➀ SK Hynix is set to receive $450 million from the US Chips Act to build a $3.87 billion HBM packaging plant in Indiana. ➁ The facility, located at Purdue University Research Park, will mass-produce next-generation HBM chips, crucial for AI system training. ➂ The investment will establish a research hub in Indiana in partnership with Purdue University, enhancing the U.S. semiconductor ecosystem and technological leadership.