➀ e-con Systems announced expanded camera support for Renesas' RZ/G3E microprocessor to enhance edge AI vision solutions for industrial automation and smart city applications;

➁ The RZ/G3E, optimized for low-power edge computing, now integrates e-con's production-ready cameras: e-CAM22_CURZH (Sony STARVIS IMX462) for low-light imaging and e-CAM25_CURZH (onsemi AR0234) with global shutter for fast-moving objects;

➂ The collaboration accelerates time-to-market for AI vision systems, leveraging Renesas' dual-display support and Arm Cortex-A55 processor for high-performance edge applications.

➀ TekStart transformed from a commercialization partner to a semiconductor/AI-focused venture builder, offering end-to-end support for innovators.

➁ Its business unit Newport by ChipStart delivers 65 TOPS at under 2W, addressing supply chain resilience and AI-driven edge computing demands.

➂ Key applications include security, agriculture, AR/VR, and industrial automation, emphasizing real-time intelligence and energy efficiency.

➀ Astute Group与瑞典边缘AI模组开发商Alp Lab达成全球分销协议，推动其Edge-1 AI Module（E1M）平台应用；

➁ E1M平台采用统一硬件设计及标准化软件堆栈，支持多处理器架构切换，显著降低开发成本与时间；

➂ 方案集成Alp SDK开源工具，支持跨厂商硬件无缝集成，增强物联网应用的本地数据处理能力并减少对云端的依赖。

➀ CHIIPS Podcast #12 features Dr. Sakya Dasgupta from EdgeCortix, discussing neural computation and AI at the edge, with a focus on power-efficient hardware-software co-design;

➁ The conversation highlights EdgeCortix’s DNA IP, Sakura processors for robotics/defense systems, and collaborations with NASA, the US Defense Innovation Unit, and Japan’s semiconductor initiatives;

➂ The podcast series aims to explore key electronics industry trends, with future episodes covering sector updates and expert predictions.

➀ The 45th Symposium on VLSI Technology & Circuits will be held in Kyoto, Japan from June 8-12, 2025;

➁ Topics include DRAM technology innovation, VLSI for AI growth, and challenges in semiconductor design technologies;

➂ The program features joint focus sessions, short courses, and panel discussions on sustainability and education.

➀ The Fraunhofer IPMS is involved in a research project called InSeKT to develop new technological approaches for integrating AI at the edges of IT networks.

➁ The project aims to enable complex calculations directly where data is generated, improving data protection and real-time capabilities.

➂ Fraunhofer IPMS is working on sensor technology, including gas analysis using IMS, near-infrared photodetector evaluation, and adapted use of CMUTs for improved imaging.

➀ Hailo, a pioneering chipmaker of edge AI processors, has selected Avnet ASIC as its silicon channel partner for future chip production.

➁ Avnet ASIC is a leading provider of ASIC and SoC full turnkey solutions and a business division of Avnet Silica.

➂ The collaboration is for future chips to be produced using TSMC's silicon technology.

➀ Lantronix has launched the Open-Q 8550CS System-on-Module (SOM), built on the Qualcomm Dragonwing QCS8550 processor, offering low-power on-device AI and ML capabilities.

➁ The SOM is designed for demanding AI/ML applications in extreme Edge computing environments, supporting advanced video processing, AI inference, and Edge AI gateway integration.

➂ Key features include low power consumption with a 4nm process, dual eNPU for AI acceleration, and support for high-speed connectivity and multiple display interfaces.

➀ Synaptics has introduced the SR-Series adaptive microcontrollers (MCUs) to expand its Astra AI-Native platform for Edge AI applications, offering three performance tiers: performance (100 GOPS), efficiency, and ultra-low-power always-on (AON) processing.

➁ These MCUs feature an Arm Cortex-M55 core combined with an Arm Ethos-U55 neural processing unit (NPU), along with multiple camera interfaces, secure memory, and accelerators, targeting applications such as battery-powered security cameras, sensors, and smart appliances.

➂ The SR-Series supports the Astra Machina Micro development kit and an open-source SDK, enabling developers to create context-aware cognitive IoT devices with adaptive vision, audio, and voice processing capabilities.

➀ AI正逐渐向边缘迁移，这是好事；

➁ 设计师必须为巨大的电力需求做好准备；

➂ 准备合适的硬件和策略以优化效率。

➀ Ceva recently unveiled the XC21 and XC23 DSP cores for advanced wireless and edge AI processing;

➁ The XC21 is optimized for low-power, high-performance applications in cost-sensitive markets;

➂ The XC23 provides significant performance improvements for high-end communications with AI capabilities.

➀ Synaptics has expanded its Veros connectivity portfolio with the SYN461x family;

➁ The SYN461x is designed for embedded Edge AI IoT and offers ULP Wi-Fi, Bluetooth 6.0, and BLE;

➂ It is optimized for power, integration, size, and market time while providing high performance and interoperability.

➀ AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, has announced a strategic partnership with Faraday Technology Corporation.

➁ The collaboration aims to enhance AONDevices' production capabilities for its advanced AI processors.

➂ Faraday Technology brings its comprehensive manufacturing expertise to the partnership.

The Fraunhofer Institute for Integrated Circuits IIS has developed an AI chip for processing Spiking Neural Networks (SNNs). The SENNA spiking neural network inference accelerator, inspired by brain function, consists of artificial neurons and can process electrical impulses (spikes) directly. Its speed, energy efficiency, and compact design enable the use of SNNs directly where data is generated: in edge devices.

SNNs consist of a network of artificial neurons connected by synapses. Information is transmitted and processed in the form of electrical impulses, allowing pulsing networks to be the next step in artificial intelligence: faster, more energy-efficient, and closer to the processing method of the human brain. To bring these advantages into application, small, efficient hardware that mimics a structure of neurons and synapses is needed. For this, the Fraunhofer IIS has developed the neuromorphic SNN accelerator SENNA as part of the Fraunhofer project SEC-Learn.

SENNA is a neuromorphic chip for fast processing of low-dimensional time series data in AI applications. The current version consists of 1024 artificial neurons on less than 11 mm² of chip area. Its low reaction time down to 20 nanoseconds ensures precise timing in time-critical applications at the edge. This makes it particularly strong in real-time event-based sensor data processing and in closed control systems, such as the control of small electric motors with AI. With SENNA, AI-optimized data transmission can be realized in communication systems. There, the AI processor can analyze signal streams and adjust transmission and reception methods as needed to improve efficiency and performance.

➀ YorChip, in collaboration with SiliconIPs, has developed a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core;

➁ The IP core is optimized for size, power, and latency;

➂ It targets edge AI applications and Data Center Accelerator developers requiring low power and high performance.

➀ NXP is acquiring Kinara, a specialist in programmable discrete neural processing units (NPUs).

➁ The acquisition is valued at $307 million and is expected to close in the first half of 2025.

➂ Kinara's NPUs and software enable energy-efficient AI performance across various neural networks.

➀ AONDevices specializes in super-low-power Edge AI solutions with a focus on energy efficiency and high accuracy.

➁ The AONx360 platform simplifies ML model creation and deployment.

➂ AONDevices differentiates itself through an end-to-end approach combining ML chips, models, and software.