08/14/2024, 07:45 AM UTC
理解HBM：高带宽内存技术Understanding HBM: High Bandwidth Memory Technology
➀ HBM通过使用堆叠内存芯片和TSV技术解决了传统2D封装中的带宽限制。➁ HBM的关键技术包括先进封装、微凸点互连和TSV。➂ 与GDDR相比，HBM提供更高的带宽和更低的功耗，适用于高性能计算和图形处理。➀ HBM addresses bandwidth limitations in traditional 2D packaging by using stacked memory chips and TSV technology. ➁ Key technologies in HBM include advanced packaging, microbump interconnects, and TSV. ➂ HBM offers higher bandwidth and lower power consumption compared to GDDR, making it suitable for high-performance computing and graphics processing.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
