SemiVoice

➀ The Solidigm D5-P5336 122.88TB NVMe SSD offers extreme capacity in a 2.5" U.2 form factor, leveraging 192-layer QLC NAND and PCIe Gen4 technology;

➀ The drive prioritizes capacity over speed, delivering up to 7300 MB/s sequential read speeds and 25K random write IOPS (32K block size) with a 5-year endurance rating of 0.6 DWPD (73TB/day);

➂ Designed for enterprise storage needs, the SSD eliminates traditional endurance concerns through massive overprovisioning, supporting 134.3PBW total writes over its lifespan.

➀ HPE introduced new ProLiant DL325 Gen12 and DL345 Gen12 servers at HPE Discover 2025, featuring AMD EPYC 9005 'Turin' processors;

➁ Both models support up to 24 DIMMs per socket for expanded memory capacity and include the iLO 7 management system;

➂ The 2U DL345 Gen12 offers superior storage flexibility and I/O expansion, targeting high-core-count workloads and modernization from legacy platforms.

➀ The SK Hynix Beetle X31 is a compact 2TB external USB SSD offering read/write speeds up to 1050/1000 MB/s via USB 3.2 Gen2;

➁ Positioned in the $140-$155 range, it competes with SanDisk Extreme, Crucial X9 Pro, and Samsung T7 series;

➂ Features aluminum and silicone casing for durability, includes dual USB cables, but has mixed aesthetic appeal compared to rivals.

➀ Kioxia launched the CD9P series PCIe Gen5 NVMe SSDs, offering capacities up to 61.44TB in 2.5-inch and E3.S form factors, targeting high-performance and high-capacity storage needs in data centers;

➁ The series includes CD9P-V (3 DWPD, mixed-use) with up to 12.8TB and CD9P-R (1 DWPD, read-optimized) up to 61.44TB, prioritizing performance scalability for large-scale storage;

➂ Positioned as a single-port solution for scale-out architectures, the CD9P complements Kioxia's dual-port CM9 Gen5 SSDs, emphasizing capacity expansion and enterprise storage evolution.

➀ Xsight Labs introduced its E1 DPU featuring up to 64 Arm Neoverse N2 cores, dual 400Gbps networking interfaces, and 32 PCIe Gen5 lanes;

➁ The DPU integrates DDR5 memory, hardware accelerators for crypto and NVMe-oF, and supports flexible deployment models like NVMe SSD aggregation and storage offloading;

➂ It competes with NVIDIA BlueField-3 DPU by offering Arm SystemReady-certified Linux compatibility and scalability for cloud data centers.

① AMD unveiled the Ryzen Threadripper 9000 series, featuring Zen 5 architecture, up to 96 cores, 8-channel DDR5-6400 support, and backward compatibility with existing sTR5 platforms, delivering 15-25% performance gains.

② The Radeon AI Pro R9700 GPU utilizes RDNA 4 architecture with 32GB GDDR6, 71 TOPS AI performance, and FP8 support, targeting AI-accelerated workstation workflows.

③ AMD reinforces its workstation leadership against Intel’s aging Xeon W lineup, while the R9700 competes with both NVIDIA GPUs and AMD’s own Ryzen AI Max mobile solutions.

➀ PCI-SIG released PCIe 7.0 specifications, delivering 128 GT/s raw bit rate and up to 512GB/s bidirectional bandwidth in x16 slots using PAM4 signaling and flit-based encoding;

➁ A new optical PCIe interconnect solution (PCIe 6.4/7.0) was introduced, enabling extended reach and multiplexing for applications like NVMe storage pools and CXL memory shelves in hyperscale AI data centers;

➂ PCIe Gen8 development is already underway, with adoption expected to accelerate in high-performance computing and AI-driven infrastructure.

➀ AMD announced the Instinct MI350 series, currently shipping to customers, featuring HBM3E memory and OAM packaging;

➁ The MI350 utilizes eight HBM3E stacks and two I/O dies, compatible with the OCP UBB platform for scalable 8-GPU configurations;

➂ Both air-cooled (MI350X) and liquid-cooled (MI355X) variants are available, promising higher performance and memory density compared to the previous MI300X generation.

➀ Google Cloud announces G4 VMs with dual AMD EPYC 9005 Turin CPUs and eight NVIDIA RTX Pro 6000 GPUs, delivering 768GB GDDR7 memory and 384 vCPUs;

➁ The instances feature 400Gbps network bandwidth, NVIDIA MIG partitioning for up to 32 GPU partitions, and 1.4TB system memory;

➂ Targets cost-sensitive workloads with GDDR7 instead of HBM3E, offering flexibility for AI, rendering, and VDI applications.

➀ Micron has commenced shipments of HBM4 memory, delivering 2.0TB/s per stack with a 2048-bit interface, a 60% performance boost over HBM3E;

➁ Initial 36GB stacks target next-gen AI accelerators, built on Micron's 1-beta process with advanced memory testing (MBIST) for reliability;

➂ Full production ramp is planned for 2026, aligning with next-gen AI hardware releases, while future designs may combine HBM with LPDDR for expanded memory capacity.

