Recent #HPC news in the semiconductor industry
12/24/2024, 02:00 PM UTC
如果我是英特尔CEO，我会怎么做？What would you do if you were the CEO of Intel?
➀ 英特尔在技术宣布中转向更加透明的策略；➁ 英特尔PowerVia与台积电Super Power Rail之间的竞争；➂ 安迪·格鲁夫保持‘适度忧虑’的哲学。➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
12/23/2024, 12:56 PM UTC
Arm与高通诉讼的后果The Fall-Out From Arm vs Qualcomm
➀ Arm在与高通的诉讼中未能获得禁止高通使用Nuvia设计的基于Arm的核心的裁决；➁ 陪审团未能就Nuvia是否违反了与Arm的许可条款达成一致，Arm有机会就此问题进行重审；➂ 高通律师出示了一份Arm首席执行官撰写的策略文件，其中提出了Arm自行制造芯片的设想，这可能标志着Arm业务模式的重大转变。➀ Arm在诉讼中未能获得其最想要的结果，即禁止高通在PC芯片组中使用Nuvia设计的基于Arm的核心；➁ 虽然陪审团未能就Nuvia是否违反了与Arm的许可条款达成一致意见，但Arm有机会进行重审；➂ 高通律师出示了一份由Arm首席执行官撰写的策略文件，其中设想Arm建造自己的芯片，这可能是Arm业务模式的一个重大转变。
12/23/2024, 01:02 AM UTC
埃德嗅到欧洲的机会Ed Sniffs Euro-Wonga
➀ 埃德认为欧盟的‘ECS经纪’是一个鼓励英国技术人才获取欧洲资金的方法；➁ 他已经说服部门为研究人员、发明家、初创企业和中小企业参加这些活动提供预算；➂ 他正在探索斯肯索普量子利用欧洲发展基金的机会。➀ Ed sees the EU's 'ECS Brokerage' as a way to encourage UK techies to access European funds; ➁ He has convinced the Department to allocate a budget for researchers, inventors, startups, and SMEs to attend these events; ➂ He is exploring opportunities for Scunthorpe Quantum to benefit from European development funds.
12/19/2024, 08:39 PM UTC
CXL技术终于在2025年到来CXL is Finally Coming in 2025
➀ 计算表达式链接（CXL）技术预计将在2025年从利基市场转向主流应用；➁ CXL对内存扩展的支持是主要驱动力，现在有各种服务器和内存解决方案可用；➂ CXL 2.0和未来的PCIe/CXL版本将实现更高级的应用，如交换和动态内存分配。➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
12/19/2024, 06:00 PM UTC
TSMC在IEDM上展示全球最先进的逻辑技术：2nm平台TSMC Unveils the World’s Most Advanced Logic Technology at IEDM
➀ TSMC在IEDM上发布了其2nm平台技术，具备用于AI、HPC和移动应用的GAA纳米片晶体管。➁ N2技术相比3nm节点在速度和功耗效率方面实现了显著提升。➂ TSMC的N2预计将于2025年下半年开始量产，而增强版N2P则预计于2026年投产。➀ TSMC unveiled its 2nm Platform Technology at IEDM, featuring GAA nanosheet transistors for AI, HPC, and mobile applications. ➁ The N2 technology achieves significant improvements in speed and power efficiency compared to the 3nm node. ➂ TSMC's N2 is scheduled for mass production in 2025, with an enhanced version, N2P, targeted for 2026.
12/17/2024, 02:00 PM UTC
微控制器（MCU）现在正拥抱主流网络互连（NoC）MCUs Are Now Embracing Mainstream NoCs
➀ MCU设计从简单到复杂的转变，需要更复杂的互连技术如NoC；➁ 推动这一变化的因素，包括功耗降低、安全标准支持和多协议支持；➂ 设计的可扩展性重要性以及NoC架构如何支持这一点。➀ The shift in MCU design from simple to complex, requiring more sophisticated interconnects like NoC; ➁ The factors driving this change, including power reduction, safety standards, and support for multiple protocols; ➂ The importance of scalability in design and how NoC architectures can support this.
