➀ In-Circuit Emulation (ICE) emerged as a breakthrough in semiconductor verification, enabling 1,000x faster testing than traditional HDL simulations through FPGA-based hardware platforms;

➁ Early ICE faced limitations with rigid speed adapters and non-deterministic debugging, prompting a shift to virtual transaction-based verification by the 2000s for improved flexibility and software co-verification;

➂ Modern 3rd-gen speed adapters integrate real PHY layers, 100Gbps bandwidth, and multi-user deployment, bridging functional and system-level validation for complex SoCs.

➀ Silicon Labs announces SiXG301 as the world's first PSA Level 4 iSE/SE-certified SoC, offering advanced hardware/software protection against attacks like laser fault injection and side-channel vulnerabilities.

➁ The 22nm SoC, designed for IoT/edge devices, supports over-a-decade field operation with OTA updates and real-time monitoring, set for Q3 2025 availability.

➂ Collaboration with Keysight Labs validated the security features, addressing emerging threats once deemed theoretical.

➀ Calterah introduces its Dubhe UWB SoC series, compliant with IEEE 802.15.4ab and 802.15.4z standards, featuring ToF, PDoA, and TDoA modes;

➁ The SoCs integrate a RISC-V processor, BLE-assisted long-range detection (over 400m), and signal penetration capabilities for NLoS positioning, tested in automotive scenarios;

➂ Target applications include digital keys, in-cabin detection, and radar systems, with production approval expected in Q4 2025 using a 22nm CMOS process.

➀ According to a known leaker, the Snapdragon 8 Elite Gen 2 is being tested at a high 5GHz;

➁ The chip is expected to offer a 30% performance boost over its predecessor;

➂ It is manufactured with TSMC's 3-nm N3P process and could carry 32MB of L2 cache.

➀ Cadence launched Cerebrus AI Studio, the first agentic AI-driven multi-block SoC design platform, accelerating chip development by up to 5X;

➁ The platform uses autonomous AI agents for hierarchical design optimization, multi-user collaboration, and advanced analytics to enhance power-performance-area (PPA) targets;

➂ Early adopters like Samsung and STMicroelectronics reported 8-11% PPA improvements and 4X productivity gains, addressing semiconductor complexity and engineering shortages.

➀ Aion Silicon (formerly Sondrel) rebrands to focus on advanced SoC and ASIC solutions;

➁ Leverages decades of expertise to address complex semiconductor development challenges;

➂ Introduces new leadership team and vision to enhance customer-centric chip design services.

➀ QuickLogic's eFPGA IP is now integrated into Faraday's FlashKit™-22RRAM SoC development platform;

➁ The collaboration provides designers with unmatched flexibility and adaptability;

➂ The integration aims to enhance IoT edge solutions.

➀ Silicon Labs has introduced the BG29 Series 2 wireless SoCs designed for ultra-compact Bluetooth Low Energy (LE) devices, offering high performance, robust connectivity, and extended memory without sacrificing size or power.

➁ The BG29 SoCs are available in QFN and WLCSP packages, making them suitable for small devices like smart implants, glucose monitors, and disposable wearables.

➂ Key features include 1 MB of Flash memory, 256 kB of RAM, integrated DCDC boost, and a Coulomb counter for accurate battery monitoring, ensuring extended battery life and enhanced security with Secure Vault High and Virtual Secure Engine.

➀ Hailo, a pioneering chipmaker of edge AI processors, has selected Avnet ASIC as its silicon channel partner for future chip production.

➁ Avnet ASIC is a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica.

➂ The collaboration is for future chips to be produced using TSMC's silicon technology.

➀ The webinar discusses the impact of generative AI on technology evolution and the rise in compute power demand.

➁ It covers the trends in larger compute chips, multi-die systems, advanced packaging, and memory architectures.

➂ Key technologies like die-to-die communication, custom HBMs, and 3D stacking are explored in detail.

➀ The Raspberry Pi Pico 2's RP2350 SoC is now available for general sale.

➁ The RP2350A and RP2350B variants are available from Raspberry Pi resellers.

➂ The RP2350 features a dual-core Arm Cortex M33 and RISC-V Hazard3 CPU, with options for PSRAM expansion.

➀ Dolphin Semiconductor has announced a collaboration with Ingenic, a key player in high-performance SoC design in China.

➁ The company will provide Low Dropout (LDO) regulators in TSMC 22nm technology for camera applications.

➂ This collaboration reinforces Dolphin Semiconductor's position as a trusted partner in power management IP solutions.

➀ The new Intel Xeon 6 SoC, codenamed Granite Rapids-D, is expected to have up to 72 cores by late 2025;

➁ The initial batch will have up to 42 cores, with networking speeds of up to 200Gbps;

➂ The new series includes vRAN Boost and various built-in accelerators, targeting embedded markets.

➀ Arteris, Inc. introduces FlexGen, a revolutionary NoC interconnect IP;

➁ FlexGen accelerates chip development and optimizes performance efficiency;

➂ The solution addresses the growing demand for faster and more sustainable innovation in the automotive, datacenter, and consumer electronics sectors.

➀ Qorvo's QPF5100Q Ultra-Wideband (UWB) System-on-Chip (SoC) is now automotive-qualified and available for sampling.

➁ The SoC is designed to enable secure keyless entry, Digital Key systems, child presence detection, and motion sensing in automotive applications.

➂ It offers low-power operation and high integration, and is undergoing Design Verification Testing (DVT) with leading automotive manufacturers.

➀ RANSemi, a specialist in 5G O-RAN baseband, has partnered with Antevia Networks for its 5G SHIFT enterprise private 5G platform.

➁ The 5G SHIFT platform uses O-RAN fronthaul technology in its Radio Units (O-RUs) to enhance indoor wireless coverage.

➂ The platform is currently running live public trials in multiple locations across the United Kingdom.

➀ Nanjingwei's revenue from signal chain products accounted for more than half of its total revenue in the first half of 2024, reflecting the company's focus on this product line.

➁ Nanjingwei has launched the NovoGenius series SoC, aiming to become an international analog chip giant.

➂ The NSUC1610 SoC is designed for automotive applications such as electronic water valves and electronic expansion valves, providing an integrated solution for motor control.

➀ Silicon Labs has introduced new 'Lite' versions of its BG22 and BG24 Bluetooth Low Energy (BLE) system-on-chips (SoCs), the BG22L and BG24L, designed for cost-effective, low-power Bluetooth solutions.

➁ The BG22L features an Arm Cortex-M33F core running up to 38.4MHz with reduced memory compared to the BG22, while the BG24L supports machine learning and AI workloads with built-in accelerators.

➂ Both Lite variants lack the hardware cryptographic acceleration engines found in their standard counterparts and have fewer GPIO pins.

➀ Defacto Technologies, led by Dr. Chouki Aktouf, specializes in innovative SoC design solutions and has become a leader in front-end SoC integration.

➁ In 2024, the company focused on incorporating AI technologies into their R&D projects, aiming to introduce AI-based automation in their tools.

➂ For 2025, the company plans to focus on AI-based EDA and attend key industry conferences like DAC and DATE.