08/20/2024, 01:25 PM UTC
第二季度半导体销售额同比增长27%Q2 semis up 27%
➀ 第二季度集成电路销售额同比增长27%，预计第三季度将增长29%。➁ 第二季度已安装的晶圆厂产能达到每季度4050万片晶圆，预计第三季度将增长1.6%。➂ 第二季度内存产能增长0.7%，预计第三季度将增长1.1%，得益于HBM需求和内存价格的改善。➀ Q2 IC sales increased by 27% YoY and are expected to grow by 29% in Q3 2024. ➁ Q2 installed fab capacity reached 40.5 million wafers per quarter, projected to rise by 1.6% in Q3. ➂ Memory capacity increased by 0.7% in Q2 and is forecast to grow by 1.1% in Q3, supported by demand for HBM and improving memory pricing.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
