➀ KLA报告第三季度营收31亿美元，非GAAP每股收益8.20美元；
➁ 预计未来季度营收30-35亿美元，非GAAP每股收益7.55-8.65美元；
➂ AI和HBM是推动高端市场增长的关键因素。
Recent #HBM news in the semiconductor industry
➀ Samsung has reportedly received approval to supply NVIDIA with its 8-layer HBM3E memory chips for less powerful AI GPUs destined for China.
➁ Despite previous distrust from NVIDIA's CEO, Samsung is now approved to supply these chips.
➂ SK hynix remains NVIDIA's main partner for advanced HBM memory, providing 12-layer HBM3E and working on next-gen HBM4 for future GPUs.
➀ NVIDIA is distancing itself from Samsung and its HBM memory due to trust issues, as stated by CEO Jensen Huang.
➁ Despite previous positive remarks, NVIDIA is working to certify Samsung's HBM3E memory for AI GPUs.
➂ If unsuccessful, NVIDIA may rely on SK hynix and Micron for HBM supply.
➀ SK hynix reported record profits in 2024, driven by high demand for its HBM memory used in AI chips.
➁ Despite the success, the labor union criticized the company for not honoring a profit-sharing agreement.
➂ The company plans to focus on sustainable growth and flexible investments.
➀ Tongfu Microelectronics has begun trial production of HBM2 memory, potentially for Huawei AI GPUs.
➁ This marks a significant step for China's domestic industry, despite being behind current HBM standards.
➂ HBM4 is on the horizon and will be featured in NVIDIA's next-gen Rubin R100 AI GPU.
➀ Hanmi Semiconductor has signed a 10.8 billion won deal with SK Hynix for HBM production equipment; ➁ The deal involves tuning bonders supplied by Hanmi to SK Hynix; ➂ Details of the deal were not disclosed.
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和；➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模，并寻求与代工厂的合作；➂ 35ELEMENTS拥有立方氮化镓材料的独家专利，并计划制造高效的光发射器，如创新型绿色发光二极管。
➀ SK Hynix is developing high bandwidth memory (HBM) faster than customer Nvidia's demand; ➁ SK Group Chairman Chey Tae-won met with Nvidia CEO Jensen Huang at CES 2025; ➂ SK Hynix, as the most valuable subsidiary of SK Group, is manufacturing memory.
➀ Samsung is re-engineering its HBM chips as revealed at CES; ➁ Hynix has been leading the HBM market with about 50% of the revenues; ➂ The HBM market is expected to be worth about $14 billion last year and grow at a CAGR of ~38% to reach $37.7 billion by 2029.
➀ SK Hynix unveils the latest HBM (HBM3E) 16-chip at CES 2025;
➁ SK Hynix's stock price surged by 6.25% due to positive expectations for NVIDIA;
➂ SK Hynix plans to release HBM3E 16-chip with expanded storage capacity of up to 48GB;
➃ Lee & Huang's meeting at CES is anticipated.
➀ SK hynix is rumored to deliver a significant HBM memory order to Broadcom in 2025; ➁ Broadcom is developing new AI chips for Google, Meta, and ByteDance; ➃ SK hynix will increase its HBM production capacity to meet the demand.
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
➀ Micron reports revenue and EPS in line with expectations but provides weak guidance; ➁ AI-driven memory demand surges, while consumer memory struggles; ➂ Market concerns over Micron's stock due to the imbalance between AI and consumer memory growth.
➀ AI laptops like Microsoft's Copilot+ PCs face uncertain future; ➁ Micron's Q3 earnings weaker than expected; ➂ AI PC and smartphone 'supercycle' not materializing as projected
➀ SK Hynix has secured a significant order for HBM from Broadcom; ➁ The chips will be used in an AI computing chip for a major technology company; ➂ The deal is expected to enhance SK Hynix's market position in high-performance memory.
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
➀ 3D design with HBM is critical for advanced semiconductor systems; ➁ Large system designs require multi-chiplet integration; ➂ Multiphysics and ML are essential for optimizing performance and reliability.
➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.
➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 6.5% year-on-year to $113 billion in 2024, with projections of $121 billion for 2025 and $139 billion for 2026. ➁ The wafer fab equipment (WFE) segment is expected to grow 5.4% to $101 billion in 2024, driven by DRAM, HBM, and China. ➂ Back-end equipment sales are projected to surge, with test equipment sales increasing 14.7% in 2025 and 18.6% in 2026.
➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.