➀ Socionext licenses aiMotive's aiWare IP and tools to develop chiplet-based SoCs for automotive ADAS;

➁ The collaboration aims to accelerate AI adoption in automotive solutions, integrating energy-efficient neural network accelerators;

➂ Partnership focuses on mass production-ready Custom SoCs with SDK support, enhancing road safety and intelligence.

➀ Ex-Intel CEO Pat Gelsinger advises Japan's Rapidus to develop unique differentiating technologies beyond production efficiency to compete with TSMC.

➁ Rapidus plans to integrate wafer fabrication and advanced packaging at the same facility for faster cycles, though full automation will not be available immediately from 2027.

➂ The company aims to begin 2nm test production with GAA transistors and establish a chiplets R&D center, utilizing ASML EUV lithography tools for future HBM and 3D packaging.

➀ Fraunhofer IZM-ASSID celebrated its 15th anniversary as a global innovation leader in 3D system integration and wafer-level packaging, driving advancements in hybrid bonding and chiplet architectures;

➁ Key projects like CEASAX and the APECS pilot line under the EU Chips Act strengthen Europe's semiconductor ecosystem, enabling modular chip design and industrial collaboration;

➂ The institute fosters partnerships with industry giants (e.g., Infineon, GlobalFoundries) and academia, supporting critical research in edge AI, quantum computing, and automotive electronics.

➀ TrendForce releases the 2024 ranking of the top ten OSAT (Outsourced Semiconductor Assembly and Testing) companies;

➁ The article references related rankings of semiconductor companies and market trends;

➂ Highlights the critical role of OSAT providers in the semiconductor supply chain.

➀ Intel's Nova Lake CPUs adopt a groundbreaking chiplet design, integrating Xe3 Celestial for iGPU and Xe4 Druid for media/display engines on separate tiles;

➁ The split architecture allows TSMC N6/N5 nodes for non-critical components, improving cost-efficiency while preparing for future Druid-based products;

➂ Performance upgrades focus on media codec support (e.g., H.266 decode) and a potential tripling of iGPU power to rival low-end discrete GPUs.

➀ The June 2025 issue covers global electronics trade dynamics shaped by tariffs and evaluates India's semiconductor manufacturing progress;

➀ Features advanced technology topics including mesoporous silicon, Quantum 2.0, and chiplet architecture;

➃ Includes DIY projects like a wireless streaming camera and resources for PCB design, alongside startup innovations in wireless charging and aerospace.

➀ Analogue Insight and Tetrivis collaborate on developing Eurytion RFK1, a 12 nm RF chiplet transceiver supporting Ka/Ku-band with 2 GHz programmable bandwidth;

➁ The chiplet integrates Tetrivis' KuKa® IP and a local oscillator, leveraging UCIe standards for scalable connectivity;

➂ Targets applications in satellite communications, 5G, and aerospace due to its wideband performance and compact design.

➀ NVIDIA announced NVLink Fusion at Computex 2025, enabling third-party CPUs and accelerators to integrate with its NVLink ecosystem through semi-custom designs;

➁ The technology includes two approaches: NVLink C2C for connecting custom CPUs to NVIDIA GPUs, and a proprietary NVLink 5 chiplet for third-party accelerators to join NVLink networks;

➂ While offering flexibility, all nodes must include NVIDIA hardware, reflecting a strategic balance between openness and maintaining control over its ecosystem.

➀ Panmesia secures $30 million to develop modular AI accelerators using chiplet technology, targeting LLMs and large-scale AI workloads with optimized resource utilization;

➁ Its flexible chiplet architecture integrates in-memory processing and CXL to reduce data movement, power consumption, and infrastructure costs while enabling scalability;

➂ The accelerator combines manycore and vector processor chiplets, leveraging advanced nodes to deliver high parallelism and tailored performance for diverse AI tasks.

➀ Intel showcased its 18A process node (planned for late 2025 HVM) and 14A roadmap (15-20% performance per watt gain) with advanced technologies like RibbonFET and High-NA EUV tools;

➁ Collaborations with EDA giants (Synopsys, Cadence, Siemens) emphasized AI-driven design flows, DTCO optimization, and advanced packaging solutions like EMIB-T and 2nd-gen co-packaged optics;

➂ Focused on U.S.-based ecosystem expansion, including Arizona fabs, partnerships with Amkor for advanced packaging, and leveraging government support for secure semiconductor supply chains.