➀ The SanDisk Extreme PRO Portable SSD 4TB is a USB 3.2 Gen 2 x2 external drive offering high-speed storage, competing with models like the Samsung T9 and Crucial X10 Pro;

➁ The drive features a rugged design with 3-meter drop protection and IP65 water/dust resistance, along with a large 4TB capacity clearly labeled for easy identification;

➂ It includes both USB-C to USB-C and USB-C to USB-A cables, supporting 20Gbps transfer speeds for real-world performance advantages.

➀ Broadcom unveiled its Tomahawk 6 series switches at Computex 2025, featuring 102.4T bandwidth and 64-port 1.6TbE configurations.

➁ Delta and Wistron/Wiwynn showcased prototype switches, with Delta's 3U design focusing on airflow cooling and Wistron/Wiwynn's 4U model emphasizing enhanced thermal management.

➂ Limited photography was permitted due to embargo constraints, but more Tomahawk 6-based hardware is expected to emerge following the official announcement.

➀ MLPerf Training v5.0 results highlight NVIDIA's dominance with Blackwell and Hopper architectures, supported by submissions from Dell and Supermicro;

➁ AMD showcases improved performance of Instinct MI325X, claiming 30% generational gains over MI300X and competitive results against NVIDIA H200 in Llama2 70B training;

➂ Limited participation from other vendors noted, with Google's Trillium system appearing and a focus on accelerated hardware-software optimization trends.

➀ Broadcom launched the Tomahawk 6 series switch ASICs, supporting 102.4Tbps bandwidth and up to 64 ports of 1.6TbE, marking the transition to terabit Ethernet;

➁ The chips enable both scale-up configurations (e.g., connecting HBM4 memory across 512 XPUs) and scale-out architectures for AI clusters, reducing network tiers and latency;

➂ Features like Global Load Balancing 2.0, Cognitive Routing, and enhanced telemetry optimize data flow and cost efficiency, positioning Broadcom as a key player amid competition with NVIDIA in AI infrastructure.

➀ Cornelis Networks launched the CN5000 series, a 400Gbps Omni-Path solution targeting AI and HPC markets, offering liquid/air-cooled director-class switches and low-latency SuperNICs;

➁ The new architecture emphasizes zero-congestion networking to optimize GPU utilization in AI clusters, with production availability starting Q3 2025;

➂ The company revealed a roadmap integrating UltraEthernet by 2026-2027, positioning itself as an alternative to NVIDIA's InfiniBand and challenging Broadcom/Marvell in Ethernet switching.

➀ The ASRock Rack EPYC4000D4U is an mATX motherboard designed for AMD's socket AM5 CPUs, bridging server-class features to compact builds with support for up to 192GB DDR5 ECC memory and PCIe Gen5 slots.

➀ It features an ASPEED AST2600 BMC for IPMI management, dual Intel i210-at NICs, and eliminates traditional chipsets by using ASMedia controllers for SATA ports, reducing power and cost and aligning with modern server designs.

➁ The motherboard prioritizes EPYC CPUs for server workloads (e.g., 170W liquid-cooled EPYC 4565P) but supports Ryzen CPUs, though with reduced PCIe Gen5 speed on M.2 slots for Ryzen 8000 series processors.

➀ The GIGABYTE G383-R80-AAP1 is a 3U server featuring AMD's Instinct MI300A APUs, combining CPU and GPU cores with HBM3 memory for high-performance AI and HPC workloads;

➀ The server houses four MI300A APUs, eight 2.5" NVMe drives, and eight PCIe Gen5 slots, along with four 3kW PSUs for efficient power delivery;

➂ Designed for supercomputing tasks, it emphasizes cooling efficiency and scalability, targeting applications like the AMD-powered El Capitan supercomputer.

➀ The Minisforum MS-A2 is an AMD Ryzen-based upgrade to the popular Intel MS-01, featuring dual 10GbE SFP+ and 2.5GbE ports for homelab use;

➁ It supports up to 128GB non-ECC RAM and partially works with 96GB ECC RAM, addressing prior hardware limitations like problematic SSD configurations;

➂ The compact 1.7L chassis includes mixed NIC vendors (Intel and Realtek) and lacks clear port labeling, but offers PCIe expansion and improved thermal design for multi-node setups.

➀ ASRock Rack demonstrated the AMPONEMD12DNO motherboard for AmpereOne M Arm servers at Computex 2025;

➁ The OCP M-DNO Type 2 motherboard features 12 DDR5 DIMM slots, PCIe Gen5 x16 connectors, and supports expandability with OCP NIC 3.0 and DC-SCM modules;

➂ The early-stage board highlights Ampere's upcoming focus on 16-channel memory platforms for enhanced server performance.

➀ NVIDIA unveiled its new MGX PCIe Switch Board with ConnectX-8, designed for 8x PCIe GPU servers, marking a significant architectural shift in AI server infrastructure;

➁ The board integrates four PCIe Gen6 ConnectX-8 NICs, enabling 800Gbps networking and direct PCIe Gen6 x16 connectivity between GPU pairs, bypassing CPU limitations;

➂ This innovation allows NVIDIA to deploy PCIe Gen6 and high-speed networking capabilities independently of next-gen CPU platforms, accelerating AI factory scalability.

