Recent #Broadcom news in the semiconductor industry

2 months ago

➀ Broadcom launched Jericho4, a 3nm Ethernet fabric router designed to interconnect over 1 million XPUs across distributed AI data centers, addressing power and space constraints;

➁ It offers 3.2T HyperPort technology, MACsec encryption, and lossless RoCE over 100km+, enabling high-bandwidth, secure, and efficient multi-data-center AI infrastructure;

➂ Jericho4 complies with Ultra Ethernet Consortium (UEC) standards, ensuring interoperability with ecosystem components like NICs and switches.

AIBroadcomHPC
2 months ago

➀ Broadcom Jericho4 51.2Tbps AI router chip is now shipping, targeting large AI clusters with 3.2Tbps HyperPorts and 3nm process technology;

➁ Features 100Km+ RoCE deployment for long-distance AI cluster communication and 200G PAM4 signaling;

➂ Part of Broadcom's expanded switch/routing portfolio, including Tomahawk 6 and Tomahawk Ultra, for high-tier AI network infrastructure.

AIBroadcomNetworking
3 months ago

➀ Broadcom launched the Tomahawk Ultra, a 51.2Tbps Ethernet switch chip optimized for small packet sizes and ultra-low latency (250ns), targeting HPC and AI clusters;

➁ The chip challenges NVIDIA's NVLink and InfiniBand by offering 'Scale-Up Ethernet' (SUE) with features like in-network collectives, compressed headers, and lossless fabric technology;

➂ Pin-compatible with Tomahawk 5 and shipping alongside Tomahawk 6, it emphasizes scalability for AI workloads while maintaining Ethernet compliance.

BroadcomHPCNVIDIA
4 months ago

➀ Q1 global fabless semiconductor revenue rose 6% quarter-over-quarter to $77.4 billion, driven by strong market demand;

➁ NVIDIA led with $42.3 billion (up 12% QoQ), followed by Qualcomm ($9.47 billion, down 6%) and Broadcom ($8.2 billion, up 2%);

➂ AMD, MediaTek, and others like Marvell and Realtek rounded out the top ten, reflecting varied performance across the semiconductor sector.

BroadcomNVIDIAQualcomm
4 months ago

➀ Broadcom unveiled its Tomahawk 6 series switches at Computex 2025, featuring 102.4T bandwidth and 64-port 1.6TbE configurations.

➁ Delta and Wistron/Wiwynn showcased prototype switches, with Delta's 3U design focusing on airflow cooling and Wistron/Wiwynn's 4U model emphasizing enhanced thermal management.

➂ Limited photography was permitted due to embargo constraints, but more Tomahawk 6-based hardware is expected to emerge following the official announcement.

BroadcomNetworking
4 months ago

➀ Broadcom launched the Tomahawk 6 series switch ASICs, supporting 102.4Tbps bandwidth and up to 64 ports of 1.6TbE, marking the transition to terabit Ethernet;

➁ The chips enable both scale-up configurations (e.g., connecting HBM4 memory across 512 XPUs) and scale-out architectures for AI clusters, reducing network tiers and latency;

➂ Features like Global Load Balancing 2.0, Cognitive Routing, and enhanced telemetry optimize data flow and cost efficiency, positioning Broadcom as a key player amid competition with NVIDIA in AI infrastructure.

AIBroadcomHPC
4 months ago

➀ Broadcom's Tomahawk 6 switch series delivers 102.4 Tbps switching capacity, doubling current Ethernet switch bandwidth, targeting AI networks with 100G/200G SerDes and co-packaged optics (CPO);

➁ It supports AI cluster interconnects for over one million XPUs, featuring Cognitive Routing 2.0 for dynamic load balancing and adaptive flow control tailored for AI workloads like mixture-of-expert models;

➂ Compliant with Ultra Ethernet Consortium standards, the switch enables scalable, low-latency networks for AI training/inference and integrates with open ecosystems like OCP's SUE Framework for flexible cluster configurations.

AIBroadcomHPC
5 months ago

① Apple and Broadcom are collaborating on the "Baltra" data center processor, expected to launch by 2027, featuring proprietary AI accelerators and HBM memory for Apple Intelligence services.

② The processor may scale up to 8x the CPU/GPU cores of the M3 Ultra, though AI workloads typically require specialized tensor units, suggesting a hybrid CPU-NPU design.

③ Apple’s roadmap includes M5 updates for 2025 iPads/MacBooks, M6 (Komodo), M7 (Borneo), and a high-end Sotra chip, alongside custom processors for wearables like AR glasses.

AI ServerAppleBroadcom
6 months ago

➀ NXP CEO Kurt Sievers will resign on October 28, succeeded by current President Rafael Sotomayor, who has 20 years of experience at NXP and previously held executive roles at Broadcom, Intel, and Motorola;

➁ Sievers, CEO since 2020, led strategic initiatives in automotive and IoT, including the acquisition of Marvell’s Wi-Fi business in 2019;

➂ NXP reported a 9% Q1 revenue decline to $2.84 billion, citing market uncertainty and tariff challenges while maintaining "cautious optimism."

BroadcomNXPsemiconductor
6 months ago

➀ Broadcom has introduced two new 200G/lane DSP PHY designs, Sian3 and Sian2M, to address the growing demand for AI and machine learning cluster connectivity.

➁ Sian3, built on 3nm technology, offers the lowest power consumption for SMF-based 800G and 1.6T modules, improving on its predecessor by reducing power usage by over 20%.

➂ Sian2M is optimized for short-reach MMF links in AI clusters, featuring an integrated VCSEL driver and leveraging Broadcom's 200G VCSEL technology for enhanced performance and efficiency.

AIAI InfrastructureBroadcomDSPOptical Connectivity
7 months ago

➀ TSMC has proposed a joint venture with US chip designers like NVIDIA and AMD to operate Intel's semiconductor fabs, with TSMC holding no more than a 50% stake.

➁ The talks are in early stages, following President Trump's push to revitalize the US semiconductor industry.

➂ TSMC would run the operations of Intel Foundry, but wouldn't own more than 50%.

AMDBroadcomFoundryIntelJoint VentureNVIDIAQualcommSEMICONDUCTORTSMC
7 months ago

➀ TSMC and Intel are reportedly still working on a potential joint venture to run Intel's manufacturing capacity;

➁ The joint venture would involve leading American fabless chip designers such as AMD, Broadcom, Nvidia, and Qualcomm;

➂ The initiative is in response to a request from President Trump's administration to strengthen Intel and ensure continued American control.

AMDBroadcomIntelIntel FoundryJoint VentureManufacturingNVIDIATSMCfoundryinvestmentsemiconductortechnology
8 months ago

➀ Samtec showcased its Si-Fly® HD 224 Gbps PAM4 interconnect technology at DesignCon, collaborating with Broadcom.

➁ The demo featured Broadcom’s 200 Gbps SerDes technology and Samtec’s high-speed cable systems.

➂ The collaboration aims to enhance system performance and open new horizons in multi-channel SerDes technology.

BroadcomBroadcom 200 Gbps SerDesDesignConHigh-speed InterconnectsInterconnect TechnologySamtecSerDesSi-Fly HDgaming
8 months ago

➀ Broadcom and TSMC are considering a deal with Intel to split the company, with Broadcom interested in Intel's chip design business and TSMC focusing on Intel's factories.

➁ Broadcom has been closely monitoring Intel's chip design and marketing business and has held informal discussions with advisors, but this could only happen if a partner is found for Intel's manufacturing business.

➂ The potential transactions, which were unimaginable before Intel's recent troubles, could result in the disintegration of Intel.

BroadcomTSMCsemiconductor industry