12/17/2024, 05:00 PM UTC
弗劳恩霍夫IAF在APECS试验线上扩展芯片创新技术能力Fraunhofer IAF Expands Technology Capabilities for Chiplet Innovations within the APECS Pilot Line
➀ 弗劳恩霍夫IAF正在增强其在III-V族化合物半导体领域的技术能力，为APECS试验线做出贡献，支持欧盟芯片法案。➁ 该项目将从巴登-符腾堡州经济事务部获得450万欧元的资金。➂ APECS旨在扩大欧洲研发基础设施，并增强半导体竞争力。➀ The Fraunhofer IAF is enhancing its technology capabilities in III-V compound semiconductors for the APECS pilot line, contributing to the EU Chips Act.➁ The project is receiving €4.35 million from Baden-Württemberg's Ministry of Economic Affairs.➂ APECS aims to expand European R&D infrastructure and enhance semiconductor competitiveness.
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