➀ Meta showcased its IcePack liquid-cooled networking rack at OCP 2025, targeting AI and high-performance networking applications;

➁ The rack uses pluggable optics (not co-packaged) and features 12x 64-port switches with partially populated columns for scalability;

➂ Despite liquid cooling integration, the design retains fans for redundancy, aiming to improve power density and thermal management in data centers.

➀ Traditional chip cooling methods dissipate heat from the surface, creating localized hot spots (dark silicon) that limit performance and energy efficiency.

➁ Researchers propose photonic cooling using anti-Stokes fluorescence, where targeted laser light absorbs heat from inside the chip and converts it into higher-energy light, enabled by a thin photonic cold plate and optical layers.

➂ Early tests show this method outperforms conventional air/liquid cooling with lower power consumption, potentially boosting processing speeds, reducing energy use, and recycling waste heat as light energy.

➀ Tryx Panorama SE 360 offers a 6.7-inch curved AMOLED screen with striking 3D effects, surpassing Thermalright's Wonder Vision in visual design;

➁ Despite its $279.99 price tag, it runs 15% quieter and costs $50 less than Thermalright's competing model;

➂ Exclusive Asetek Adela pump and improved Kanali software provide better customization than rivals, though static image burn-in risk remains.

➀ Stanford researchers developed ultra-thin diamond layers to address chip overheating by spreading heat efficiently, reducing temperatures by up to 70°C in GaN transistors.

➀ The diamond film, grown at a low 400°C, integrates directly with semiconductors and forms a silicon-carbide interface for effective heat transfer.

➂ Collaborations with TSMC, Samsung, and Applied Materials aim to commercialize this cooling solution for next-gen high-density chips and 3D chip stacks.

➀ The OceanGate Titan submersible's mission computers, composed of three Nuvo-5000LP fanless PCs, were crushed into a 100-pound metal-electronics mass during its 2023 implosion;

➁ Despite finding intact SanDisk memory cards, CT scans and physical extraction revealed deformed SSDs with cracked NAND chips, rendering all data unrecoverable;

➂ Thermal damage and extreme pressure effects highlight the limits of consumer-grade electronics in deep-sea environments.

➀ The South Korean-made Amech SGT-4 thermal paste emits acetic acid vapors, corrodes copper surfaces, and causes permanent damage to CPUs/coolers through 'ant nest corrosion'.

➁ Despite manufacturer claims of RoHS/REACH compliance, chemical analysis reveals its reactive acetoxy-curing formula reduces thermal conductivity by 30% and chemically 'glues' heatsinks to processors.

➂ Community backlash intensifies as the manufacturer dismisses evidence and attacks critics, eroding trust amid widespread reports of hardware damage.

➀ Frore Systems introduced LiquidJet coldplates capable of handling up to 4.4kW TDP, compatible with NVIDIA's Blackwell and next-gen Feynman AI GPUs.

➁ The 3D short-loop jet-channel microstructures reduce pressure loss by 4x and achieve hotspot density of 600W/cm², doubling traditional coldplate performance.

➂ Scalable design supports future processors like Rubin (3.6kW) and integrates flexibility for custom hotspot mapping, improving AI training efficiency and data center PUE.

➀ German overclocker Der8auer tested spray cooling on a Ryzen 7 9800X3D CPU using a makeshift setup, revealing challenges in achieving full IHS coverage.

➁ The experimental cooling method, inspired by supercomputers like Cray X1, relies on non-conductive mist sprayed directly on the chip but underperformed compared to traditional air cooling.

➂ Despite partial success, results highlighted the critical role of nozzle placement and coolant properties, emphasizing spray cooling's niche status in supercomputing.

➀ Edifier's Huazai New Cyber is a Bluetooth speaker mimicking a gaming PC with faux dual GPUs, liquid cooling, and RGB lighting.

➁ Features a 2.8-inch display for system stats, a 2.1 audio system with a subwoofer, and 35W USB charging ports.

➂ Priced at 1,499 yuan (~$210), currently exclusive to the Chinese market.

➀ Amatech's new two-component epoxy system addresses thermal management challenges with >1 W/m·K thermal conductivity, suitable for power electronics, LEDs, and battery modules;

➁ Compatible with diverse substrates (metals, ceramics, composites) and offers controlled curing for precision assembly processes;

➂ Designed for reliability in industrial, automotive, and energy storage applications, featuring dielectric stability and thermal cycling resilience.

➀ The UK faces strong local opposition to datacentre construction due to water supply concerns, but national policies mandate their approval even in green belts;

➁ Ed proposes adopting water-free liquid-cooling technology to the Secretary of State, allowing environmentally sustainable datacentre development;

➂ By positioning himself as a technical advisor for datacentre approvals, Ed gains significant political influence and access to lucrative government contracts.

➀ Microsoft developed a new cooling technology by etching microfluidic channels directly into silicon chips, aiming to improve heat dissipation for high-power AI accelerators and future 3D-IC designs;

➁ The prototype used a 3rd Gen Intel Xeon Scalable processor (likely Ice Lake) with DDR4 RDIMMs, demonstrating leak-proof packaging and structural integrity challenges in channel depth optimization;

➂ This approach reduces thermal interface layers and increases surface contact, potentially revolutionizing liquid cooling for advanced chip packaging architectures.