➀ Cadence has introduced a new system chiplet based on Arm; ➁ The article delves into the motivations behind this move; ➂ The Briefing series provides further insights.

➀ Position your company as a leader in emerging technology; ➁ Lay claim to your share of a projected $5.8 billion market; ➂ Share thoughts with key experts and analysts; ➃ Show movers and shakers how your company is innovating

➀ The Fraunhofer IAF is enhancing its technology capabilities in III-V compound semiconductors for the APECS pilot line, contributing to the EU Chips Act.➁ The project is receiving €4.35 million from Baden-Württemberg's Ministry of Economic Affairs.➂ APECS aims to expand European R&D infrastructure and enhance semiconductor competitiveness.

➀ The APECS pilot line marks a significant step in strengthening Europe's semiconductor manufacturing and chiplet innovation. ➁ It aims to enhance technological resilience, cross-border collaboration, and global competitiveness. ➂ The line will provide advanced technology access to industry players, SMEs, and startups, establishing a strong foundation for European semiconductor supply chains. ➃ APECS focuses on bridging research with innovative developments in heterogeneous integration and advanced packaging.

➀ The APECS pilot line, a key part of the EU Chips Act, is launched to advance chiplet innovations and enhance European semiconductor manufacturing capabilities. ➁ The pilot line will provide low-barrier access to cutting-edge technologies for large companies, SMEs, and startups, ensuring secure and resilient semiconductor value chains. ➂ The APECS project is co-financed by the Chips Joint Undertaking and national funds from Belgium, Germany, Finland, France, Greece, Austria, Portugal, and Spain, with a total funding of 730 million euros over 4.5 years.

➀ Synopsys announces Ultra Ethernet and UALink IP for next-generation AI datacenters; ➁ The IPs support high-speed connectivity and intelligent multipathing; ➂ The technologies are expected to be launched in 2025.

➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.

➀ HomeResearch's new report predicts the chiplet market will grow to $411 billion by 2035; ➁ The technology is revolutionizing the semiconductor industry with modular and efficient SoC design alternatives; ➂ The report highlights the transformative potential of chiplet technology.

➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.

➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.

➀ Marvell introduces the Ara platform, a 3nm, 1.6Tbps PAM4 interconnect solution for AI bandwidth demand; ➁ The platform is designed for data centers, cloud providers, and AI enterprises, aiming to enhance AI infrastructure with scalable, high-performance solutions; ➂ The Ara platform uses advanced 3nm technology to reduce power consumption, making it ideal for scaling AI applications and large-scale computing.

➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.

➀ DeepX is set to receive the production wafer for its DX-M1 chip from Samsung Foundry by the end of the year; ➁ The chip's multi-project wafers are being produced in collaboration with design house Gaonchips and Samsung Foundry; ➂ DeepX has entered into a 7.2 billion won production deal with Gaonchi.

➀ Nvidia warns of a potential gaming GPU supply shortfall this quarter; ➁ The company achieves record profits with a 109% YoY increase in net income; ➂ The shortage is attributed to factors like the upcoming Blackwell launch and increased demand from AI and data center sectors.

➀ Cadence宣布开发并成功流片其首款基于Arm的系统芯片let；➁ 这标志着芯片let技术的重大进步；➂ 强调了Cadence通过其芯片let架构和框架推动行业领先解决方案的承诺。

➀ Alchip presents at TSMC OIP Ecosystem Forum; ➁ Challenges in 3D IC design overcome; ➂ Collaboration with Synopsys and TSMC for 3D design innovation

➀ NVIDIA has announced a new Grace Blackwell platform with the NVIDIA GB200 NVL4, which combines two Arm-based Grace CPUs and four Blackwell GPUs. The platform is designed for lower power deployments with a power consumption of just over 6kW. The NVL4 module is targeted to be a large node with up to 1.3TB of combined coherent memory. ➁ The GB200 NVL4 is set to ship in the second half of 2025. ➂ The NVL4 is designed as an alternative to the higher power and higher GPU count platforms offered by NVIDIA, targeting specific deployment needs.

➀ Panmnesia, a Korean startup focusing on CXL switch chips and CXL IP, has raised $60 million in Series A funding, valuing the company at $250 million. The funds will be used for the completion of the CXL 3.1 switch chip manufacturing, advancement of CXL IP, and global IT company collaborations. ➁ Founded in 2022, Panmnesia is led by CEO Myoungsoo Jung, a professor at KAIST, and includes Masters and PhD researchers. ➂ The round was led by InterVest and included new investors like Korea Investment Partners and existing investors such as Daekyo Investment.

➀ Hynix plans to start sampling HBM3e 16hi memory with 48 GB capacity per cube in H1 2025; ➁ HBM3e 16hi offers a high-capacity alternative before the production of HBM4 16hi; ➂ HBM3e 16hi can deliver a maximum capacity of 384 GB per system, surpassing NVIDIA’s Rubin at 288 GB; ➃ Transitioning from HBM3e to HBM4 will double the I/O count and increase die size, but the per-die capacity remains at 24 GB; ➄ HBM3e 16hi will adopt the Advanced MR-MUF stacking process for higher stack counts and computational bandwidth.

➀ Nvidia surpasses Apple in market capitalization for the second time this year; ➁ Nvidia's market cap surged by 214% in one year; ➂ Nvidia's focus on AI and GPU sales drives its growth; ➃ AMD's CDNA3-based MI325X and CDNA4-based MI355X could challenge Nvidia's market dominance.