09/30/2024, 01:24 PM UTC
海力士开始大规模生产36GB 12层HBM3E内存Hynix in mass production of 12-layer 36GB HBM
海力士已经开始大规模生产36GB的12层HBM3E内存，这是迄今为止容量最大的HBM产品。通过堆叠12层3GB的DRAM芯片，每个芯片比之前薄40%，并使用TSV4技术，公司实现了这一目标。与上一代产品相比，新产品在散热性能和稳定性方面有所提高，旨在在速度、容量和稳定性方面表现出色，这对于AI内存至关重要。Hynix has started mass production of a 36GB 12-layer HBM3E memory, marking the largest capacity HBM to date. The company achieved this by stacking 12 layers of 3GB DRAM chips, making each chip 40% thinner than before and using TSV4 technology. The new product offers improved heat dissipation performance and stability compared to the previous generation, and is designed to excel in speed, capacity, and stability, crucial for AI memory.
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