➀ A YouTube video by 'High Yield' provides a clear analysis of AMD's advanced Strix Halo triple-die processor using chiplet technology;

➁ The 24-minute video explains AMD's innovation in chiplet design and its significance in processor development;

➂ Chiplet technology is rapidly evolving, highlighted by AMD's approach to improving performance and integration.

➀ Zhaoxin unveils KH-50000 server CPUs with 96 cores using chiplet design, matching AMD's 96-core EPYC architecture;

➁ Supports up to 384 cores in 4S configurations, 12-channel DDR5-5200 memory, and PCIe 5.0 lanes, marking China’s progress in chiplet-based solutions;

➂ Designed for China’s domestic market with enhanced security protocols but lacks power efficiency details amid geopolitical challenges.

➀ Alphawave Semi taped out a 64Gbps UCIe D2D IP subsystem on TSMC's 3nm technology, doubling bandwidth density and enabling chiplet-based architectures for AI and datacenters;

➁ The solution supports Co-Packaged Optics (CPO) and offers 8x higher bandwidth density than conventional interfaces, with advanced reliability features like per-lane health monitoring;

➂ Collaboration with TSMC highlights a focus on high-performance, energy-efficient computing, strengthening Alphawave's AI platform for scalable systems.

➀ Anthony Paul Bellezza developed two solderless interconnect processes for advanced ICs, addressing challenges with traditional soldering;

➁ The fusion-based method uses low-temperature bonding (200-400°C) and martensitic substrates to create durable, ultra-low-resistance interconnects with environmental benefits;

➂ A secondary 2D graphene deposition process offers CMOS compatibility but is less durable, making it suitable for consumer electronics requiring frequent upgrades.

➀ Intel's Foveros 2.5D uses 3D die stacking with a 36μm microbump pitch for high-density chiplet integration;

➁ The technology reduces latency by 50% vs traditional packaging and aligns with UCIe for multi-vendor interoperability;

➂ Variants like Foveros-S/R/B enable tailored solutions from HPC to cost-sensitive IoT applications

➀ Researchers at the University of Illinois Urbana-Champaign developed a modular quantum architecture that connects components like Lego bricks using coaxial cables;

➁ The system achieved 99% fidelity in SWAP gates, enabling scalable quantum computing with minimal signal loss;

➂ Modular design offers flexibility for upgrades, fault isolation, and reconfiguration without rebuilding entire processors.

➀ TSMC doubled its Arizona internship program to over 200 students, targeting talent for its advanced 4nm and future 2nm fabs;

➀ The U.S. government's $6.6B CHIPS Act supports TSMC’s third Arizona fab, aiming to create 6,000 jobs and onshore advanced chip production;

➂ Partnerships with ASU, Amkor’s $2B packaging facility, and state-funded apprenticeships strengthen the U.S. semiconductor ecosystem.

➀ Marvell Technology introduces a 64Gbit/s bi-directional die-to-die interconnect for xPUs on 2nm and 3nm processes;

➁ The interface achieves over 30Tbit/s/mm bandwidth density, exceeding UCIe by 3x, with adaptive power management reducing consumption by up to 75%;

➂ Features include redundant lanes, automatic repair, and a complete stack spanning application bridge, link layers, and physical interconnect.

➀ Chiplet-based SoCs offer increased yield, design flexibility, and simplified assembly compared to traditional monolithic SoCs；

➁ UK patent enforcement becomes complex for chiplet-based designs, as individual chiplets may not directly infringe all patent claims；

➂ Drafting patents to cover individual chiplets rather than entire systems is advised for stronger IP protection.

➀ Researchers at Chemnitz University of Technology developed millimeter-sized Smartlet microrobots with integrated electronics, sensors, and optocommunication, enabling autonomous movement and coordination in aqueous environments;

➀ The microrobots use an origami-inspired manufacturing approach to self-fold into 3D structures, powered by photovoltaics and controlled by embedded silicon chiplets, achieving decentralized control without external systems;

➀ Potential applications include environmental monitoring, medical diagnostics, and adaptive robotic systems, with future goals to expand sensory capabilities and evolve toward collective, organism-like behaviors.

