➀ Global semiconductor equipment spending surged 23% YoY in Q2 2025, reaching $33.07B, with China ($11.36B), Taiwan ($8.77B), and South Korea leading regional investments.

➁ North America’s spending declined due to wafer fab delays (Intel, Micron, Samsung) amid administration policy shifts, while TSMC drove Taiwan’s 125% growth through aggressive CapEx.

➂ 2025 global CapEx is projected at $160B (+3% YoY), but 2026 forecasts vary; concerns grow over U.S. CHIPS Act implementation under Trump’s equity-focused strategy.

➀ Researchers from imec and Ghent University achieved a 120-layer stack of silicon and silicon-germanium (Si/Ge) using advanced epitaxial deposition, overcoming lattice mismatch challenges through carbon doping and temperature control.

➁ This breakthrough enables 3D DRAM development, allowing vertical stacking for higher memory density without increasing chip size, potentially revolutionizing storage capacity.

➂ The technology also benefits 3D transistors, quantum computing, and aligns with Samsung's 3D DRAM roadmap and next-gen architectures like GAAFET and CFET.

➀ DDR5 memory with advanced error correction (ECC) ensures data integrity in shrinking DRAM nodes, exemplified by Kingston's 32GB DDR5 module for servers;

➁ Industrial-grade storage solutions like Micron's DDR4 SODIMM and TDK/Swissbit SSDs deliver reliability in harsh environments;

➂ Embedded storage innovations, including eMMC, SD cards, and pSLC flash, support AI, IoT, and high-performance computing with enhanced endurance and speed.

➀ Micron launched three datacentre SSDs, including the 9650 PCIe Gen6 with 28GB/s read speeds and liquid-cooling options for AI training/inference;

➁ The 6600 ION E3.S 122TB SSD offers 245TB capacity per drive, reducing storage footprint and energy consumption by up to 37% vs. HDDs;

➂ The 7600 PCIe Gen5 SSD focuses on low latency (sub-1ms) and energy efficiency for critical workloads, with samples of all three models shipping in 2025-2026.

➀ Micron announced three new SSDs: the 9650 PCIe Gen6 (up to 30.72TB) for AI servers with 28GB/s reads and liquid cooling support;

➁ The 6600 ION offers massive 122TB capacity in E3.S form factor, targeting AI data storage;

➂ The mainstream 7650 PCIe Gen5 SSD focuses on low latency and capacities down to 1.92TB, replacing smaller Gen5 drives.

➀ Micron announces $200B U.S. investment plan spanning 20+ years, including $150B for six new DRAM fabs (2 in Idaho, 4 in New York) and $50B for domestic R&D;

➁ The first Idaho fab (ID1) will start DRAM production in late 2027, with HBM packaging capabilities added to Virginia facility post-domestic wafer scaling;

➂ While expanding U.S. capacity, Micron’s global DRAM/NAND production will remain predominantly overseas, reflecting strategic balancing of geopolitical demands and economic realities.

➀ Micron Technology introduces the world's first LPDDR5X memory using 1γ node technology, achieving 10.7 Gbps speed and 20% power savings;

➁ The ultra-thin 0.61mm package enables slimmer designs for smartphones and foldable devices, supporting on-device AI tasks like real-time translation and image generation;

➂ Performance tests show 30-50% faster AI responses compared to previous generations, with potential applications in AI PCs and automotive systems.

➀ Micron has commenced shipments of HBM4 memory, delivering 2.0TB/s per stack with a 2048-bit interface, a 60% performance boost over HBM3E;

➁ Initial 36GB stacks target next-gen AI accelerators, built on Micron's 1-beta process with advanced memory testing (MBIST) for reliability;

➂ Full production ramp is planned for 2026, aligning with next-gen AI hardware releases, while future designs may combine HBM with LPDDR for expanded memory capacity.

