➀ Cissoid introduces new SiC and IGBT power modules targeting automotive, industrial, and energy markets with diverse current/voltage ratings;

➁ The portfolio includes a 750V/820A IGBT module, AQG-324 automotive-qualified, offering high performance and compatibility at competitive costs;

➂ Modules feature standardized packages, mechanical robustness, and drop-in compatibility to accelerate innovation in power systems.

➀ Amatech's new two-component epoxy system addresses thermal management challenges with >1 W/m·K thermal conductivity, suitable for power electronics, LEDs, and battery modules;

➁ Compatible with diverse substrates (metals, ceramics, composites) and offers controlled curing for precision assembly processes;

➂ Designed for reliability in industrial, automotive, and energy storage applications, featuring dielectric stability and thermal cycling resilience.

➀ Vishay's bidirectional eFuse reference design addresses high-voltage protection challenges in eMobility systems using SiC MOSFETs for 40 kW operation with under 30W losses;

➁ The design features ultra-fast overcurrent shutdown (＜2.5μs), continuous load monitoring, and preload detection for capacitor/short-circuit protection;

➂ Implemented on a thermally optimized 4-layer PCB, it supports remote control via web interface and maintains galvanic isolation for enhanced safety in automotive battery applications.

➀ ThingsUp's Vehicle Telematics Solution provides real-time GPS tracking, geofencing, and vehicle health monitoring for fleets;

➁ It supports global connectivity (4G/3G/2G) across regions and integrates with EV systems with OTA updates and backup data logging;

➂ The platform combines sensor integration and analytics to optimize operations, reduce costs, and ensure compliance for diverse fleets.

➀ Nexperia introduces 80 V and 100 V ASFETs optimized for dynamic current sharing in high-power 48 V systems, addressing unbalanced current distribution in parallel MOSFET configurations;

➁ The PSMN1R9-80SSJ and PSMN2R3-100SSJ models feature a 50% lower current delta (up to 50 A/device) and a tight VGS(th) window of 0.6 V, eliminating costly voltage-matching requirements;

➂ With ultra-low RDS(on) values (1.9 mΩ and 2.3 mΩ) and rugged packaging, the MOSFETs enhance efficiency and reliability in automotive electrification and industrial motor-drive applications.

➀ Texas Instruments' TIDA-050071 reference design addresses the challenge of powering automotive processors in ADAS and infotainment systems directly from a 12V battery;

➁ It integrates input protection, configurable voltage sequencing via an MSPM0 microcontroller, and a high-efficiency PMIC with multiple outputs;

➂ The compact solution supports cold-cranking down to 3V, reduces EMI, and offers flexibility for applications like autonomous driving modules and head-up displays.

➀ EU President Ursula von der Leyen proposes a '28th regime' to unify regulations for startups, simplifying cross-border scaling in Europe;

➁ Key initiatives include the Scaleup Europe Fund to address risk capital shortages and AI-driven healthcare screening centers to accelerate technology adoption;

➂ Emphasizes Europe's potential to lead in AI and autonomous vehicles, aiming to retain talent and drive global innovation.

➀ Key ASIC Berhad signs RM1.11 million contract with a Middle Eastern navigation firm to co-develop an AI-driven RF-integrated navigation chip;

➁ The chip targets ultra-low power consumption and advanced navigation accuracy for applications in automotive and IoT sectors;

➂ Collaboration aims to strengthen Key ASIC's presence in AI-optimized semiconductor solutions for global markets.

➀ Presents a DIY delay-off timer circuit using TLC555 IC for automated appliance control;

➁ Offers selectable preset timing options (5-30 mins) using dedicated push switches;

➂ Details circuitry, components, and applications in home, office, and automotive scenarios to improve energy efficiency

➀ ROHM launched new high-side smart switches for zonal controllers in vehicles, featuring ON resistances from 9 mΩ to 180 mΩ; ➁ The switches combine high-capacity load handling, ±5% current sensing accuracy, and diagnostic functions to enhance safety in EVs; ➂ Designed to replace mechanical fuses, they support zonal architectures critical for software-defined vehicle platforms.

➀ ASA Motion Link simplifies automotive cabling design for camera and sensor integration;

➁ Provides high-speed communication capabilities to support advanced automotive systems;

➂ Enhives connectivity efficiency in next-generation vehicle architectures

➀ The TranSphere project at Kempten University's IFM aims to create a mixed-reality platform that integrates real-world and virtual testing environments to revolutionize automated vehicle development.