12/17/2024, 10:57 AM UTC
联电获得高通重要先进封装订单，挑战台积电行业主导地位UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
➀ 联电在先进封装市场取得重大突破；➁ 该合同用于高性能计算（HPC）应用；➂ 这一胜利挑战了台积电在该领域的长期主导地位。➀ UMC announced a significant breakthrough in the advanced packaging market; ➁ The contract is for high-performance computing (HPC) applications; ➂ The win challenges TSMC's long-standing dominance in the sector.
12/16/2024, 12:20 PM UTC
蔡崇信与埃隆·马斯克联手机器人C.C.Wei and Elon Musk hooking up on robots
➀ 蔡崇信与埃隆·马斯克正在合作开发多功能机器人；➁ 马斯克计划于2026年推出名为Optimus的多功能人形机器人；➂ 蔡崇信强调无人机和人工智能在水资源、电力等公用事业领域的应用的重要性。➀ C.C. Wei and Elon Musk are collaborating on multifunctional robots; ➁ Musk plans to launch a multifunctional humanoid robot named Optimus in 2026; ➂ Wei emphasizes the importance of drones and AI applications in utilities such as water and electricity provision.
12/13/2024, 02:15 PM UTC
英国在塑料电子领域的领先地位UK Leads In Plastic Electronics
➀ 英国在塑料电子领域是全球的领导者；➁ 曼德尔森勋爵强调了为行业制定路线图的重要性，以从尖端技术走向大众市场；➂ 斯旺西大学和威尔士印刷与涂覆中心参与开发使用塑料电子的新产品线。➀ The UK has been a global leader in the Plastic Electronics sector; ➁ Lord Mandelson emphasized the importance of a roadmap for the industry to move from cutting-edge to mass market; ➂ Swansea University and the Welsh Centre for Printing and Coating are involved in developing new product lines using plastic electronics.
12/13/2024, 09:18 AM UTC
利用人工智能实现更好的光伏材料Using AI to Achieve Better Photovoltaic Materials
➀ 卡尔鲁厄理工学院的研究人员通过人工智能和高通量合成找到了新的有机分子，以提高钙钛矿太阳能电池的效率。➁ 开发的策略可以应用于其他材料研究领域，如新型电池材料。➂ 该团队使参考太阳能电池的效率提高了2%，达到26.2%。➀ Researchers at KIT have found new organic molecules to improve the efficiency of perovskite solar cells with the help of AI and high-throughput synthesis. ➁ The strategy developed can be applied to other areas of material research, such as new battery materials. ➂ The team achieved a two percent efficiency increase for a reference solar cell, reaching 26.2 percent.
12/12/2024, 02:00 PM UTC
寓言：牛仔CEO的故事Fable: The Cowboy CEO
➀ 这位CEO以他的十加仑帽子和牛仔靴闻名，创立的公司收购了60多家电信公司，市值一度高达1860亿美元。➁ 在一个季度亏损的情况下，公司报告了138亿美元的净利润。➂ 他从公司借款4.08亿美元来弥补保证金调用，最终违约，并在监狱中度过了13年。➀ The CEO, known for his ten gallon hats and cowboy boots, founded a company that acquired over 60 telecoms companies and had a peak market cap of $186 billion. ➁ In one quarter with a loss, the company reported a net profit of $1.38 billion. ➂ He borrowed $408 million from the company to cover margin calls and defaulted on the debt, spending 13 years in jail.
12/12/2024, 12:35 PM UTC
Synopsys发布Ultra Ethernet和UALink IP，为下一代AI数据中心提供动力Synopsys announces Ultra Ethernet and UALink IP to power the next-generation of AI datacenters
➀ 慧荣科技宣布推出Ultra Ethernet和UALink IP，用于下一代AI数据中心；➁ 这些IP支持高速连接和智能多路径；➂ 预计这些技术将于2025年推出。➀ Synopsys announces Ultra Ethernet and UALink IP for next-generation AI datacenters; ➁ The IPs support high-speed connectivity and intelligent multipathing; ➂ The technologies are expected to be launched in 2025.
