Author page description
September 30
- Sounding Out Cool MEMS Technology
➀ Piezoelectric MEMS technology enables innovative applications such as miniature speakers;
➁ Demonstrates MEMS' potential in miniaturization and novel audio solutions;
➂ Highlights advancements in semiconductor materials for next-generation devices
- xMEMS Labs
➀ xMEMS Labs utilizes solid-state, all-silicon piezo MEMS technology to achieve high performance, compact size, and enhanced durability;
➁ The technology demonstrates significant improvements in energy efficiency and robustness compared to traditional solutions;
➂ Potential applications span consumer electronics, industrial systems, and emerging micro-acoustic devices.
September 29
- ASA Motion Link Delivers Camera and Sensor Connectivity
➀ ASA Motion Link simplifies automotive cabling design for camera and sensor integration;
➁ Provides high-speed communication capabilities to support advanced automotive systems;
➂ Enhives connectivity efficiency in next-generation vehicle architectures
September 21
- Time-Sensitive Networking @ EndeavorB2B Brands
➀ Explore curated content from EndeavorB2B brands focusing on time-sensitive networking (TSN) for real-time industrial and embedded systems;
➁ Highlight technical solutions addressing TSN requirements like deterministic communication and ultra-low latency;
➂ Discuss applications across automotive, manufacturing, and high-performance computing sectors
September 19
- EDGE Award 2025 Winners and Honorees
➀ Announcement of the 2025 EDGE Awards winners and honorees across semiconductor and technology industries;
➁ Recognition of companies like Silicon Motion (storage controllers), Silicon Catalyst (chip incubator), Analog Bits (IP solutions), and DeepCool/Noctua (cooling systems);
➂ Highlighted innovations in categories such as EDA tools (X-Epic) and automotive/memory solutions (Microchip).
September 18
- What's New in Zephyr 4.2?
➀ The article introduces Zephyr 4.2, highlighting its updates in embedded system solutions and real-time OS capabilities.
➁ New features include expanded hardware support for IoT devices, improved driver frameworks, and enhanced security protocols.
➂ Performance optimizations for power efficiency and developer workflow improvements are also emphasized.
September 3
- This Week in PowerBites: Fun-Forward STEM Education, Mighty MOSFETs, and Chips in Space
➀ Exploration of energy-efficient solid-state cooling technologies for thermal management;
➁ Highlighting a novel approach to STEM education aimed at making learning more engaging;
➂ Introduction of radiation-tolerant power devices designed for NewSpace and low Earth orbit satellite (LEOSat) applications.
August 26
- Top Stories of the Week: Aug. 25-29, 2025
➀ Highlights key technology and semiconductor-related stories from late August 2025;
➁ Features a collection of videos and podcasts covering industry trends;
➂ Provides a curated roundup of developments in AI, HPC, and related sectors.
August 25
- 11 Myths About Liquid-Cooling Technology
➀ Liquid cooling is essential for next-generation superchips operating at 2,800 W and above in data centers and AI infrastructure;
➁ The article debunks common myths about liquid-cooling technology's complexity, efficiency, and scalability;
➂ It highlights the transformative role of liquid cooling in addressing thermal challenges for advanced computing systems.
August 22
- Making MEMS Move Air and Fluids for Fun and Cooling
➀ Introduces xMEMS Labs' piezoMEMS technology for precise air/fluid manipulation;
➁ Explores applications spanning entertainment (e.g., audio devices) and advanced cooling systems;
➂ Showcases piezoelectric micro-actuators enabling efficient, compact solutions.
August 21
- Staying Current: Midyear 2025 EDA Tools for Engineers (Part 2)
➀ Part 2 introduces cutting-edge EDA tools for engineers to manage increasing chip complexities;
➁ Focuses on solutions for larger chip designs, tighter process nodes, and accelerated development timelines;
➂ Emphasizes maintaining quality standards while overcoming scaling challenges in semiconductor engineering.
August 20
- High-Current E-Fuses Bring Compact Circuit Protection to Data Centers
➀ Alpha and Omega Semiconductor introduces a new high-current e-fuse for circuit protection;
➁ Supports up to 60 A, targeting power rails in data centers and telecom infrastructure;
➂ Provides compact and reliable overcurrent/overvoltage protection solutions.
- Basic Op Amp Circuits with Quizplanation
➀ Andy recommends Texas Instruments' Application Note AN-20 and other resources for learning basic op amp circuits;
➁ The article includes a knowledge-testing op amp quiz with detailed answer explanations;
➂ Focuses on practical circuit design fundamentals and analog IC applications.
August 16
- Top Stories of the Week: Aug. 11-15, 2025
➀ Silicon Motion approves its acquisition by MaxLinear after receiving Chinese regulatory approval for the merger;
➁ Silicon Catalyst partners with Analog Bits to support analog chip startups, while DeepCool and Noctua launch new cooling products;
➂ Microchip introduces CarrierRATE system, X-Epic upgrades verification software, and Google enhances AI-driven security for devices.
