01/05/2025, 06:38 AM UTC
SK하이닉스在CES上公开新HBM,期待崔泰源和黄仁勋的会面SK Hynix Unveils New HBM at CES, Lee & Huang's Meeting Anticipated
➀ SK하이닉스在CES 2025上发布了最新的HBM(HBM3E)16芯片;
➁ 由于对英伟达的积极预期,SK하이닉스的股价上涨了6.25%;
➂ SK하이닉스计划发布存储容量高达48GB的HBM3E 16芯片;
➃ 期待在CES上崔泰源和黄仁勋的会面。
➀ SK Hynix unveils the latest HBM (HBM3E) 16-chip at CES 2025;
➁ SK Hynix's stock price surged by 6.25% due to positive expectations for NVIDIA;
➂ SK Hynix plans to release HBM3E 16-chip with expanded storage capacity of up to 48GB;
➃ Lee & Huang's meeting at CES is anticipated.
---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。