08/29/2024, 08:52 AM UTC
先进封装技术：推动人工智能和高带宽内存的未来Advanced Packaging Technologies: Driving the Future of AI and High-Bandwidth Memory
➀ 由于人工智能模型需要更多的参数和节能训练与推理，对高带宽内存（HBM）的需求正在增加。➁ HBM预计在未来几年将以50%的复合年增长率增长，推动对先进DRAM晶圆处理设备和HBM堆栈创建的需求。➂ 应用材料公司是该领域的领先供应商，其在HBM封装工艺设备支出中的份额超过50%，并在DRAM处理和3D封装技术方面有显著创新。➀ The demand for High Bandwidth Memory (HBM) is increasing due to the growth of AI models, which require more parameters and energy-efficient training and inference. ➁ HBM is expected to grow at a CAGR of 50% in the coming years, driving the need for advanced DRAM wafer processing equipment and HBM stack creation. ➂ Applied Materials is a leading supplier in this field, with over 50% share in HBM packaging process equipment spending and significant innovations in DRAM processing and 3D packaging technologies.
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