Recent #TSMC news in the semiconductor industry

11 months ago

➀ The article discusses the SRAM density of Intel's 18A process and TSMC's N2 process, highlighting the advantages of TSMC's N2 in terms of SRAM density and GAA technology.

➁ TSMC's 2nm process is expected to be introduced in 2025, with key technologies including GAA transistors and backside power supply networks.

➂ The challenges of manufacturing 2nm technology, including the complexity of GAA transistors and the dependency on EUV tools, are also addressed.

TSMCsemiconductor
11 months ago
➀ Intel's preliminary $8.5 billion Chips Act funding may be reduced due to the company's plans to withdraw investment in Ohio and unconvincing process development results. ➁ The reduction may also be affected by the Pentagon's $3 billion foundry deal with Intel. ➂ The Chips Act grant is now unlikely to exceed $7.5 billion, and Intel is also in line for $11 billion in government loans.
Chips ActIntelProcess technologyTSMCUS Governmentfundingsemiconductor
12 months ago

➀ TrendForce predicts that TSMC will capture 66% of the global wafer foundry market revenue in 2025.

➁ The growth rate of the wafer foundry market is expected to increase by 20.3% in 2025, with TSMC contributing significantly.

➂ Key factors affecting the 2025 wafer foundry market include macroeconomic uncertainty and export control policy upgrades.

➃ The demand for wafer foundry is expected to grow due to chip manufacturing localization in major countries and regions.

➄ The capacity utilization rate of wafer foundry factories is expected to continue to rise in 2025.

➅ TSMC will lead in capital expenditure among the top ten wafer foundry companies globally in 2025.

➆ China's 12-inch wafer capacity is expected to account for 34% of the global total by 2027.

➇ Taiwan's advanced process capacity will decrease to 54% by 2027, while the US will increase to 21%.

➈ The process technology roadmap shows that Intel is closing the gap, while Samsung is falling behind.

➉ TSMC still occupies 69% of the global advanced process capacity.

➊ AI brings new opportunities to the wafer foundry industry.

AIMarket OutlookTSMCWafer Foundry
12 months ago
➀ Hynix is set to sample HBM3e 16hi memory in the first half of 2025; ➁ Lightsynq Technologies emerges with $18 million in Series A funding for diamond optical interconnects in quantum computing; ➂ DigiKey is optimistic about the future of the electronics market; ➃ Texas Instruments aims to increase in-house manufacturing to 95% by 2030.
HynixDigiKeyHBM3ePackaging TechnologyQuantum ComputingTSMCTexas InstrumentsTrendForcememory
12 months ago

➀ TSMC founder Morris Chang revealed the details of his successor training, where Liu Deren refused to take over a department with only a few dozen employees, and Wei Zhejia accepted it with enthusiasm.

➁ Chang's retirement in 2005 was followed by a failed transition, and TSMC's performance declined under the leadership of his successor, Tsai Li-hsiung.

➂ Chang returned to TSMC in 2009 to turn around the company, improving technology and workforce morale, and transforming the company's market position.

TSMC
12 months ago

➀ TSMC plans to invest as scheduled over the next ten years, with the Economic Bureau preparing for water and electricity supply.

➁ TSMC may build one factory in Taiwan every year, according to Kuo Chih-wei of the Taiwan's top economic official.

➂ TSMC's 2nm orders have exceeded expectations, with Apple likely to remain the exclusive supplier of Apple's high-end processors.

TSMCinvestment
12 months ago
➀ The article discusses the current state of the chip business and the competition between American companies like Intel and TSMC, with a focus on the importance of process technology. ➁ It highlights Intel's ambitious plan to surpass TSMC in four years and the challenges faced by both companies in developing new technologies. ➂ The article notes the historical trend of semiconductor industry innovation and the significance of the upcoming innovations in transistor and power delivery.
IntelProcess technologyTSMCTransistorsemiconductor
12 months ago
➀ Hynix plans to start sampling HBM3e 16hi memory with 48 GB capacity per cube in H1 2025; ➁ HBM3e 16hi offers a high-capacity alternative before the production of HBM4 16hi; ➂ HBM3e 16hi can deliver a maximum capacity of 384 GB per system, surpassing NVIDIA’s Rubin at 288 GB; ➃ Transitioning from HBM3e to HBM4 will double the I/O count and increase die size, but the per-die capacity remains at 24 GB; ➄ HBM3e 16hi will adopt the Advanced MR-MUF stacking process for higher stack counts and computational bandwidth.
HynixChipletDRAMHBMMicrochipTSMC
12 months ago
➀ TSMC secures $11.6 billion in Chips Act funding; ➁ The funding includes $6.6 billion in Chips Act money, €5 billion in liabilities, and a 25% tax credit on infrastructure capex; ➂ The investment supports TSMC's $65 billion investment in three fabs in Arizona; ➃ US President Joe Biden highlights the investment as the largest foreign direct investment in a greenfield project in US history; ➄ TSMC CEO C.C. Wei emphasizes the importance of the Chips and Science Act in strengthening the US semiconductor ecosystem.
ArizonaChips ActTSMCinvestmentsemiconductor