12/11/2024, 10:07 AM UTC
MosChip为C-DAC的HPC处理器“AUM”选择Cadence 5nm EDA工具MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
➀ 慧荣科技选择Cadence的5nm EDA工具设计C-DAC的HPC处理器“AUM”；➁ 慧荣科技是印度首家公开上市的无厂半导体公司，拥有超过25年设计产品和SoC的经验；➂ 合作旨在利用Cadence的先进工具开发高性能计算解决方案。➀ MosChip selects Cadence's 5nm EDA tools for designing the HPC processor 'AUM' for C-DAC; ➁ MosChip is the first publicly traded fabless semiconductor company in India with over 25 years of experience in designing products and SoCs; ➂ The collaboration aims to leverage Cadence's advanced tools for the development of high-performance computing solutions.
12/09/2024, 03:51 PM UTC
英特尔Arc B580在早期基准测试中与RTX 4060和RX 7600交锋 —— B580在OpenCL和Vulkan工作负载中比A580快30%Intel Arc B580 trades blows with the RTX 4060 and RX 7600 in early benchmarks — B580 beats A580 by up to 30% in OpenCL and Vulkan workloads
➀ 英特尔Arc B580在早期基准测试中比其前代产品A580快30%以上；➁ 基准测试在OpenCL和Vulkan API上完成；➂ Arc B580的价格低于RTX 4060，但性能快10%。➀ Intel's Arc B580 outperforms its predecessor, A580, by up to 30% in early benchmarks; ➁ The benchmarks were conducted across the OpenCL and Vulkan APIs; ➂ The Arc B580 is 10% faster than the RTX 4060 at a lower price point.
12/09/2024, 06:30 AM UTC
英国原子能署和布里斯托尔大学开发出首枚碳-14钻石电池UKAEA and Bristol University make first carbon-14 diamond battery
➀ 英国原子能署和布里斯托尔大学的研究人员共同开发出世界上首个碳-14钻石电池；➁ 该电池利用放射性同位素碳-14产生，具有数千年的潜在寿命；➂ 该技术可应用于医疗设备和极端环境，提供数十年的连续电源。➀ Scientists and engineers from UKAEA and the University of Bristol have created the world's first carbon-14 diamond battery; ➁ The battery leverages the radioactive isotope carbon-14 to produce a diamond battery with a potential lifespan of thousands of years; ➂ The technology could be used in medical devices and extreme environments, providing continuous power for decades.
12/09/2024, 06:02 AM UTC
Farnell年终促销Farnell end-of-year sale
➀ 慧荣科技全球宣布在EMEA地区推出测试与工具（T&T）产品的年终促销活动；➁ 该促销活动包括广泛测试与工具产品的显著折扣；➂ 促销活动将于2025年1月31日结束。➀ Farnell Global has announced end-of-year offers on Test & Tools (T&T) products across the EMEA; ➁ The sale includes significant discounts on a wide range of T&T products; ➂ The promotional period ends on January 31, 2025.
12/08/2024, 06:00 AM UTC
香港城市大学发现新型电场信号，具有广泛应用潜力：最新研究成果Observation of New Electric Field Signals Strong Potential for Assorted Devices: New Research at City University of Hong Kong
➀ 香港城市大学的研究人员观察到一种新型涡旋电场，该电场有望提高未来电子、磁性和光学设备的能力；➁ 该研究发表在《科学》杂志上，可能带来内存稳定性和计算速度的改进，并影响量子计算、自旋电子学和纳米技术等领域；➂ 研究团队开发了一种创新的冰辅助转移技术，以创建具有广泛扭转角度的扭曲双层，从而发现了可能提高各种设备功能的二维准晶体。➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.
12/07/2024, 03:35 PM UTC
博通推出专为AI和HPC设计的巨无霸3.5D XDSiP平台——6000mm²堆叠硅芯片，配备12个HBM模块Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
➀ 博通推出了专为AI和HPC设计的3.5D XDSiP平台；➁ 该平台采用台积电的CoWoS和其他先进封装技术；➂ 平台支持最多6000mm²的3D堆叠硅芯片和12个HBM模块的系统封装，预计2026年推出。➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.
