06/25/2025, 10:28 AM UTC
15年弗劳恩霍夫IZM-ASSID：德累斯顿研究所引领微电子未来15 Years of Fraunhofer IZM-ASSID: Dresden Institute Unit Shapes the Future of Microelectronics
➀ 弗劳恩霍夫IZM-ASSID成立15周年，成为3D系统集成和晶圆级封装领域的全球创新引领者，推动混合键合技术和芯粒架构发展；
➁ 主导CEASAX中心和欧盟芯片法案下的APECS中试线项目，强化欧洲半导体生态，实现模块化芯片设计与产业协同；
➂ 与英飞凌、格芯等企业及高校深度合作，重点推进边缘AI、量子计算与汽车电子领域的前沿研究。
➀ Fraunhofer IZM-ASSID celebrated its 15th anniversary as a global innovation leader in 3D system integration and wafer-level packaging, driving advancements in hybrid bonding and chiplet architectures;
➁ Key projects like CEASAX and the APECS pilot line under the EU Chips Act strengthen Europe's semiconductor ecosystem, enabling modular chip design and industrial collaboration;
➂ The institute fosters partnerships with industry giants (e.g., Infineon, GlobalFoundries) and academia, supporting critical research in edge AI, quantum computing, and automotive electronics.
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