➀ Focused on four key scenarios (Track Testing, Test Bed, Driving Simulator, and Scenario Networking), the initiative seeks to accelerate development cycles, enhance safety, and reduce resource consumption.

➂ Funded by the European Regional Development Fund (EFRE) until 2028, the project involves collaboration with industrial partners in simulation, robotics, and homologation to strengthen Europe’s automotive industry and address skilled labor shortages.

➀ Inductors are fundamental components that store magnetic energy and regulate current in circuits, playing critical roles in DC-DC converters, smartphones, EVs, and communication systems;

➁ TAIYO YUDEN offers advanced inductor solutions using ferrite and metal materials, including the MCOIL™ series for miniaturized consumer devices and AEC-Q200-compliant inductors for automotive applications;

➂ The global automotive-grade inductor market is growing due to EV adoption, with innovations focusing on high-frequency performance, miniaturization, and reliability.

➀ The automotive semiconductor market is projected to grow from $68 billion in 2024 to $132 billion by 2030 (10% CAGR), five times faster than the auto market's 2% growth rate;

➁ Infineon, NXP, and ST lead the market, while Chinese firms, backed by national policies, advance in ADAS and power SiC. OEMs like Tesla, BYD, and Nio are vertically integrating, disrupting traditional supply chains;

➂ TSMC and Samsung control sub-16nm node production, with capacity fully booked through 2027. Challenges include geopolitical risks, AI compute demands, and centralized vehicle architecture shifts.

➀ Taoglas expanded its Comet Series with the MA58x family of antennas engineered to maintain stable RF performance in metal-rich environments, overcoming groundplane interference challenges;

➁ The antennas offer multi-connectivity across 5G/4G MIMO, Wi-Fi 6/7, and GNSS, with 20% better efficiency than alternatives and support for 600 MHz–7.125 GHz frequencies;

➂ Designed with IP67-rated ASA housing, they target applications in automotive, industrial automation, and IoT, ensuring reliability in harsh conditions.

➀ Pickering Interfaces expanded its standard LXI microwave switching solutions with five new RFIU families, enhancing flexibility and density for cross-industry RF testing;

➁ The new products simplify system design through higher channel density, integrated multiplexer/matrix solutions, and support for frequencies up to 110GHz, while reducing lead times and test system size;

➂ Applications span semiconductor, automotive, medical, and communications sectors, supported by tools like the Microwave Switch Design Tool and compatibility with Linux/real-time OS.

➀ EnSilica and Codasip partner to integrate CHERI cybersecurity into ASICs for automotive, defense, and aerospace applications;

➁ CHERI's hardware architecture mitigates memory vulnerabilities, combined with Post-Quantum Cryptography and Codasip's RISC-V CPUs meeting ISO safety standards;

➂ Collaboration aims to accelerate adoption of secure, application-specific ASICs in mission-critical fields.

➀ Nvidia signed a letter of intent with UK self-driving startup Wayve for a potential $500m investment, building on a 7-year collaboration and existing use of NVIDIA's Drive AGX Thor technology;

➁ Wayve's AI foundation model combines imitation learning, reinforcement learning, and simulation to adapt to global driving environments with minimal retraining;

➂ The company plans London self-driving trials with Uber and has raised $1.3bn to date, with new funding potentially reaching $1.8bn.

➀ Explore curated content from EndeavorB2B brands focusing on time-sensitive networking (TSN) for real-time industrial and embedded systems;

➁ Highlight technical solutions addressing TSN requirements like deterministic communication and ultra-low latency;

➂ Discuss applications across automotive, manufacturing, and high-performance computing sectors

➀ Vishay Intertechnology introduces industry-first automotive-grade Y1-rated ceramic capacitors in SMD packages for EVs, combining safety certification with surface-mount design;

➁ Capacitors offer 500 VAC (Y1) and 1500 VDC ratings, capacitance up to 4.7 nF, and AEC-Q200 qualification for critical EV systems like chargers and inverters;

➂ Compact SMD format enables automated assembly, reduces PCB footprint, and meets stringent automotive humidity/thermal reliability requirements with IEC60384-14 compliance.