➀ Intel is reportedly targeting a recently retired TSMC executive to lead its key R&D efforts.

➁ Wei-Jen Lo, former TSMC Senior Vice President of Corporate Strategy Development, is rumored to be joining Intel.

➂ Lo's move could have significant implications for TSMC and the Taiwanese semiconductor industry.

➀ AMD's Zen 6 architecture may be delayed until 2027, marking a significant shift from the company's established release rhythm;

➁ The Ryzen 11000 series could face a year-long delay due to changes in TSMC's advanced node production plan;

➂ The N2X process node, central to Zen 6 development, is now expected to be available closer to late 2027 or early 2028;

➃ This delay disrupts AMD's two-year product cadence, potentially creating the longest hiatus between major CPU generations in nearly a decade;

➄ AMD is expected to implement a two-phase strategy to manage the transition, possibly releasing enhanced versions of Zen 5 and delaying the full Zen 6 rollout.

➀ Amid the AI era and geopolitical influence, Taiwan's semiconductor industry remains a global hub.

➁ TSIA's chairman and TSMC's senior vice president discuss strategies to strengthen Taiwan's semiconductor supply chain.

➂ Expansion domestically and bringing in foreign companies are the two main strategies outlined.

➀ Tesla CEO Elon Musk has chosen both Samsung Foundry and TSMC to produce the next-gen AI5 chip for Tesla, a critical component for its latest Autopilot hardware and real-time self-driving signals processing.

➁ The decision, confirmed during a Tesla earnings call, aims to leverage the capacity and optimization of both top-tier U.S. facilities.

➂ The split production deal is a win for both foundries and strengthens the U.S. semiconductor supply chain.

➀ TSMC will begin constructing its 1.4nm fab in Taichung on November 5th, with a $49 billion investment, targeting mass production by H2 2028 and generating up to $15.9 billion in annual revenue;

➁ Due to strong demand for 1.4nm chips (priced at $45k per wafer), TSMC will build four 1.4nm fabs simultaneously, revising initial plans for two 1.4nm and two 1nm fabs;

➂ The move aims to solidify TSMC's process leadership amid competition from Intel's 18A and Samsung's 2nm advancements, with TSMC opting against high-NA EUV tools for cost and maturity reasons.

① China bans Canadian research firm TechInsights, a key entity that revealed Huawei's use of TSMC chips despite U.S. sanctions;

② The ban prohibits Chinese entities from collaborating with TechInsights, citing its role in exposing sensitive tech dependencies of Chinese companies;

③ The move aligns with China's strategic push for semiconductor self-reliance, following TechInsights' reports contradicting Beijing's narrative.

➀ TSMC's September 2025 revenue reached $10.3 billion, a 31.4% year-on-year increase, though declining 1.4% month-on-month;

➁ Q3 2025 revenue totaled $32.47 billion, up 30% year-on-year;

➂ January-September 2025 cumulative revenue rose 36.4% year-on-year to $90.33 billion.

➀ Moore's Law faced collapse in the early 2000s due to planar transistor limitations, including excessive leakage currents and power inefficiency at sub-90nm nodes;

➁ Dr. Chenming Hu invented the 3D FinFET structure, enabling superior electrostatic control and 37-50% efficiency improvements, allowing transistor scaling to 3nm and beyond;

➂ FinFET adoption by Intel (22nm), TSMC (16nm), and Samsung revived Moore's Law, enabling modern AI/5G/HPC chips with densities exceeding 200 million transistors/mm².