August 15
- Embracing the Chiplet Journey
➀ Chiplets enable modular integration of multiple silicon dies, improving compute performance and reducing manufacturing costs for complex SoCs and processors;
➁ They support heterogeneous design flexibility by combining different process nodes and materials to optimize power, performance, and area;
➂ Chiplet architectures address semiconductor scaling challenges while meeting demands for AI, HPC, and advanced packaging solutions.
August 13
- Staying Current: Midyear 2025 EDA Tools for Engineers (Part 1)
➀ Modern EDA tools demonstrate enhanced speed and efficiency;
➁ They fundamentally transform engineers' approaches to silicon design and verification;
➂ Enable accelerated deployment of complex silicon solutions into mass production
- Where is VITA 100 Now and Where is It Headed? (Part 3)
➀ The video provides an update on the current status of the VITA 100 standards;
➁ It outlines the future roadmap for these standards;
➂ Viewers need to log in to access the content.
August 9
- Top Stories of the Week: Aug. 4-8, 2025
➀ Key developments in semiconductor manufacturing and 3D IC advancements were highlighted this week;
➁ Major AI chip innovations and partnerships between tech giants like NVIDIA and AMD emerged;
➂ High-Performance Computing (HPC) infrastructure projects gained momentum globally.
August 7
- The Chiplet Market Today and Where We’re Headed
➀ Objective Analysis' Jim Handy analyzes the growth trajectory of the chiplet market, highlighting its current state and future potential;
➁ The article discusses how chiplets address semiconductor scaling challenges through modular designs and heterogenous integration, enabling cost-effective solutions for advanced nodes;
➂ Key focus areas include 3D IC packaging advancements, ecosystem collaboration, and market adoption across AI, HPC, and consumer electronics.
August 2
- Arming a Chiplet System Architecture
➀ Arm introduced its Chiplet System Architecture to address key challenges in chip design;
➁ The architecture leverages the Neoverse Compute Subsystem and AMBA interconnect technology;
➂ Aims to enhance scalability and efficiency for complex system integration in advanced computing applications.
July 31
- UCIe: Open Chiplet Ecosystem at the Package Level
➀ Brian Rea from the UCIe Consortium introduces the Universal Chiplet Interconnect Express (UCIe) standard;
➁ UCIe aims to create an open ecosystem for chiplets at the package level, enabling modular chip design;
➂ The standard focuses on interoperability and scalability to advance heterogeneous integration in semiconductor packaging.
July 29
- Electrical Power Systems Meet the Density Demands of Small Satellites
➀ Electrical power subsystems must independently fulfill all energy needs for small satellites due to the absence of an external power grid in space;
➁ Radiation-tolerant power solutions and advanced technologies (e.g., GaN, SiC) are critical for efficiency and durability;
➂ System design prioritizes balancing power density, weight savings, and reliability for space-constrained applications.
July 19
- Top Stories of the Week: July 14-18, 2025
➀ Silicon Motion launched the SM2508 SSD controller supporting PCIe 5.0 and 2400MT/s NAND;
➁ Analog Bits partnered with DeepCool/Noctua for advanced thermal management modules;
➂ X-Epic released Lumina EDA platform accelerating 5nm/3nm chip design verification.
April 23
- This Week in PowerBites: Top Tech Trends, Hot Products, and More at APEC 2025
➀ Electronic Design’s editors bring back the latest innovative products from the IEEE’s APEC 2025 conference;
➁ Highlighting disruptive technologies and significant industry news;
➂ A special edition of PowerBites covers the event in detail.
April 19
- Top Stories of the Week: April 14-18, 2025
➀ Top Stories of the Week: Highlighting the most significant news events from April 14-18, 2025.
➁ Stay informed: Check out the latest in technology, business, and global events.
➂ Don't miss out: Keep up with the latest news that shaped the week.
April 16
- Design for Tariffs
➀ Design for X has expanded to include considerations for tariffs;
➁ This now encompasses aspects from testing to manufacturing and security;
➂ The integration of tariff considerations aims to optimize the entire design and production process.
April 15
- The Future of Electronics: Rigid vs. Flexible Semiconductors
➀ Flexible semiconductors open up new avenues for innovation;
➁ They enhance efficiency and intelligence in various applications;
➂ This article explores the potential of rigid versus flexible semiconductors.
April 11
- Navigating the Challenges of Multi-Motor EVs
➀ Multi-motor EVs offer optimal performance and handling through independent wheel control;
➁ The complexities in implementation need to be understood to meet expectations;
➂ This article discusses the challenges associated with multi-motor EV technology.
April 9
- 10BASE-T1L Single-Pair Ethernet Cable Reach and Link Performance
➀ Cable length significantly affects Ethernet performance and efficiency;
➁ 10BASE-T1L technology enables single-pair Ethernet cables to achieve better link performance;
➂ The article discusses the importance of link technology in single-pair Ethernet cables.
March 26
- Designing to Support Energy-Efficient Edge AI in Process Applications
➀ AI正逐渐向边缘迁移，这是好事；
➁ 设计师必须为巨大的电力需求做好准备；
➂ 准备合适的硬件和策略以优化效率。