08/07/2024, 01:16 PM UTC
海力士获得4.5亿美元资金在印第安纳州建立HBM封装工厂Hynix gets $450m to set up HBM packaging plant in Indiana.
➀ 海力士将从美国芯片法案中获得4.5亿美元，用于在印第安纳州建立一座38.7亿美元的HBM封装工厂。➁ 该工厂位于普渡大学研究园区，将大规模生产下一代HBM芯片，这对AI系统训练至关重要。➂ 这项投资将与普渡大学合作，在印第安纳州建立一个研究中心，加强美国半导体生态系统和科技领导地位。➀ SK Hynix is set to receive $450 million from the US Chips Act to build a $3.87 billion HBM packaging plant in Indiana. ➁ The facility, located at Purdue University Research Park, will mass-produce next-generation HBM chips, crucial for AI system training. ➂ The investment will establish a research hub in Indiana in partnership with Purdue University, enhancing the U.S. semiconductor ecosystem and technological leadership.
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