12/06/2024, 04:20 PM UTC
尽管面临制裁，中国公司仍不愿采用本土芯片——国内解决方案技术落后太多Chinese companies are reportedly reluctant to adopt homegrown chips — domestic solutions are technologically too far behind
➀ 尽管面临美国制裁和中国本土化生产努力，中国公司仍然不愿意采用本土芯片；➁ 这种犹豫源于技术限制、可靠的外国替代品可用性以及缺乏政府要求；➂ AI和高性能计算领域尤其具有挑战性，对先进技术的访问受限，本土替代品在竞争中难以立足。➀ Despite U.S. sanctions and China's localization efforts, Chinese companies remain reluctant to adopt domestic chips; ➁ The reluctance stems from technological limitations, availability of reliable foreign alternatives, and lack of government requirements; ➂ AI and HPC sectors are particularly challenging, with limited access to advanced technologies and domestic alternatives struggling to compete.
12/06/2024, 01:23 PM UTC
被暗杀的联合健康CEO涉嫌使用AI拒绝患病者保险Assassinated UnitedHealthcare CEO allegedly used AI to deny sick people coverage
➀ 一项集体诉讼指控联合健康保险公司使用一个有缺陷的算法拒绝患者保险，由两名现已去世的个人提起。➁ 联合健康保险公司首席执行官布莱恩·汤普森本周在曼哈顿中城被杀，嫌疑人目前仍在逃。➂ 诉讼声称联合健康保险公司促使员工使用一个错误率约为90%的算法来拒绝保险。➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
12/05/2024, 09:30 AM UTC
先进工艺与中国政策推动2024年第三季度全球前十大晶圆代工营收创历史新高，TrendForce报告显示Advanced Processes and Chinese Policies Drive 3Q24 Global Top 10 Foundry Revenue to Record Highs, Says TrendForce
➀ TrendForce最 新报告显示，2024年第三季度全球前十大晶圆代工营收创下历史新高；➁ 尽管整体经济状况没有显著改善，但新款智能手机和PC/笔记本电脑的发布以及人工智能服务器相关的高性能计算（HPC）的强劲需求推动了收入增长；➂ 报告突出了先进工艺和中国政策对全球市场的影响。➀ TrendForce's latest report indicates a record high for the global top 10 foundry revenue in 3Q24; ➁ Despite the overall economic situation not improving significantly, new smartphone and PC/notebook launches, along with strong demand for AI server-related HPC, contributed to the revenue growth; ➂ The report highlights the impact of advanced processes and Chinese policies on the global market.
12/05/2024, 08:53 AM UTC
首个可编程连接模块First Programmable Connectivity Module
➀ 本文讨论了首个可编程连接模块，这是电子行业的一项重大发展；➁ 可能探讨了其功能和潜在应用；➂ 该模块可能与连接技术方面的进步有关，影响游戏、人工智能和汽车等各个领域。➀ The article discusses the first programmable connectivity module, a significant development in the electronics industry; ➁ It likely explores its features and potential applications; ➂ The module could be related to advancements in connectivity technology, impacting various sectors such as gaming, AI, and automotive.
12/04/2024, 02:00 PM UTC
与Ansys和Synopsys的大师班：多芯片设计最新进展A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
➀ 2.5D和3D多芯片设计在主流应用中的兴起；➁ Synopsys和Ansys为多芯片项目提供的全面设计流程；➂ Marc Swinnen和Keith Lanier就技术知识和引人入胜的演示提供的专家见解。➀ The rise of 2.5D and 3D multi-die design in mainstream applications; ➁ Comprehensive design flows provided by Synopsys and Ansys for multi-die projects; ➂ Expert insights from Marc Swinnen and Keith Lanier on technical knowledge and engaging presentation.
12/03/2024, 12:00 PM UTC
英特尔面临的困境Intel’s Dilemma
➀ 英特尔在帕特·格尔辛格的领导下初期承诺雄心勃勃，但执行力度不足；➁ 公司面临着臃肿的员工队伍、风险规避的文化和落后的AI战略等挑战；➂ 英特尔在工艺技术上的投资并未带来显著成果，公司必须对其未来做出艰难的选择。➀ Intel's initial promises under Pat Gelsinger were ambitious but execution has been lacking; ➁ The company faces challenges with a bloated workforce, risk-averse culture, and a lagging AI strategy; ➂ Intel's investments in process technology have not yielded significant results, and the company must make hard choices about its future.
