SemiVoice

➀ Microchip Technology launches SA15-28, a radiation-hardened 15W DC-DC power converter, and SF100-28 EMI filter for harsh space environments;

➁ Features compact size (1.68 cubic inches), operation in -55°C to +125°C, radiation tolerance up to 100 krad TID, and compatibility with existing satellite power systems;

➂ Utilizes discrete components for faster prototyping, scalable SWaP-optimized designs, and flexible COTS-to-qualified production options for space missions.

➀ Liquid Instruments introduced AI-powered Generative Instrumentation, enabling engineers to build custom test setups via natural language input;

➁ The system automates complex configurations, adapts to test requirements, and deploys real-time FPGA-based solutions without manual coding;

➂ Moku:Delta hardware platform offers 2 GHz bandwidth and multi-channel support, praised by researchers for accelerating advanced signal analysis workflows.

➀ PANJIT's HULV Series Ultra-Low VF Bridge Rectifiers feature 800 V reverse voltage rating and 175°C maximum junction temperature, designed for demanding environments;

➁ These rectifiers utilize planar EPI chip technology and polyimide layers to achieve 0.66 V forward voltage for reduced power loss, supporting AI servers, telecom equipment, and high-power systems;

➂ With surge current handling up to 400 A and multiple packaging options, they enable efficient thermal management in automotive, industrial, and display applications.

➀ TDK launches the InvenSense SmartAutomotive IAM-20680HV, a 6-axis IMU combining gyroscope and accelerometer for in-cabin automotive applications;

➁ Features high-temperature resistance (up to +105°C), compact design, low noise, and compatibility with existing TDK sensors;

➂ Supports navigation systems, door control, heads-up displays, and driving-style recording to enhance in-cabin safety and performance.

➀ TDK Corporation expands its GENESYS AC series with new 6kVA and 9kVA programmable AC power sources, offering scalability from 750W to 90kW;

➁ Features include a compact 3U design, multi-mode operation (AC/DC/hybrid), advanced waveform control, and built-in compliance testing for aerospace/automotive standards;

➂ Supports real-time simulation, HIL testing, and modular scaling for e-mobility and automated test equipment, with full safety certifications.

➀ Researchers at Tianjin University developed a non-destructive 'soft-touch' testing method for micro-LED wafers using flexible 3D probes with minimal pressure (0.9 MPa) to prevent surface damage;

➁ The system achieves 1/10,000th the pressure of traditional probes, ensuring wafer integrity and extending probe lifespan to over 1 million cycles;

➂ This innovation addresses critical quality control challenges in micro-LED production, enabling efficient yield screening and showing potential for commercialization in flexible electronics.

➀ LG Innotek unveiled the world's first automotive 5G communication module with satellite connectivity, enabling high-speed data transmission (tens of Mbps) in remote areas via 30MHz NR-NTN bandwidth;

➁ The module reduces latency to hundreds of milliseconds, supports real-time video/voice services, and ensures emergency connectivity for autonomous vehicles under 3GPP Release 17 standards;

➂ Designed for software-defined vehicles, it enhances navigation updates and safety systems, aligning with LG's goal to expand automotive components into an $800M business.

➀ SK Hynix unveiled a UFS 4.1 storage solution using 321-layer 4D NAND flash, marking the industry's highest layer count;

➁ It delivers 4300MB/s read speed, 15%-40% faster random operations, 7% power efficiency improvement, and ultra-thin 0.85mm design for AI smartphones;

➂ The 1Tb TLC chip will expand to SSDs, strengthening SK Hynix's position as a full-stack AI memory provider.

➀ Researchers at Science Tokyo developed BBCube - a 3D chip stacking architecture enabling direct DRAM-xPU integration with 10μm chip gaps and 10ms/chip bonding;

➁ Innovations include inkjet-based COW bonding, heat-resistant DPAS300 adhesive, and embedded capacitors for power delivery;

➂ Reduces data transmission energy by 80-95% compared to traditional 2D systems, promising breakthroughs for AI accelerators and edge devices.

➀ Micron Technology introduces the world's first LPDDR5X memory using 1γ node technology, achieving 10.7 Gbps speed and 20% power savings;

➁ The ultra-thin 0.61mm package enables slimmer designs for smartphones and foldable devices, supporting on-device AI tasks like real-time translation and image generation;

➂ Performance tests show 30-50% faster AI responses compared to previous generations, with potential applications in AI PCs and automotive systems.

➀ Apeiron Mobility offers a 6-month full-time internship in Bengaluru for electronics and embedded engineering, requiring skills in PCB design, C programming, and microcontroller development;

➁ Responsibilities include hardware prototyping, firmware development for 8/32-bit microcontrollers, and end-to-end project execution from ideation to testing;

➂ Successful candidates may receive job offers with annual salaries ranging from ₹200,000 to ₹600,000, along with certifications and recommendation letters.