➀ Dutch edge AI chip developer Axelera AI is seeking €150 million to advance its AI chiplet technology, targeting applications in robotics, automotive, and datacenters by 2028;

➁ The EU has supported Axelera with grants (€68 million) and investments, emphasizing its role in building Europe’s sovereign AI industry and reducing dependency on foreign chips;

➂ Axelera’s upcoming Titania chiplet utilizes proprietary Digital In-Memory Computing (D-IMC) and RISC-V architecture, with CEO Del Maffeo highlighting talent acquisition and competitive company culture as key drivers.

➀ The 2026 IEEE ECTC, a major semiconductor packaging industry event, will be held in Orlando, FL, from May 26-29, 2026, attracting over 2,000 participants worldwide;

➁ The conference will focus on cutting-edge topics like heterogeneous integration, chiplet architectures, hybrid bonding, 5G, quantum computing, and advanced packaging technologies;

➂ Submissions are invited for unpublished, non-commercial research in areas including reliability, manufacturing, material processing, and photonics.

➀ Chiplets enable modular integration of multiple silicon dies, improving compute performance and reducing manufacturing costs for complex SoCs and processors;

➁ They support heterogeneous design flexibility by combining different process nodes and materials to optimize power, performance, and area;

➂ Chiplet architectures address semiconductor scaling challenges while meeting demands for AI, HPC, and advanced packaging solutions.

➀ Cadence's 'SoC Cockpit' automation flow addresses chiplet and SoC design challenges through standardized processes and tools;

➀ The framework integrates executable specifications, IP libraries, AI-driven verification, and multi-phase design automation (RTL to GDS II);

➂ Adoption of UCIe, Arm CSA, and AMBA C2C standards accelerates time-to-market for heterogeneous multi-die systems.

➀ Agentic AI's integration into semiconductor workflows accelerates design tasks but introduces risks of opaque decision-making and unintended behaviors;

➀ Security concerns arise from compromised hardware and lack of transparency tools for engineers, necessitating rigorous output validation;

➂ EDA vendors are implementing containment strategies like restricted access and predictable AI modules to mitigate risks in advanced chip designs.

➀ Objective Analysis' Jim Handy analyzes the growth trajectory of the chiplet market, highlighting its current state and future potential;

➁ The article discusses how chiplets address semiconductor scaling challenges through modular designs and heterogenous integration, enabling cost-effective solutions for advanced nodes;

➂ Key focus areas include 3D IC packaging advancements, ecosystem collaboration, and market adoption across AI, HPC, and consumer electronics.

➀ The UCIe 3.0 specification doubles data transfer rates to 64GT/s for chiplet-based designs, significantly improving bandwidth density and enabling faster interconnects for 2D/2.5D packaging;

➁ Introduces new features like continuous transmission protocols, enhanced runtime recalibration, and L2 exit handshake to optimize power efficiency and link reliability;

➂ UCIe 3.0 lays the foundation for future chiplet ecosystems, with commercial products expected around 2026-2028 as adoption by major semiconductor companies accelerates.

➀ Arm introduced its Chiplet System Architecture to address key challenges in chip design;

➁ The architecture leverages the Neoverse Compute Subsystem and AMBA interconnect technology;

➂ Aims to enhance scalability and efficiency for complex system integration in advanced computing applications.

➀ Indium Corporation introduced WS-910, a water-soluble flip-chip flux designed for next-gen semiconductor packaging to address complex assembly challenges;

➁ The flux enables residue-free cleaning with room-temperature deionized water and maintains stability for large dies during reflow processes;

➂ It supports Pb-free applications, high-Sn solders, and high-I/O designs, offering compatibility with various ultrafiltration systems.

➀ Brian Rea from the UCIe Consortium introduces the Universal Chiplet Interconnect Express (UCIe) standard;

➁ UCIe aims to create an open ecosystem for chiplets at the package level, enabling modular chip design;

➂ The standard focuses on interoperability and scalability to advance heterogeneous integration in semiconductor packaging.