12/03/2024, 07:23 AM UTC
威廉·布克纳学院1月开设14个商业工程学士新课程14 New Study Programs in Bachelor of Business Engineering at Wilhelm Büchner Hochschule Starting January
➀ 威廉·布克纳学院将从1月份开始提供14个商业工程学士新课程；➁ 这些课程旨在为在职学生提供各自职业领域的进一步资格；➂ 课程涵盖了车辆技术、信息技术、塑料技术、人工智能、食品、物流、机电、医疗技术和工艺技术等多个主题。➀ Wilhelm Büchner Hochschule will offer 14 new study programs in Business Engineering starting from January; ➁ The programs aim to provide working students with further qualifications in their respective professional fields; ➂ The courses cover various topics such as vehicle technology, informatics, plastics technology, artificial intelligence, food, logistics, mechatronics, medical technology, and process technology.
12/02/2024, 06:00 PM UTC
Breker如何帮助解决RISC-V认证问题How Breker is Helping to Solve the RISC-V Certification Problem
➀ RISC-V核心的兴起和认证的挑战；➁ Breker验证系统 在认证过程中的作用；➂ 认证RISC-V ISA实现的复杂性以及RISC-V国际组织的努力。➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
12/02/2024, 02:00 PM UTC
Sondrel新任CEO Ollie Jones访谈：专注客户至上，提供定制芯片高质量服务CEO Interview: Ollie Jones of Sondrel
➀ Ollie Jones强调Sondrel以客户为中心，确保在交付定制芯片时提供高质量的个人服务；➁ Sondrel在欧洲和以色列建立强大声誉后，将业务扩展到美国市场；➂ 公司通过为复杂的芯片设计提供定制服务来区分自己。➀ Ollie Jones emphasizes customer focus at Sondrel, ensuring high-quality personal service in custom chip delivery; ➁ Sondrel expands into the American market after establishing a strong reputation in Europe and Israel; ➂ The company differentiates itself by providing tailored services for complex chip designs.
11/23/2024, 10:19 AM UTC
您的免费试用Feed URL已于2024年11月23日星期六到期，请创建新的免费URL或升级订阅计划以获得持久URLYour trial feed URL has expired on Sat Nov 23, 2024
➀ 您的免费试用Feed URL已于2024年11月23日星期六到期；➁ 请免费创建新的URL或升级您的订阅计划；➂ 在<a href="https://www.mysitemapgenerator.com/rss/index.html">MySitemapGenerator.com</a>获取持久URL➀ Your trial feed URL has expired on Sat Nov 23, 2024; ➁ Please create a new one for free or upgrade your subscription plan; ➂ Get a persistent URL at <a href="https://www.mysitemapgenerator.com/rss/index.html">MySitemapGenerator.com</a>
11/19/2024, 02:00 PM UTC
Alchip引领未来3D设计创新之路Alchip is Paving the Way to Future 3D Design Innovation
➀ Alchip在TSMC OIP生态系统论坛上展示；➁ 克服3D IC设计挑战；➂ 与Synopsys和TSMC合作进行3D设计创新➀ Alchip presents at TSMC OIP Ecosystem Forum; ➁ Challenges in 3D IC design overcome; ➂ Collaboration with Synopsys and TSMC for 3D design innovation
11/09/2024, 10:19 AM UTC
中美芯片战持续，中国芯片制造设备支出或将在2025年降至400亿美元以下 | TrendForce 新闻[News] China’s Chipmaking Equipment Spending Likely to Drop below USD 40 Billion in 2025 amid U.S. Tensions | TrendForce News
➀ 美国总统选举的影响以及中美持续的芯片战争可能使中国半导体设备支出在2025年降至400亿美元以下。➁ 预计这一紧张局势将影响全球半导体供应链。➂ 该情况凸显了国内半导体制造能力的重要性。➀ Concerns over the impact of the U.S. presidential election and the ongoing chip war between China and the U.S. are likely to decrease China's semiconductor equipment spending to below USD 40 billion in 2025. ➁ The tension is expected to affect the global semiconductor supply chain. ➃ The situation highlights the importance of domestic semiconductor manufacturing capabilities.
