➀ NVIDIA invests $5B in Intel to leverage its advanced Foveros 3D packaging and EMIB bridge technology for next-gen AI SoCs;
➁ Intel's stacking solutions enable hybrid chiplet designs, boosting interconnect bandwidth by 3-10x compared to planar layouts;
➂ The partnership grants NVIDIA domestic US packaging capacity, reducing reliance on TSMC while accelerating time-to-market for complex AI systems.