➀ Atum Works claims its nanoscale 3D printing method can replace current production flows and reduce chip fabrication costs by 90%;

➁ The method uses a nanoscale 3D printer to fabricate multi-material 3D structures with a 100 nm resolution at wafer scale;

➂ While not suitable for high-performance processors, the technology may be beneficial for packaging, photonics, sensors, and non-logic elements.

➀ Ayar Labs has unveiled the world's first UCIe optical chiplet, designed to eliminate data bottlenecks, reduce latency, and cut power consumption while enabling interoperability between chiplets from different vendors.

➁ The TeraPHY chiplet offers 8 Tbps bandwidth and is powered by Ayar Labs' 16-wavelength SuperNova light source, making it suitable for scalable AI architectures.

➂ AMD supports the UCIe standard, recognizing its importance in driving innovation and meeting the needs of AI scale-up solutions.

➀ A prototype for an E-Bike terminal has been developed at the Hochschule Karlsruhe (HKA) as part of a project aiming for sustainable mobility;

➁ The terminal is constructed primarily from renewable resources (wood) and is designed to be replicable in other locations;

➂ The project includes a solar power system to charge the E-bikes and features social components such as a meeting point for students and staff.

➀ This study explores the development of chitosan-silanized hexagonal boron nitride (hBN) nanocomposite films;

➁ It focuses on their structural, mechanical, and barrier properties;

➂ The research aims to enhance the performance of biodegradable polymer films, overcoming limitations of chitosan.

➀ MinebeaMitsumi has announced a tender offer to acquire thermistor specialist Shibaura Electronics to save it from a hostile takeover bid from Taiwan's Yageo Corp.;

➁ Shibaura Electronics, with a 13.5% world market share in thermistors, is a key player in vehicles, wind turbines, and industrial robots;

➂ Yageo Corp. plans to make a takeover bid on May 7th, offering $29 per share, but MinebeaMitsumi is offering $31 per share, totaling $485 million for the company.

➀ Ed在日记中透露，关税问题让他感到自豪，他预见到这将是Liz Truss故事的翻版，并相应地应对。

➁ 到周二晚上，关税已使全球股市价值蒸发10万亿美元，而到周四早上，股市又上涨了6万亿美元。

➂ 所有金融人士都说，当政府债券开始抛售时，总统将改变方向，就像Liz在她预算后大量出售金边债券时那样。

➀ Silex Technology has launched the AMC Edge System-on-Module (SoM), EP-200Q, which is powered by the Qualcomm Dragonwing™ QCS6490 processor and offers high-performance edge AI capabilities in a very small form factor.

➁ The EP-200Q integrates Wi-Fi 7 drivers and is optimized for industrial and healthcare IoT devices requiring power efficiency and rapid deployment.

➂ It features an octa-core CPU, Hexagon DSP, and a 12-TOPS AI engine, along with long-term availability through the Qualcomm Product Longevity Program.

➀ Hamamatsu Photonics Europe has launched NZConnectMD Scan, an image acquisition platform for digital pathology workflows.

➁ The software allows for centralized control of multiple NanoZoomer MD Series scanners.

➂ Key features include barcode-based slide tracking, workflow balancing, and space optimization.

➀ Navitas Semiconductor发布了首款量产的650V双向氮化镓（GaN）快充IC，结合了隔离式栅极驱动器。

➁ 这些IC支持单阶段双向系统（BDS），可取代传统的两阶段功率转换设计，适用于电动汽车充电、太阳能逆变器和电机驱动等应用。

➂ 使用这些IC的制造商报告称，成本降低了10%，能源节约20%，体积减少了50%。

➀ Magnachip Semiconductor Corporation has launched 25 new 6th-generation Super Junction (SJ) MOSFETs, which are designed for various applications such as AI TVs, smart appliances, industrial equipment, and electric vehicle (EV) chargers.

➁ These new MOSFETs offer improved switching speeds (up to 23% faster), reduced size (about 30% smaller), and enhanced reliability compared to the previous generation.

➂ The products support voltage ratings of 600V, 650V, and 700V, and are available in multiple package types including TO220, TO220FT, SOT223, and others.