11/08/2024, 04:17 AM UTC
台灣AI伺服器龍頭Quanta計劃在美國增加AI伺服器生產，由於需求狂熱，生產線已預訂至2025年Quanta to boost production of AI servers in the US, booked to 2025 because of 'insane demand'
➀ Quanta計劃由於需求高漲，在美國增加AI伺服器生產；➁ NVIDIA的GB200在台灣和美國進行試產，預計2025年第一季度生產量增加；➂ Quanta在美國東西海岸都有生產能力，並將繼續擴大其美國工廠。➀ Quanta Computer plans to increase AI server production in the US due to high demand; ➁ NVIDIA's GB200 is being trial-produced in Taiwan and the US, with production ramping up in Q1 2025; ➂ Quanta has production capacity on both the east and west coasts of the United States and will continue to expand its factories.
11/01/2024, 01:00 PM UTC
OpenLight CEO访谈：Adam Carter博士CEO Interview: Dr. Adam Carter of OpenLight
➀ OpenLight是全球首个集成了激光的开放硅光子平台；➁ 解决了硅光子在设计与部署中的挑战；➂ 在数据中心、AI/ML和高性能计算等领域表现突出；➃ 专注于光子组件的规模化和效率；➃ 通过直接将活性组件集成到硅中实现差异化；➅ 开发先进的PIC并扩展产品线，包括1.6Tb产品。➀ OpenLight is the first open silicon photonics platform with integrated lasers; ➁ Solves challenges in design, manufacturing, and deployment of silicon photonics; ➂ Strongest application areas include data centers, AI/ML, and HPC; ➃ Focuses on scalability and efficiency for photonic components; ➄ Differentiates by enabling direct integration of active components into silicon; ➅ Developing advanced PICs and expanding portfolio with 1.6Tb products.
10/24/2024, 05:00 PM UTC
RISC-V与开源功能验证挑战The RISC-V and Open-Source Functional Verification Challenge
➀ RISC-V与开源功能验证挑战探讨了RISC-V和ARM核心验证过程的差异。 ➁ 讨论了选择可靠IP供应商的重要性以及软件支持对验证的影响。 ➂ 强调了RISC-V配置文件在简化验证和实现软件兼容性方面的作用。➀ The RISC-V and open-source functional verification challenge highlights the differences in verification processes between RISC-V and ARM cores. ➁ The importance of selecting a reliable IP vendor and the impact of software support on verification is discussed. ➂ The role of RISC-V profiles in simplifying verification and enabling software compatibility is emphasized.
10/24/2024, 12:00 PM UTC
谷歌或采用台积电N3E工艺替代2nm制造Tensor G6[News] Google Reportedly Adopts TSMC’s N3P Process instead of 2nm for Tensor G6
➀ 据传闻，谷歌将采用台积电的N3E工艺制造Tensor G5；➁ 报告还明确指出，谷歌没有选择为Tensor G6使用2nm技术；➂ 这一举措可能影响AI和智能手机芯片市场的竞争。➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.
10/21/2024, 05:00 PM UTC
SoC调试挑战解锁：高效原型制作之路Unlocking SoC Debugging Challenges: Paving the Way for Efficient Prototyping
➀ 随着芯片设计的日益复杂，高效的调试解决方案对于成功的原型验证至关重要；➁ 原型制作在芯片验证中扮演着关键角色，它可以通过真实场景测试和早期客户演示来确保可靠性；➂ S2C的Prodigy原型制作解决方案提供了一整套调试平台，包括实时控制软件、设计调试软件、多调试模块和ProtoBridge协同仿真软件等工具。➀ The increasing complexity of chip design necessitates efficient debugging solutions for successful prototype verification; ➁ Prototyping plays a crucial role in chip verification by enabling real-world scenario testing and early customer demonstrations; ➂ S2C's Prodigy prototyping solution offers a comprehensive debugging platform with tools like real-time control software, design debugging software, Multi-Debug Module, and ProtoBridge co-simulation software.
