Recent #GaN news in the semiconductor industry

9 months ago

➀ The GeForce RTX 5060's launch has been pushed back to April 2025 due to 'chip supply constraints';

➁ The delay affects the RTX 5070, RTX 5080, and RTX 5090, with limited supply expected leading to instant sellouts;

➂ The AI boom is increasing semiconductor demand, impacting the availability of the new GeForce RTX 50 Series.

2nm3nmAIAI PCAI chipAMDASUSArmChipletDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.

➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.

➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ Rutronik 分销的 GaN HEMT 单通道门驱动器 BM6GD11BFJ-LB 由 Rohm 生产,具有高达 2,500Vrms 的隔离电压和 60ns 的最小输入输出延迟;

➁ 驱动器在 -40 到 +125°C 的温度范围内工作,输入侧需要 5V 电源,消耗在 250μA 到 6mA 之间;

➂ 输入逻辑阈值分别为高电平 2.0V 和低电平 0.8V,并提供输入电阻以设置输出侧 GaN 晶体管的关闭状态。

GaNdriver
9 months ago

➀ The article discusses the potential of manufacturing semiconductors in space, highlighting the advantages of low gravity and vacuum environments, which can lead to higher quality and more efficient chips.

➁ It mentions the challenges, including the high cost of launching equipment to space and the logistical difficulties of setting up and maintaining facilities in space.

➂ Despite these challenges, the potential benefits of space-based semiconductor manufacturing are significant, including reduced carbon emissions, improved chip performance, and the possibility of new technological advancements.

3D printingGaNManufacturingSpacesemiconductor
9 months ago

➀ Allegro MicroSystems, Inc. 推出了两款先进的电流传感器IC——ACS37030MY 和 ACS37220MZ,专为汽车、工业和消费类应用设计。

➁ ACS37030MY 是一款全集成电流传感器IC,提供业界最快的响应时间,适用于保护宽禁带GaN功率器件。

➂ ACS37220MZ 是一款全集成霍尔效应电流传感器,具有150 kHz 带宽和故障引脚,成本效益高,适用于高效应用。

Allegro MicroSystemsGaNautomotiveindustrial
9 months ago

➀ EPC has introduced the EPC91104 7A 48V brushless DC motor driver evaluation board aimed at humanoid robot designers, utilizing GaN power transistors.

➁ The board measures 72 x 75mm and operates within a voltage range of 14 to 80V with peak currents up to 20A. It requires a separate signal generator board and proper heatsinking.

➂ The EPC91104 comes with four compatible control boards based on various microprocessors and can support sensorless and shaft-encoder operation, including field-oriented control.

GaNMotor Controlrobotics
9 months ago

➀ Element Six, a specialist in synthetic diamond materials, has launched Cu-Diamond, a copper-plated diamond composite material with high thermal and electrical conductivity.

➁ Designed to address thermal management challenges in advanced semiconductor devices, Cu-Diamond enables greater performance and reliability for applications like AI, HPC, and GaN RF devices.

➂ The new material offers thermal conductivity in the 800 W/mK range, optimized for high-demand applications, and can be manufactured in complex shapes for seamless integration into advanced packaging configurations.

AICoolingGaNHPCsemiconductor
10 months ago
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和;➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模,并寻求与代工厂的合作;➂ 35ELEMENTS拥有立方氮化镓材料的独家专利,并计划制造高效的光发射器,如创新型绿色发光二极管。
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
10 months ago
➀ Researchers at Stanford University have demonstrated that niobium phosphide films, just a few atoms thick, can conduct electricity more efficiently than copper. This is due to the material's unique surface conduction properties, which enhance its conductivity even as the film thickness decreases. ➁ The films can be fabricated at temperatures compatible with modern chip manufacturing processes, potentially leading to more powerful and energy-efficient electronics. ➂ The research could pave the way for exploring other topological semimetals as potential conductors in future electronics.
GaNsemiconductor
10 months ago
➀ Agileo Automation specializes in software solutions for semiconductor production equipment control and MES system integration; ➁ Marc Engel has 25 years of engineering experience in software development and equipment setup; ➂ The company's A²ECF-SEMI framework helps customers reduce time-to-market; ➃ Agileo Automation focuses on customer experience and service.
AI chipAgile AnalogAutomationEDA StandardsGaNMES SystemsOPC Unified ArchitectureSEMI StandardsSEMICONDUCTORSoftware Solutionsmicrochipsoftware
10 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
10 months ago

➀ Odyssey, a US GaN company, has entered the liquidation distribution process and will distribute assets to shareholders by December 23, 2023, with each share receiving $0.11 (about RMB 0.8);

➁ Odyssey held a special shareholders' meeting on June 3, 2023, approving a comprehensive liquidation, dissolution, and asset distribution plan, resulting in the redemption and cancellation of all issued capital stocks;

➂ Odyssey had a cash balance of approximately $1.837 million (about RMB 13.37 million) as of December 17, 2023, with most funds allocated to pay the distribution of $0.11 per share, totaling $1.606 million (about RMB 11.69 million);

➃ Odyssey had previously announced the sale of most of its assets to Power Integrations for $9.52 million (about RMB 67 million) in cash, with key employees joining PI's technical department.

GaNodyssey
10 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver
10 months ago
➀ Astute Group, a UK-based distributor, has signed a distribution agreement with Wise-integration, a French specialist in GaN and GaN ICs for power conversion, covering EMEA. The agreement aims to accelerate the adoption of GaN technology in key markets. ➁ WiseGan family of GaN power devices and WiseWare digital control software offer performance advantages over silicon solutions. ➂ The collaboration aims to drive innovation and integrate GaN technology across various sectors.
Data CentersGaNPower Conversionconsumer electronicselectric vehiclesindustrial automation
11 months ago
➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.
3D ICChipletGPUGaNHBMsemiconductor
11 months ago
➀ ROHM and TSMC have formed a strategic partnership to develop and produce GaN power devices for electric vehicle applications; ➁ The collaboration aims to integrate ROHM's device development technology with TSMC's GaN-on-silicon process technology; ➂ GaN power devices are currently used in consumer and industrial applications, and TSMC supports GaN technology for its potential environmental benefits in automotive applications.
GaNTSMC
11 months ago
➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.
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