Recent #GaN news in the semiconductor industry

7 months ago

➀ Researchers developed lipid nanoparticles (LNPs) to deliver mRNA encoding the KRAS G12D neoantigen and cGAMP to reprogram the liver's immune environment and generate an antitumor response against metastatic pancreatic cancer.

➁ The LNPs successfully activated the type I interferon pathway, leading to the generation of CD8+ cytotoxic T cells capable of recognizing and attacking metastatic cancer cells.

➂ The study suggests that combining KRAS mRNA with a STING agonist strengthens the immune response against PDAC and offers a more effective approach than traditional immunotherapies.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
7 months ago

➀ Ed reflects on the sources of €1trn and his strategy to secure a share of it;

➁ Ed discusses the possibility of the US raising €800 billion for 'ReArm Europe' and €200 billion for 'InvestAI';

➂ Ed's assignment to the EU as 'Digital Envoy' and his plan to spend on meals and indulgences to identify influential figures in the spending of the funds.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
8 months ago

➀ A research team led by Professor Kyu-Young Park from POSTECH has developed technology to significantly increase the lifespan and energy density of electric vehicle (EV) batteries;

➁ The technology involves a 'nano-spring coating' technique that improves battery stability and performance;

➂ The research is published in ACS Nano and has the potential to revolutionize EV battery technology.

2nm3D IC3nmAIAI ChipAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGaNHBMHPCInfineonLaptopLinuxMicrochipNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecybersecurityiosmemorymonitorsemiconductor
8 months ago

➀ A new type of miniaturized pumps and valves using ultra-thin silicon films is presented at the Hannover Messe, developed by researchers at Saarland University. These pumps and valves operate without air pressure, motors, and lubricants, and can be operated in clean rooms. The team demonstrates a prototype of a new vacuum pump that can draw a vacuum up to 300 millibars.

➁ The technology is cost-effective, lightweight, and energy-efficient compared to current methods, with a 400 times lower energy consumption compared to conventional air-driven valves.

➂ The researchers have developed a novel actuator and pump technology that can be used in various applications, including robotic grippers, speakers, smart textiles, and haptic feedback.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
8 months ago

➀ Neil Druckmann discussed the evolving role of storytelling in video games with screenwriter Alex Garland, reflecting on the challenges and inspirations around narratives in games.

➁ Games like BioShock and The Last of Us demonstrated the full capability of narrative in gaming, challenging the industry's skepticism.

➂ Druckmann shared his early inspirations for narrative-driven games, including Monkey Island 2 and Half-Life 2.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago

➀ A team from Saarland University's Faculty of Engineering and Medicine is developing smart implants at the university and university hospital to monitor and promote healing in body bone fractures.

➁ The robotic implants can stiffen and soften through shape-memory technology, allowing for permanent monitoring of fracture healing.

➂ The research team is miniaturizing the technology for use in market screws as part of an EU project.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusBiomechanicsChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSmart MaterialsSoftwareSwitchTIautomotivecpucybersecuritygamingiosmedical technologymemorymonitorroboticssemiconductor
8 months ago

➀ Reputable leaker Billbil-Kun reports that Death Stranding 2 pre-orders are expected to start in March, with a release date likely announced at SXSW 2025.

➁ The game will have a Standard Edition at $69.99 and a Collector's Edition at $229.

➂ The leak also confirms that Death Stranding 2 will launch with a physical Standard Edition, priced at $69.99 USD / 69.99 EUR, along with a Collector's Edition planned for North America and Europe, retailing at $229 USD.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago

➀ Dr. Prady Gupta is the Founder and Chief Scientist at Infinita Lab and Infinita Materials, focusing on materials testing and specialized chemicals for high-tech industries.

➁ Infinita Lab offers a network of over 2,000 accredited labs for comprehensive materials testing services.

➂ Infinita Materials specializes in custom inorganic chemicals for sectors like semiconductors and batteries.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago

➀ The Nvidia GeForce RTX 5070 Founders Edition offers a 20% performance increase over its predecessor and a $549 MSRP.

➁ Concerns over retail availability and pricing, with potential for significantly higher prices in the short term.

➂ AMD's RX 9070 launch scheduled for the same day, posing competition and availability challenges.

2nm3nmAIAI ChipAI PCAMDArmAsusBlackwellCoolingDellEDAEUVGDDRGPUGaNGraphics CardHPCInfineonLaptopLinuxMicrochipNVIDIAPCIePrivacyRaspberry PiSoftwareSwitchTIautomotivecybersecuritygamingiosmemorymonitorsemiconductor
8 months ago

➀ Lois Rossmann, a renowned RepairTuber, expresses disappointment with Brother's shift towards becoming an 'anti-consumer printer company';

➁ Brother's recent firmware updates have disabled third-party toner and prevented color registration functionality on color devices;

➂ Older firmware versions are being removed from support portals, making it difficult for users to roll back updates.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHPCInfineonLaptopLinuxMicrochipPCIePrivacyRaspberry PiSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
8 months ago

➀ The article discusses the potential of diamond semiconductors to revolutionize power electronics due to their unmatched thermal conductivity and wide bandgap.

➁ Researchers at Saga University have developed the first diamond n-channel MOSFET, demonstrating high field-effect mobility and stability at high temperatures.

➂ Companies like Adamant Namiki Precision Jewel Co, Ltd, Saga University, Element Six, and Cree are leading the way in diamond semiconductor research and commercialization.

GaNMOSFETSiCpower electronicssemiconductor
8 months ago

➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.

➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.

➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.

3D IntegrationChipletEngineered SubstrateFD-SOIFoverosGaNIntelMoore's LawSEMICONDUCTORSamsungSiCSmart Cut™SoitecUCIe
8 months ago

➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.

➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.

➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago

➀ Three new GaN projects have been launched in China, covering the four major links of 'substrate-epitaxy-chip-module';

➁ Gaao Technology's GaN project has been settled in Zhejiang Province, focusing on GaN power devices and modules;

➂ Gaao Technology has developed a new national standard electric bicycle intelligent charging pile using GaN technology;

➃ Quanlei Optoelectronics has started a GaN epitaxy wafer/芯片 research and development and industrialization project;

➄ Guogan Xinkeshi has completed the environmental protection acceptance of its GaN substrate production base project.

GaNsemiconductor
8 months ago

➀ The development history of semiconductor materials, from the first generation to the third generation;

➁ The unique physical properties of silicon carbide (SiC) and gallium nitride (GaN), such as wide bandgap, high breakdown field, high electron mobility, and excellent thermal conductivity;

➂ The market landscape of SiC and GaN, including market size, key players, and application areas.

GaNSemiconductor MaterialsSiCpower electronics
8 months ago

➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;

➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;

➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago

➀ Infineon Technologies AG 推出了新的CoolGaN G3晶体管,包括100V和80V两种型号,提供超低电阻和卓越的热性能。

➁ 新的晶体管采用行业标准封装,易于多源和与硅基设计无缝集成。

➂ 样品将于2025年4月提供,这些新设备有望简化氮化镓技术在数据通信、消费电子和工业电源应用中的采用。

GaNInfineonPower