➀ Micron challenges court rulings that allowed YMTC access to 73 pages of confidential 3D NAND documentation, citing national security risks;

➁ The dispute stems from a 2023 patent infringement case where YMTC accused Micron, with Micron arguing YMTC's request for printed source code pages exceeds agreed limits;

➂ Under the protective order, YMTC's access is restricted to physical copies with strict anti-duplication rules, though Micron seeks Supreme Court intervention to revoke access entirely.

➀ Micron showcased a PCIe 6.0 SSD prototype (EVT3) at Computex 2025, achieving up to 30.25 GB/s speeds, though mass production remains distant;

➁ Astera Labs utilized the SSD to demo its PCIe 6.0 switch and software, highlighting peer-to-peer GPU-SSD communication for AI platforms;

➂ PCIe 6.0 certification delays until late 2025 mean interoperability testing is pending, with Micron's SSD still undergoing engineering validation phases (EVT3).

➀ This article lists the top ten semiconductor companies in 2024, based on data from Gartner.

➁ The top five companies are Nvidia, Samsung, Intel, Hynix, and Qualcomm.

➂ The full list includes other notable companies such as Broadcom, Micron, AMD, and MediaTek.

➀ The newly imposed U.S. import duties are likely to significantly increase the cost of storage devices due to their impact on HDD and SSD manufacturers.

➁ HDD manufacturers like Seagate, Toshiba, and Western Digital have complex supply chains with production in various countries, making them susceptible to high tariffs on Chinese-made drives.

➂ SSD manufacturers face challenges due to the 'country of origin' rules, potentially leading to increased costs if they are not assembled in countries exempt from tariffs.

➀ Micron confirms plans to raise memory prices due to strong demand for DRAM and NAND flash.

➁ The price hike is expected to continue through 2025 and 2026.

➂ Factors include supply constraints and growing demand from AI, data centers, and consumer electronics.

➀ Micron's SOCAMM memory is being used to power the next generation of NVIDIA Grace GB300 servers;

➁ The new SOCAMM memory form factor offers modular LPDDR5X memory for NVIDIA Grace CPUs;

➂ The modular design allows for easier upgrades and changes in memory configuration during the manufacturing process.

➀ Micron and SK hynix unveil new LPDDR5X SOCAMM memory modules;

➁ The modules are designed for AI and low-power servers, debuting on Nvidia GB300 systems;

➂ The memory offers high capacity, performance, and low power consumption.

➀ The CHIPS and Science Act, aimed at strengthening U.S. semiconductor manufacturing, is under threat of repeal by the Trump administration.

➁ The Act has already attracted nearly $450 billion in private investment from leading companies, raising concerns about the impact of its repeal on the U.S. chip market.

➂ Political hurdles and legal obligations make the repeal process complex and challenging.

➀ Micron and Astera Labs demonstrate the world's first PCIe 6.0 SSDs at DesignCon 2025;

➁ The SSD achieves read speeds of 27.14 GB/s with Astera's Scorpio PCIe 6.0 switch;

➂ PCIe 6.x promises to be the next horizon for enterprise and consumer products.

➀ The Q4 DRAM market grew 9.9%, reaching over $28 billion;

➁ Seasonal Q1 weakness and weakening CSP demand are expected to lower prices in the current quarter;

➂ Samsung remained the top DRAM supplier with $11.25 billion in revenue, followed by Hynix and Micron.

➀ TrendForce reports a 6.2% decline in Q4 NAND revenues, with ASPs falling 4% QoQ;

➁ Samsung's revenue fell 9.7% QoQ due to weak consumer electronics demand;

➂ Kioxia's Q4 revenue declined by only 0.2% QoQ due to enterprise SSD shipments;

➃ Micron's Q4 NAND Flash revenue dropped 9.3% QoQ despite strong enterprise SSD shipments.

➀ Micron is sampling its first Gen5 client SSD based on its G9 TLC NAND;

➁ The PCIe 4600 SSD offers sequential read speeds of 14.5 GB/s and write speeds of 12.0 GB/s;

➂ The SSD reduces load times by up to 62% compared to Gen4, enhancing energy efficiency by 107%.