<p>➀ Intel showcased its 18A process node (planned for late 2025 HVM) and 14A roadmap (15-20% performance per watt gain) with advanced technologies like RibbonFET and High-NA EUV tools;</p><p>➁ Collaborations with EDA giants (Synopsys, Cadence, Siemens) emphasized AI-driven design flows, DTCO optimization, and advanced packaging solutions like EMIB-T and 2nd-gen co-packaged optics;</p><p>➂ Focused on U.S.-based ecosystem expansion, including Arizona fabs, partnerships with Amkor for advanced packaging, and leveraging government support for secure semiconductor supply chains.</p>