04/29/2025, 04:23 PM UTC
2025 英特尔代工服务大会：决定英特尔成败的关键时刻Intel Foundry Direct Connect 2025 Make-or-Break Time For Intel
➀ 英特尔公布 18A 制程（计划 2025 年底量产）和 14A 路线图（能效提升 15-20%），展示 RibbonFET 晶体管、高数值孔径 EUV 光刻机等创新技术；
➁ 与 Synopsys、Cadence、西门子等 EDA 巨头合作，推动 AI 驱动设计流程、设计-工艺协同优化（DTCO），并推出 EMIB-T 封装、第二代共封装光学等先进封装方案；
➂ 强调美国本土生态布局，包括亚利桑那州晶圆厂扩建、与 Amkor 合作先进封装，并依托政府支持打造安全半导体供应链。
➀ Intel showcased its 18A process node (planned for late 2025 HVM) and 14A roadmap (15-20% performance per watt gain) with advanced technologies like RibbonFET and High-NA EUV tools;
➁ Collaborations with EDA giants (Synopsys, Cadence, Siemens) emphasized AI-driven design flows, DTCO optimization, and advanced packaging solutions like EMIB-T and 2nd-gen co-packaged optics;
➂ Focused on U.S.-based ecosystem expansion, including Arizona fabs, partnerships with Amkor for advanced packaging, and leveraging government support for secure semiconductor supply chains.
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