➀ Auras showcased its next-gen Intel Oak Stream cold plates for upcoming Xeon CPUs at Computex 2025, designed to support high thermal loads;

➁ The cold plates measure 156.0×107.5×24.2mm, larger than AMD’s SP7 counterparts, and feature a revised four-post retention mechanism;

➂ These designs highlight the growing adoption of liquid cooling in data centers, particularly for accelerated servers and high-density computing environments.

➀ Auras showcased its AMD SP7 liquid cooling cold plate for 600W CPUs at Computex 2025, targeting next-gen high-performance server processors;

➁ The compact cold plate measures 120.1×100.6×22.3mm and supports dual-socket designs with six mounting points, outperforming Intel's upcoming Oak Stream counterpart in size;

➂ AMD's SP7 platform, though not yet detailed publicly, is expected to power next-generation servers with 16-channel memory and higher core counts for advanced computing workloads.

➀ ASPEED unveiled its next-gen AST2700 BMC at Computex 2025, featuring upgraded quad Arm Cortex-A35 and dual Cortex-M4 cores for enhanced server management capabilities;

➁ The BMC integrates new 1Gbps LTPI interface, PCIe Gen4, DDR5 support, and Caliptra-based silicon root of trust security;

➂ Shown earlier than expected on Pegatron's OCP DC-SCM 2.1 module, it aims to counter emerging BMC competitors like Axiado with higher performance and integration.

➀ Teamgroup unveiled its TForce Triple M.2 liquid cooler at Computex 2025, designed to cool three M.2 SSDs with an AIO solution featuring a single-fan radiator and liquid cooling blocks;

➁ The compact design addresses thermal management challenges for clustered M.2 drives, though tube routing may complicate installation on motherboards with adjacent PCIe slots;

➂ While innovative, the product raises practicality concerns due to added cost and complexity for components with relatively low thermal demands.

➀ Intel Xeon 6 processors with High-Priority Cores (P-cores) are positioned as a key feature in NVIDIA DGX B300 AI servers, using the 64-core Xeon 6776P CPU for enhanced workload distribution;

➁ Intel markets its Xeon 6700P's 2DPC memory speed advantage (5,200 MT/s) over AMD EPYC 9005 (4,000 MT/s), though AMD offers more memory channels and capacity;

➂ NVIDIA's preference for Intel CPUs in GPU servers stems from reduced competitive overlap in AI accelerators, benefiting from Intel's canceled Rialto Bridge and Falcon Shores projects.

➀ Dell showcased a prototype Pro Max Plus laptop with Qualcomm's discrete Cloud AI 100 NPU at its 2025 Tech World event, replacing traditional dGPUs for AI tasks;

➁ The dual NPU configuration offers 64GB unified memory, enabling local execution of 109-billion-parameter models like Llama 4 Scout, outperforming NVIDIA GPUs in memory capacity and power efficiency;

➂ This solution integrates with Dell's Pro AI Studio software, targeting developers needing mobile AI acceleration, potentially challenging NVIDIA's CUDA ecosystem and AMD's integrated NPU solutions.

➀ Maxsun and Intel showcased a dual GPU card at Computex 2025, combining two 24GB Intel Arc Pro B60 GPUs for 48GB total memory;

➁ The blower-style cooler design enables deployment in workstations/servers, supporting PCIe x8 bifurcation for efficient resource allocation;

➂ Targeting AI and graphics workloads, the solution offers cost advantages over NVIDIA's RTX 6000 Ada (48GB) at a projected lower price point.

➀ AMD announced the Ryzen Threadripper 9000 family at Computex 2025, featuring Zen 5 architecture with up to 96 cores, 384MB L3 cache, and support for DDR5-6400 memory and PCIe 5.0 lanes;

➁ The Threadripper Pro 9000 series targets professional workstations with 12-96 cores and 128 PCIe 5 lanes, while the non-Pro models (24-64 cores, 48 PCIe 5 lanes) cater to HEDT users, offering backward compatibility with existing sTR5 motherboards;

➂ Zen 5 delivers ~16% IPC gains and up to 5.4GHz boost clocks, enabling ~20% performance improvement over previous gen, with availability starting July 2025 for retail and OEM systems.

➀ AMD's Computex 2025 keynote focuses on client and workstation products, led by Senior VP Jack Huynh;

➁ Anticipated announcements include Zen 5-based Threadripper CPUs, mainstream RDNA 4 Radeon GPUs (response to NVIDIA's RTX 5060), and promotion of Ryzen AI MAX laptops;

➂ Emphasis on gaming, workstation hardware, and competition in the mainstream GPU market.

➀ Innodisk showcased the 5QS-P, a 128TB PCIe Gen5 NVMe SSD in the E3.L form factor at Computex 2025, targeting high-density storage applications;

➁ The SSD offers sequential read/write speeds of up to 12GB/s and 5GB/s, leverages QLC NAND technology, and supports up to 40W power for improved performance;

➂ The E3.L form factor enables higher storage density and chassis flexibility compared to traditional 2.5" drives, marking a shift in data center storage design.