➀ Teradyne荣获2025年台积电开放创新平台（OIP）3DFabric测试领域年度合作伙伴，表彰其在多芯片测试方法和CoWoS先进封装技术上的突破；

➁ 双方合作聚焦于UCIe互连和流式扫描测试技术，显著提升3D IC在AI和云计算场景下的测试效率与良率；

➂ 通过TSMC OIP生态系统强化的协同创新模式，加速了异构集成技术在A16/N2工艺节点的商业化进程。

➀ Sofics collaborates with TSMC to provide advanced ESD protection solutions on nodes from 250nm to 2nm, enabling breakthroughs in AI infrastructure and harsh-environment electronics;

➀ Partnering with Celestial AI, Sofics developed low-parasitic ESD IP for photonic interconnects on TSMC 5nm, addressing AI's 'memory wall' with 50-100Gbps bandwidth and radiation-hardened solutions for space applications;

➂ Sofics' 15-year partnership with Magics Technologies delivers radiation-hardened ESD IP for nuclear fusion and aerospace systems, supporting SEE immunity up to 80MeV·cm²/mg.

➀ Taiwan proposes a 'Taiwan Model' strategic alliance to balance domestic chip production with U.S. investments, offering export guarantees and sharing science park expertise;

➁ The U.S. would provide land, visas, and regulatory support, while Taiwan resists relocating 50% of chip manufacturing to America and seeks expanded tariff exemptions;

➂ TSMC's Arizona expansion highlights both cooperation and U.S. concerns over Taiwan's proximity to China amid geopolitical tensions.

➀ An AI-generated video shows OpenAI CEO Sam Altman "stealing" a GPU from a Target-like store, humorously claiming it's for Sora 2 inference;

➁ Created using OpenAI's new Sora 2 model, the viral clip highlights the tool's realism and the company's pivot to a TikTok-like social platform for AI content;

➂ The video underscores growing concerns about AI's potential to blur reality and the urgent need for content authenticity verification in the AI era.

➀ Synopsys and TSMC enhance collaboration to develop AI-driven multi-die systems using advanced EDA tools and TSMC's N2P/A16制程 and 3D stacking technologies;

➁ Synopsys' 3DIC Compiler platform enables automated 3D IC design for TSMC's SoIC-X and CoWoS封装技术, achieving multiple customer tape-outs;

➂ Integrated IP solutions (HBM4、UCIe) and photonic engines optimize performance for AI data centers and automotive applications, breaking Moore's Law limitations.

➀ Synopsys certifies Ansys tools for TSMC's N3C/N3P/N2P/A16 processes, enabling precise design validation for AI and HPC applications;

➁ The collaboration introduces AI-driven photonic design flow for TSMC's COUPE™ platform, reducing design cycles by 50%;

➂ Joint development of multiphysics analysis tools enhances thermal and signal integrity in 3DIC systems for 5G/6G infrastructure.

❶ Samsung slashed its 2nm wafer price to $20,000, undercutting TSMC's $30,000 by 33% to attract clients amid fierce foundry competition.

❷ Despite cutting investments and delaying Texas fab projects, Samsung secured a $16.5B deal with Tesla for AI chip production, boosting its advanced fab capabilities.

❸ TSMC maintains market dominance with 15 major clients for 2nm nodes, including Intel and NVIDIA, leveraging its full-capacity production and premium pricing strategy.

➀ TSMC has secured 15 customers for its 2nm N2 process, with Apple reserving half of the initial capacity;

➁ NVIDIA plans a $500M investment in UK self-driving startup Wayve Technologies, enhancing AI-driven autonomous vehicles;

➂ Imec achieves breakthroughs in high-NA EUV lithography, enabling 20nm pitch structures for advanced semiconductors

➀ Global semiconductor equipment spending reached $33.07 billion in Q2 2025, up 23% YoY, with China ($11.36B) leading but declining 7%, while Taiwan ($8.77B, +125%) surged driven by TSMC;

➁ U.S. fab projects face delays (Intel, Micron, Samsung), contributing to North America's 41% QoQ spending drop;

➂ 2025 global Capex is projected at $160B (+3% YoY), with mixed 2026 forecasts: Intel plans cuts, Micron and TSMC (predicted $45B in 2026) eye expansions amid CHIPS Act policy shifts under Trump's administration.