1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.

1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.

1. Micron announced that its High Bandwidth Memory (HBM) production capacity is fully booked until 2025. 2. This follows SK Hynix's earlier statement that its HBM capacity is sold out until next year. 3. Micron reported a revenue of $6.811 billion for the fiscal quarter from March to May, marking an increase.

1. Introduction to High Bandwidth Memory (HBM); 2. Key features of HBM: high memory bandwidth, low power consumption, large memory capacity, and fast transfer rates; 3. Importance of understanding HBM characteristics for appreciating its impact on technology.

1. SK hynix is accelerating the development of HBM4 and HBM4E memory, originally planned for mass production in 2026 and 2027 respectively. 2. Now, HBM4 is set for mass production in 2025, and HBM4E will enter mass production in 2026, aligning with NVIDIA's accelerated AI accelerator release cycle. 3. The next-generation HBM4 offers a 40% increase in bandwidth and a 70% reduction in power consumption compared to HBM3E, which is the fastest memory in the world.

1. Micron Technology is building new test production lines for advanced HBM in the US; 2. The company is also considering HBM manufacturing in Malaysia for the first time; 3. Micron aims to triple its market share for HBM by 2025, targeting a 'mid-20' percentage range.

1. Samsung is set to introduce a revolutionary technology that allows stacking High Bandwidth Memory (HBM) on CPUs or GPUs this year. 2. The SAINT-D HBM, a key component of this technology, is scheduled for a 2024 rollout. 3. This development paves the way for the integration of HBM4 with Samsung's SAINT-D interconnection and packaging technology.

1. Samsung has emphasized the necessity of hybrid bonding for the production of a 16-stack High Bandwidth Memory (HBM) in a recent paper. 2. The paper was presented at the 2024 IEEE 74th Electronic Components and Technology Conference in Colorado, discussing D2W (die to wafer) copper bonding.

SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee

Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration

SK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp

Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix this week is very publicly announcing that the company's high-bandwidth memory (HBM) production capacity has already sold out for the rest of 2024, and even most of 2025 has already sold out as well. SK hynix currently produces various types of HBM memory for customers like Amazon, AMD, Facebook, Google (Broadcom), Intel, Microsoft, and, of course, NVIDIA. The latter is an especially prolific consumer of HBM3 and HBM3E memory for its H100/H200/GH200 accelerators, as NVIDIA is also working to fill what remains an insatiable (and unmet) demand for its accelerators. As a result, HBM memory orders, which are already placed months in advance, are now backlogging well into 2025 as chip vendors look to secure supplies of the memory stacks critical to their success. This has made SK hynix the secnd HBM memory vendor in recent months to announce that they've sold out into 2025, following an earlier announcement from Micron regarding its HBM3E production. But of the two announcements, SK hynix's is arguably the most significant yet, as the South Korean firm's HBM production capacity is far greater than Micron's. So while things were merely "interesting" with the smallest of the Big Three memory manufacturers being sold out into 2025, things are taking a more concerning (and constrained) outlook now that SK hynix is as well. SK hynix currently controls roughly 46% - 49% of HBM market, and its share is not expected to drop significantly in 2025, according to market tracking firm TrendForce. By contrast, Micron's share on HBM memory market is between 4% and 6%. Since HBM supply of both companies is sold out through the most of 2025, we're likely looking at a scenario where over 50% of the industry's total HBM3/HBM3E supply for the coming quarters is already sold out. This leaves Samsung as the only me

SK Hynix has beat market estimates on its latest earnings on the back of rising prices of memory chip prices and strong sales of high-bandwidth memory (HBM).The South Korean chip giant said on Thursday that it recorded 12.42 trillion won in revenue and 2.88 trillion won in operating income in the fi