10/16/2024, 01:00 PM UTC
移动LLM不只是技术。实际应用案例才是关键Mobile LLMs Aren’t Just About Technology. Realistic Use Cases Matter
➀ 谷歌正在探索在移动设备上运行大型语言模型（LLM）的可行性；➁ 谷歌在移动设备上优化LLM的技术；➂ 移动设备上LLM实际应用案例的重要性➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
10/15/2024, 05:00 PM UTC
电子束探测：7nm以下集成电路安全分析的新守护者Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs with Backside PDN
➀ 电子束探测（EBP）已成为分析7nm以下集成电路安全性的有效方法。 ➁ 它比光学探测具有更高的空间分辨率，适用于7nm以下的倒装芯片和先进的三维架构。 ➂ 研究重点在于EBP在故障分析和硬件保证中的重要性。➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.
10/08/2024, 06:44 AM UTC
AMD将成为TSMC亚利桑那州新工厂的下一个大客户：2025年美国制造的高性能计算AI芯片AMD should be TSMC's next huge customer for Arizona: HPC AI chips made in the USA in 2025
➀ 据报道，AMD将在TSMC亚利桑那州的新工厂生产下一代高性能计算AI芯片；➁ 这使得AMD成为继苹果之后该新工厂的第二个主要客户；➂ 预计将在2025年使用TSMC的5nm工艺节点开始生产。➀ AMD is reportedly set to produce next-gen, high-performance HPC AI chips at TSMC's new Arizona fab; ➁ This makes AMD the second major client for the new fab after Apple; ➂ Production is expected to begin in 2025 at TSMC's 5nm process node.
08/29/2024, 06:11 AM UTC
Supermicro确认NVIDIA B200 AI GPU延迟：提供液冷H200 AI GPU替代方案Supermicro confirms NVIDIA B200 AI GPU delay: offers liquid-cooled H200 AI GPUs instead
➀ Supermicro确认NVIDIA的Blackwell B200 AI GPU延迟；➁ 提供液冷Hopper H200 AI GPU作为替代方案；➂ 声称对AI服务器市场影响最小。➀ Supermicro confirms the delay of NVIDIA's Blackwell B200 AI GPU; ➁ Offers liquid-cooled Hopper H200 AI GPUs as an alternative; ➂ Asserts minimal impact on AI server market.
07/29/2024, 01:00 PM UTC
Alphawave Semi 推出行业首款多协议I/O连接芯片，助力高性能计算和AI基础设施Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
1、Alphawave Semi 开发了行业首款用于高性能计算（HPC）和人工智能（AI）的多协议I/O连接芯片，传输速率达1.6Tbps；2、该芯片支持多种协议，包括PCIe、CXL和以太网，提高了数据传输效率和AI模型训练能力；3、Alphawave Semi 在技术和商业因素上的双重关注，推动了芯片技术在高性能计算和AI应用中的采用和可持续性。1. Alphawave Semi has developed the industry's first multi-protocol I/O connectivity chiplet for HPC and AI, delivering 1.6Tbps throughput; 2. The chiplet supports various protocols including PCIe, CXL, and Ethernet, enhancing data transfer efficiency and AI model training; 3. Alphawave Semi's focus on both technical and business factors is driving the adoption and sustainability of chiplet technology in high-performance computing and AI applications.
07/18/2024, 05:00 PM UTC
台积电2024年第二季度业绩：HPC营收占比超52%，AI需求推动创历史最佳季度TSMCs Q2'24 Results: Best Quarter Ever as HPC Revenue Share Exceeds 52% on AI Demand
1、台积电2024年第二季度营收达到208.2亿美元，创下公司历史最佳季度。2、高性能计算（HPC）营收占比首次超过52%，主要由AI处理器需求和PC市场复苏推动。3、先进技术（N3、N5、N7）占总晶圆营收的67%，其中N3工艺技 术占比15%。1. TSMC's Q2 2024 revenue reached $20.82 billion, marking the best quarter in the company's history. 2. HPC revenue share exceeded 52%, driven by AI processor demand and a rebound in the PC market. 3. Advanced technologies (N3, N5, N7) accounted for 67% of total wafer revenue, with N3 process technologies contributing 15%.
05/21/2024, 03:00 PM UTC
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
1、TSMC将扩展CoWoS存储容量，Compound Annual Growth Rate（CAGR）为60%，以满足日益增长的需求。 2、到2026年，CoWoS存储容量将增加四倍。 3、TSMC还将扩展SoIC 3D堆叠技术的容量，Compound Annual Growth Rate（CAGR）为100%。
