➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.

➀ SK Hynix has placed a significant order for thermal compression bonders from ASMPT; ➁ The equipment is for the production of HBM3E 12H, SK Hynix's newest high-bandwidth memory; ➂ The order includes over 30 units of the equipment.

➀ HBM is expected to take 10% of the DRAM units but 30% of the revenues due to its higher ASP; ➁ Sourcengine reports that HBM supply is booked out to the end of 2025, with conflicting views on a potential shortage or oversupply next year; ➂ Regular DRAM ASPs are low and may not improve until H2 2025.

➀ Rambus details its new HBM4 memory controller with speeds up to 10Gb/s and bandwidth of 2.56TB/sec; ➁ HBM4 offers 33% faster bandwidth than HBM3E and twice the speed of HBM3; ➂ SK hynix and Samsung are expected to mass produce HBM4 memory by the end of 2025.

Hynix has started mass production of a 36GB 12-layer HBM3E memory, marking the largest capacity HBM to date. The company achieved this by stacking 12 layers of 3GB DRAM chips, making each chip 40% thinner than before and using TSV4 technology. The new product offers improved heat dissipation performance and stability compared to the previous generation, and is designed to excel in speed, capacity, and stability, crucial for AI memory.

➀ SK hynix has begun mass production of its 36GB HBM3E with 12 high dies; ➁ The new HBM3E is designed for next-generation high-performance computing and gaming applications; ➂ This marks a significant advancement in memory technology.

➀ The semiconductor industry in South Korea is experiencing a better year with rising DRAM and NAND prices and strong demand for HBM due to AI. ➁ Morgan Stanley predicts a downturn in the semiconductor industry, with DRAM prices expected to decline and HBM supply exceeding demand. ➂ SK Hynix and Micron remain optimistic about the HBM market, with SK Hynix planning to increase HBM revenue by over 300% this year and Micron expecting HBM to contribute billions to its revenue.

➀ The Marana 4.2B-6 back-illuminated sCMOS camera has been significantly enhanced for Physical Sciences and Astronomy applications; ➁ A new Low Noise Mode reduces read noise to 1.0e-; ➂ A new High-Speed mode with 2-lane CoaXPress connection allows for 135 fps operation; ➃ A new Long Exposure Mode suppresses amplifier glow; ➄ A 'Global Clear' mode for Rolling Shutter sensors improves synchronization and minimizes exposure 'dead times'.

➀ The transition of AI servers from HBM to CXL technologies; ➁ The importance of high-speed memory bandwidth in AI servers; ➂ The rise of HBM technology to overcome 'memory wall' issues; ➃ Market dominance of HBM suppliers like SK Hynix, Samsung, and Micron; ➄ The impact of new interconnect technologies like CXL and MCR/MDIMM on AI server performance; ➅ Micron's product roadmap and Rambus' interconnect solutions; ➆ The significance of SPD EEPROMs in DDR5 memory systems.

➀ The demand for High Bandwidth Memory (HBM) is increasing due to the growth of AI models, which require more parameters and energy-efficient training and inference. ➁ HBM is expected to grow at a CAGR of 50% in the coming years, driving the need for advanced DRAM wafer processing equipment and HBM stack creation. ➂ Applied Materials is a leading supplier in this field, with over 50% share in HBM packaging process equipment spending and significant innovations in DRAM processing and 3D packaging technologies.

➀ SK Hynix aims to develop differentiated HBM products to meet specific customer needs in the AI sector. ➁ The company's Advanced Package Development leader emphasizes the need for flexible and scalable technology in AI memory development. ➂ HBM memory has evolved rapidly, with HBM3E reaching 9.2 GT/s - 10 GT/s and HBM4 set to feature a 2048-bit interface. ➃ SK Hynix plans to offer customized or semi-customized HBM4 solutions, considering various customer preferences and technologies.

➀ Modern electronic design trends necessitate SI-PI cosimulation to minimize power consumption and voltage levels while increasing speed. ➁ The PDN should be meticulously modeled to minimize input impedance seen by I/O drivers, and combined with channel models to accurately predict output eye diagrams. ➂ The article details the complete modeling process of SI-PI cosimulation based on HBM, highlighting considerations for high-frequency PDN design at the chip and package levels.

➀ Q2 IC sales increased by 27% YoY and are expected to grow by 29% in Q3 2024. ➁ Q2 installed fab capacity reached 40.5 million wafers per quarter, projected to rise by 1.6% in Q3. ➂ Memory capacity increased by 0.7% in Q2 and is forecast to grow by 1.1% in Q3, supported by demand for HBM and improving memory pricing.

➀ Samsung is expected to tape-out its next-generation HBM4 memory in Q4 2024. ➁ Mass production of HBM4 is scheduled for Q4 2025, targeting NVIDIA's next-gen Rubin R100 AI GPU. ➂ The AI industry's demand is driving the growth of HBM memory, with SK hynix and Samsung investing heavily in production capabilities.

➀ HBM market is rapidly expanding due to its critical role in AI computing, with SK Hynix leading in supply and innovation. ➁ SK Hynix is collaborating with TSMC to maintain its lead in the next-generation HBM products, which are expected to see a 40% increase in transmission speed. ➂ Samsung is increasing its investment in HBM to catch up, with plans to quadruple its supply in 2024 and double it again in 2025.

➀ HBM is crucial for AI but expensive, with prices up to 5 times that of DDR5. ➁ Jim Keller, a prominent chip architect, criticizes the high cost of AI chips and advocates for alternatives to HBM. ➂ Tenstorrent, a company led by Keller, aims to provide cost-effective AI solutions without using HBM, focusing on efficiency and affordability.

➀ HBM addresses bandwidth limitations in traditional 2D packaging by using stacked memory chips and TSV technology. ➁ Key technologies in HBM include advanced packaging, microbump interconnects, and TSV. ➂ HBM offers higher bandwidth and lower power consumption compared to GDDR, making it suitable for high-performance computing and graphics processing.

➀ South Korea's memory chip exports to Taiwan surged 225% in the first half of 2025. ➁ The surge is due to the high demand for HBM memory in AI GPUs. ➂ Taiwan became the third-largest importer of South Korean memory chips, surpassing Vietnam and the United States.

➀ SK hynix has secured up to $450 million in direct funding and access to $500 million in loans to build an advanced memory packaging facility in Indiana. ➁ The facility is expected to start operations in 2028, producing HBM4 or HBM4E memory. ➂ The project aims to strengthen the U.S. semiconductor industry and create up to 1,000 jobs.

➀ SK Hynix is set to receive $450 million from the US Chips Act to build a $3.87 billion HBM packaging plant in Indiana. ➁ The facility, located at Purdue University Research Park, will mass-produce next-generation HBM chips, crucial for AI system training. ➂ The investment will establish a research hub in Indiana in partnership with Purdue University, enhancing the U.S. semiconductor ecosystem and technological leadership.