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December 10
- What is Wrong with Intel?➀ The departure of CEO Pat Gelsinger highlights ongoing issues at Intel; ➁ Semiconductor technology and supply chain control are crucial in the AI era; ➂ Intel's board of directors has made a series of poor decisions over the past two decades.
December 6
- CEO Interview: GP Singh from Ambient Scientific➀ GP Singh co-founded Ambient Scientific to develop high-performance, low-power AI microprocessors; ➁ The company's DigAn® technology enables ultra-low power AI applications without cloud dependency; ➂ GPX10 processor addresses inefficiencies in current AI hardware by offering better performance and lower power consumption; ➃ GP Singh emphasizes the importance of semiconductors in improving human lives.
- SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments➀ The complexity of SoC design validation due to hardware-software interactions; ➁ The exponential cost of fixing design bugs increases with each verification stage; ➂ Arm's SystemReady Certification Program simplifies the validation process by enhancing software compatibility and interoperability across devices.
December 5
- PDF Solutions Hosts Executive Conference December 12 on AI’s Power to Transform Semiconductor Design and Manufacturing➀ PDF Solutions to host AI Executive Conference focusing on AI in semiconductor design and manufacturing; ➁ Featuring keynotes, presentations, and panels from industry leaders; ➂ Discussing AI deployment, digital transformation, and use cases.
- Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules➀ The design of high-performance electric vehicle power modules presents challenges in managing high voltage and current systems, particularly in thermal management and safety compliance; ➁ An integrated approach combining electrical, mechanical, and thermal designs is essential for reliability; ➂ Cadence's advanced design tool solutions enhance the safety and efficiency of power modules.
December 4
- A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design➀ The rise of 2.5D and 3D multi-die design in mainstream applications; ➁ Comprehensive design flows provided by Synopsys and Ansys for multi-die projects; ➂ Expert insights from Marc Swinnen and Keith Lanier on technical knowledge and engaging presentation.
- SystemC Update 2024➀ SystemC Evolution Day focused on co-simulation with QEMU; ➁ SystemC 3.0.1 release aligns with IEEE standards; ➂ Fikas encourage community interaction; ➃ SystemC 1.0 celebrates 24 years of evolution.
December 3
- Innexis Product Suite: Driving Shift Left in IC Design and Systems Development➀ The Innexis Product Suite from Siemens EDA is designed to enable shift-left methodologies in IC and systems development; ➁ It offers tools for early hardware and software validation, enhancing the overall development and verification process; ➂ The suite includes components like Developer Pro, ANA, and VSI that facilitate continuous development and faster time-to-market.
- How Breker is Helping to Solve the RISC-V Certification Problem➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
December 2
- CEO Interview: Ollie Jones of Sondrel➀ Ollie Jones emphasizes customer focus at Sondrel, ensuring high-quality personal service in custom chip delivery; ➁ Sondrel expands into the American market after establishing a strong reputation in Europe and Israel; ➂ The company differentiates itself by providing tailored services for complex chip designs.
November 29
- CEO Interview: Dr. Yunji Corcoran of SMC Diode Solutions➀ Dr. Yunji Corcoran discusses her extensive experience in the power semiconductor field; ➁ SMC Diode Solutions' focus on power conversion and efficiency solutions; ➂ The company's differentiation through advanced technology, customer service, and R&D.
- CEO Interview: Rajesh Vashist of SiTime➀ SiTime has pioneered the Precision Timing market with MEMS technology; ➁ The company addresses critical challenges in timing technology with environmental stressors; ➂ SiTime focuses on AI data centers, automotive safety, IoT, and aerospace.
November 28
- CEO Interview: Dr. Greg Newbloom of Membrion➀ Membrion specializes in electro-ceramic desalination membranes for complex wastewater treatment in industries like semiconductor manufacturing. ➁ The company's ceramic membranes offer durable, cost-effective solutions. ➂ Membrion differentiates itself by addressing the challenges of corrosive and heavy-metal-laden wastewater, providing on-site, reliable treatment systems.
- MZ Technologies is Breaking Down 3D-IC Design Barriers with GENIO➀ MZ Technologies is addressing complex challenges in 2.5D and 3D IC design with advanced EDA software, GENIO; ➁ The company has announced a roadmap for GENIO with enhancements for 2025, focusing on thermal and mechanical stress issues; ➂ GENIO is designed to facilitate the design and optimization of complex IC systems.
November 27
- Ansys Package Reliability Issues Cost Money
➀ Package reliability analysis is often overlooked during initial product development;
➁ Package reliability issues uncovered during product qualification cost significantly;
➂ The rapid adoption of 2.5D and 3D packaging exacerbates these issues due to new materials and extended thermal environments;
➃ Low-K dielectric materials are more prone to catastrophic cracking due to higher modulus of rigidity and thermal stress;
➄ Solder fatigue is another reliability issue affecting solder joint connections between package and PCB;
➅ ANSYS Multiphysics can be used for thorough thermal-mechanical simulation of material stackup to mitigate these issues.
