台上提供32kByte容量的SONOS嵌入式闪存IP；➁ 该IP包括额外的4kbit EEPROM；➂ 该解决方案旨在用于汽车、医疗和工业应用。➀ X-FAB is supplying 32kByte capacity SONOS embedded Flash IP on its 110nm BCD-on-SOI platform; ➁ The IP includes an additional 4kbit EEPROM; ➂ The solution is designed for automotive, medical, and industrial applications.
12/04/2024, 06:06 AM UTC
3nm 1.6Tbps PAM4互连平台，带200 Gbps电光接口，Marvell将于2025年第一季度首次提供样品3nm 1.6Tbps PAM4 interconnect platform with 200 Gbps electrical and optical interfaces
➀ Marvell将于2025年第一季度推出名为Ara的3nm 1.6Tbps PAM4互连平台样品；➁ Ara支持每通道200 Gbps，并集成了高摆幅激光驱动器以提高性能；➂ 该平台提供增强的交叉开关功能，并支持InfiniBand和以太网，以实现灵活的互连。➀ Marvell will sample a 3nm 1.6 Tbps PAM4 interconnect platform named Ara in Q1 2025; ➁ Ara supports 200 Gbps per channel and includes a high-swing laser driver for performance improvement; ➂ The platform offers enhanced crossbar switching capabilities and supports InfiniBand and Ethernet for versatile interconnect flexibility.
12/04/2024, 06:00 AM UTC
VSMC在新加坡庆祝300mm晶圆厂奠基仪式VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
1. VSMC，由Vanguard International Semiconductor Corporation和NXP Semiconductors合资成立，在新加坡庆祝其新的300mm晶圆制造工厂的奠基仪式。2. 该工厂预计将于2027年开始生产，到2029年每月产量将达到55,000片300mm晶圆。3. 新工厂将支持NXP的增长计划，并为半导体产业的发展做出贡献。1. VSMC, a joint venture between Vanguard International Semiconductor Corporation and NXP Semiconductors, celebrated the groundbreaking of its new 300mm wafer manufacturing facility in Singapore. 2. The facility is expected to start production in 2027 and reach an output of 55,000 300mm wafers per month by 2029. 3. The new fab will support NXP's growth plans and contribute to the development of the semiconductor industry.
12/03/2024, 12:34 PM UTC
台积电工程师吹嘘近期2nm产率提升6%，为顾客节省数十亿美元TSMC engineer boasts of recent 6% boost to 2nm yields, passing 'billions in savings' to customers
➀ 台积电即将开始大规模生产2nm级半导体；➁ 公司测试芯片产率提升6%，为顾客节省数十亿美元；➂ 台积电的N2工艺采用GAA纳米片晶体管，承诺显著降低功耗和提升性能。➀ TSMC is poised to begin mass production of 2nm-class semiconductors; ➁ The company has achieved a 6% increase in yield for test chips, saving billions for customers; ➂ TSMC's N2 process utilizes GAA nanosheet transistors, promising significant power reduction and performance boost.
12/03/2024, 08:47 AM UTC
老CEO离任，新CEO上任——尽管英特尔陷入困境，但仍是物有所值Old CEO Out, 'New CEO' In - Struggling Intel Is A Bargain Nonetheless
1. 英特尔近期面临重大财务挑战，包括暂停分红、推迟工厂建设以及激进的成本削减措施；2. 尽管季度业绩未达预期，管理层仍对到2026年利润率和自由现金流的长远改善持乐观态度；3. 由于财务和战略障碍，高通收购的传言不太可能成真；4. 英特尔股价被低估，尽管短期内波动和悲观情绪，但仍提供了长期投资机会；5. 最近CEO领导层的变动可能预示着公司的新方向。1. Intel faces significant financial challenges with recent struggles including suspended dividends, delayed factory construction, and aggressive cost-cutting measures; 2. Despite quarterly results falling short of expectations, management remains optimistic about long-term improvements in margins and free cash flow by 2026; 3. Rumors of a Qualcomm takeover are unlikely due to financial and strategic hurdles; 4. Intel's stock is undervalued, presenting a long-term buying opportunity despite short-term volatility and pessimistic sentiment; 5. The recent change in CEO leadership may signal a new direction for the company.
12/03/2024, 07:42 AM UTC
HBM需求激增超越供应：为何美光科技是最大受益者HBM Demand Is Surging Past Supply: Why Micron Is The Biggest Beneficiary
1、HBM需求激增，预计从2023年的40亿美元增长到2025年超过250亿美元；2、美光科技2024财年收入同比增长62%，由AI需求驱动；3、行业产能减少和AI需求稳定了周期性市场。1. HBM demand is skyrocketing, projected to grow from $4B in 2023 to over $25B by 2025; 2. Micron's FY2024 revenue rose 62% YoY, driven by AI demand; 3. Reduced industry capacity and AI demand are stabilizing the cyclical market.
