11/22/2024, 06:53 PM UTC
最新资讯：美光开始提供HBM3e 16hi内存，Diamond推出量子计算机互连技术，DigiKey对电子市场持乐观态度，德州仪器关注AI和内部制造Most Read – TI & AI, Digikey upbeat, Diamond interconnects
➀ 美光计划在2025年上半年开始提供HBM3e 16hi内存；➁ Lightsynq Technologies获得了1800万美元的A轮融资，用于开发量子计算机的钻石光学互连技术；➁ DigiKey对电子市场的未来持乐观态度；➂ 德州仪器计划到2030年将内部制造比例提高到95%。➀ Hynix is set to sample HBM3e 16hi memory in the first half of 2025; ➁ Lightsynq Technologies emerges with $18 million in Series A funding for diamond optical interconnects in quantum computing; ➂ DigiKey is optimistic about the future of the electronics market; ➃ Texas Instruments aims to increase in-house manufacturing to 95% by 2030.
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