November 26
- One Thousand Production Licenses Means Silicon Creations PLL IP is Everywhere➀ Silicon Creations achieves a significant milestone with over 1,000 licenses sold for its Fractional-N PLL IP; ➁ The technology offers versatile frequency synthesis capabilities, expanding its application potential; ➂ Deployed in various markets, the IP demonstrates adaptability across different applications.
November 25
- Cadence Paints a Broad Canvas in Automotive➀ Cadence推出一系列关于汽车设计趋势和挑战的网络研讨会；➁ 预计汽车半导体市场到2029年将以11%的复合年增长率增长；➂ 汽车OEM和一级供应商正朝着垂直整合的趋势发展。
November 22
- CEO Interview: Sandeep Kumar of L&T Semiconductor Technologies Ltd.➀ Sandeep Kumar discusses his extensive experience in technology and leadership positions in high-growth companies; ➁ L&T Semiconductor Technologies Ltd. focuses on designing smart semiconductor devices for global markets; ➂ The company addresses the technology transformation in sectors like mobility, industrial, and energy.
- Semiconductors Slowing in 2025➀ WSTS报告2024年第三季度半导体市场增长1660亿美元，同比增长10.7%；➁ 英伟达因AI GPU的强劲表现成为最大半导体公司；➂ 2024年第四季度展望显示数据中心市场将推动Nvidia、美光和AMD的收入增长；➃ 2025年展望显示AI将推动服务器增长，但增速将放缓。
- Relationships with IP Vendors➀ The importance of asking the right questions to IP vendors and ensuring functional models are in place; ➁ The challenges of verifying CPU IP, especially high-performance designs; ➂ The role of RISC-V in the open-source ecosystem and the importance of collaboration among vendors.
November 21
- I will see you at the Substrate Vision Summit in Santa Clara➀ The Substrate Vision Summit in Santa Clara is expected to attract a large crowd, focusing on semiconductor substrates and their impact on 3D IC performance. ➁ AI's role in transforming the semiconductor value chain will be discussed, highlighting its impact on scaling, complexity, and high-performance chip demands. ➂ Keynote speakers and panel discussions will explore advancements in semiconductor materials, AI computing, and the role of universities in technology development.
November 20
- The Immensity of Software Development and the Challenges of Debugging Series (Part 4 of 4)➀ The impact of AI on software and hardware development; ➁ The evolution of software from 'eating the world' to 'consuming hardware'; ➂ The comparison between traditional software and AI applications in terms of processing hardware; ➃ The two-stage development process of AI software and its validation challenges.
November 19
- Alchip is Paving the Way to Future 3D Design Innovation➀ Alchip presents at TSMC OIP Ecosystem Forum; ➁ Challenges in 3D IC design overcome; ➂ Collaboration with Synopsys and TSMC for 3D design innovation
- Handling Objections in UVM Code➀ This blog discusses the use of objections in UVM code for synchronization. ➁ It provides examples and alternative approaches to using uvm_objection efficiently. ➂ The importance of not overusing objections to avoid slowing down simulations is emphasized.
November 18
- GaN HEMT modeling with ANN parameters targets extensibility➀ An improved ASM-HEMT hybrid model using ANN parameters is explored for GaN HEMT modeling; ➁ The challenge of accurate wide-range S-parameter fit is addressed; ➂ ANN-based parameter fitting reduces the discrepancy between measurements and simulations.
- AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 – China & Delays & CHIPS Act?➀ AMAT's Qtr performance meets expectations but outlook is weak; ➁ AI strength can't offset market weakness; ➂ Regulatory and China risks add uncertainty.
November 16
- More Headwinds-CHIPS Act Chop?- Chip Equip Re-Shore? Orders Canceled & Fab Delay➀ The CHIPS Act faces potential cuts and modifications under the new administration; ➁ The flow of equipment to reshore may be reversed; ➂ Recent order cuts and fab delays are negative signs; ➃ SMIC comments indicate overcapacity in China; ➄ US legislators question offshore equipment sales to China.
November 15
- CEO Interview: Dr. Sakyasingha Dasgupta of EdgeCortix➀ EdgeCortix is focused on energy-efficient AI processing; ➁ Solving AI performance and power inefficiency at the edge; ➂ Strong demand in smart cities, industrial, aerospace, and security industries.
- Analog IC Migration using AI➀ The manual process of migrating DRAM chips between process nodes is a challenge; ➁ Cadence's Virtuoso Studio tools enable AI-driven design migration; ➂ AI-powered flow automates the migration process, improving productivity and reducing engineering effort.
- Next Generation of Systems Design at Siemens➀ Introduction to Siemens' next-generation EDA tools; ➁ Overview of new features like unified GUI, AI integration, and cloud connectivity; ➂ Benefits for engineers in productivity and collaboration; ➃ Integration with other Siemens products and PLM systems