12/03/2024, 07:23 AM UTC
威廉·布克纳学院1月开设14个商业工程学士新课程14 New Study Programs in Bachelor of Business Engineering at Wilhelm Büchner Hochschule Starting January
➀ 威廉·布克纳学院将从1月份开始提供14个商业工程学士新课程；➁ 这些课程旨在为在职学生提供各自职业领域的进一步资格；➂ 课程涵盖了车辆技术、信息技术、塑料技术、人工智能、食品、物流、机电、医疗技术和工艺技术等多个主题。➀ Wilhelm Büchner Hochschule will offer 14 new study programs in Business Engineering starting from January; ➁ The programs aim to provide working students with further qualifications in their respective professional fields; ➂ The courses cover various topics such as vehicle technology, informatics, plastics technology, artificial intelligence, food, logistics, mechatronics, medical technology, and process technology.
12/03/2024, 06:22 AM UTC
美国对中国140家涉及技术贸易的公司实施贸易限制US puts China trade restrictions on 140 companies
➀ 美国对中国140家涉及与中国进行技术贸易的公司实施贸易限制，包括中芯国际和华为。 ➁ 同时针对三家中国半导体设备制造商，分别是北京纳睿、ACM Research和Piotech。 ➂ 禁止三星、海力士和美光的产品。 ➃ 这项举措是拜登-哈里斯政府针对中国阻碍先进技术本土化生产的针对性策略的一部分。 ➄ 还建立了新规定，以阻止含有美国组件的产品出口到中国。➀ The US imposes trade restrictions on 140 companies involved in technology trade with China, including SMIC and Huawei. ➁ Three Chinese semiconductor equipment manufacturers are also targeted. ➂ Products from Samsung, Hynix, and Micron are banned. ➃ The move is part of the Biden-Harris administration's targeted approach to hinder China's indigenous production of advanced technologies. ➄ New rules are established to stop the export of products containing US components to China.
12/03/2024, 12:28 AM UTC
美国对中国实施HBM和半导体设备出口管制US Imposes Export Controls on HBM and Semiconductor Equipment to China
<p>➀ 美国政府对中国实施了对高带宽内存（HBM）和半导体设备的出口管制，以防止中国获得人工智能开发的关键组件。</p><p>➁ 美国商务部工业和安全局（BIS）宣布将特定HBM产品添加到受控物品清单中。</p><p>➂ 这些管制适用于内存带宽密度超过每平方毫米每秒2千兆字节的设备。</p><p>➀ The US government has imposed export controls on high-bandwidth memory (HBM) and semiconductor equipment to China to prevent China from acquiring key components for AI development.</p><p>➁ The US Commerce Department's Bureau of Industry and Security (BIS) announced the addition of specific HBM products to the list of controlled items.</p><p>➂ The controls apply to products with memory bandwidth density of over 2 gigabytes per square millimeter per second.</p>
12/02/2024, 11:51 PM UTC
140家中国半导体企业被列入实体清单，影响几何？140 Chinese Semiconductor Companies Added to Entity List: Impact Analysis
<p>➀ 美国商务部工业和安全局（BIS）已将140家中国半导体相关企业列入实体清单。</p><p>➁ 打击重点是国内半导体制造设备厂商，包括北方华创、拓荆科技、盛美上海等。</p><p>➂ 对中国半导体设备行业的影响显著，许多国内领先企业面临制裁，采购美系零部件受到限制。</p><p>➀ The U.S. Department of Commerce's Bureau of Industry and Security (BIS) has added 140 Chinese semiconductor-related companies to the Entity List.</p><p>➁ The focus of the crackdown is on domestic semiconductor manufacturing equipment manufacturers, including North Microelectronics, Top Technology, and Shanghai Shengmei.</p><p>➂ The impact on the Chinese semiconductor equipment industry is significant, with many leading domestic companies facing sanctions and restrictions on procurement of U.S. components.</p>
12/02/2024, 03:15 PM UTC
Marvell在AWS获得大型的多年期多产品胜利Marvell Nabs a Big Multi-Year Multi-Product Win at AWS
➀ 慧荣科技宣布在AWS获得了重要的多年期多产品胜利；➁ 该合同包括定制AI产品、光数字信号处理器（DSP）、主动电气电缆（AEC）DSP、PCIe重定时器、数据中心互连（DCI）光模块和以太网交换硅解决方案；➂ 该合同在业务的不同部分与博通和Aster Labs展开了竞争性胜利。➀ Marvell has announced a significant multi-year and multi-product win at AWS; ➁ The win includes custom AI products, optical digital signal processors (DSPs), active electrical cable (AEC) DSPs, PCIe retimers, data center interconnect (DCI) optical modules, and Ethernet switching silicon solutions; ➂ The deal is a competitive win against Broadcom and Astera Labs in various parts of the business.
