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Recent #TSMC news in the semiconductor industry

weixin
about 1 year ago

The Precision Beyond Photolithography: TSMC's Power and Empire

➀ The six core members of TSMC's R&D department were awarded for their achievements in the '0.13 micron copper process' war in 2003;

➁ TSMC's power struggle and the rise and fall of key figures like Liang孟松;

➂ TSMC's talent cultivation system and the internal power structure of the company;

➃ TSMC's influence on Taiwan's economy and its unique 'Zheng Huangqi' recruitment model;

➄ The challenges and opportunities facing TSMC in the global semiconductor industry.

TSMCTalent Cultivationsemiconductor industry
digitimes
about 1 year ago

ASML Launches 2025 EUV Pricing Offensive and Defensive War, Tightens TSMC's Only Weakness and Reverse Increases

➀ ASML's order book and outlook have been revised downwards, primarily due to cuts in orders from Samsung Electronics and Intel.

➁ ASML and TSMC are expected to begin negotiating the 2025 equipment procurement prices, with ASML possibly adjusting prices in reverse.

➂ The negotiation results between the two companies will not only affect ASML's future performance growth but also affect the pricing of equipment manufacturers in Europe, America, and Japan.

ASMLEUVTSMCsemiconductor equipment
weixin
about 1 year ago

NVIDIA TSMC Alliance Shows Cracks

➀ The partnership between NVIDIA and TSMC, one of the most profitable in AI chip business, is showing signs of tension due to production issues with NVIDIA's new Blackwell chip.

➁ Issues with the chip, including potential design flaws, were discovered during testing by NVIDIA engineers.

➂ TSMC employees believe that NVIDIA's rushed production requirements contributed to the problems.

➃ NVIDIA's Blackwell chip mass production plan is delayed to the fourth quarter, with additional costs incurred.

AI ChipNVIDIATSMCTechnology Partnership
weixin
about 1 year ago

TSMC to Utilize 5nm Advanced Packaging HBM4 Memory Chips?

➀ TSMC's HBM4 memory launch brings significant changes, with the most noticeable being the expansion of memory interfaces from 1024 to 2048 bits;

➁ TSMC revealed details about base die for HBM4 manufacturing using improved versions of its N12 and N5 processes at the 2024 European Technology Symposium;

➂ TSMC plans to adopt two different manufacturing processes, N12FFC+ and N5, for the first batch of HBM4 product packaging;

➃ TSMC is working with major HBM memory suppliers like Micron, Samsung, and SK Hynix to integrate HBM4 memory technology using advanced process nodes;

➄ TSMC's N12FFC+ process is suitable for achieving HBM4 performance, allowing memory manufacturers to build 12-Hi (48GB) and 16-Hi (64GB) stacks with over 2TB/s bandwidth;

➅ TSMC's N5 process will integrate more logic functions, reduce power consumption, and provide higher performance with very small interconnect spacing, enabling HBM4 direct 3D stacking on logic chips.

5nm TechnologyAdvanced PackagingHBM4Memory ChipsTSMC
electronicsweekly
about 1 year ago

TSMC Q3 revenue up 36% y-o-y

➀ TSMC reported revenue of $23.62 billion in the July-September period, a 36% year-on-year increase; ➁ September sales reached $7.74 billion, up 39.6% from the same period last year; ➂ Half of TSMC's revenue now comes from HPC, with growth driven by AI ICs, and demand for which depends on large AI investors finding paying customers for AI products.
AI ChipHPCTSMCsemiconductor
weixin
about 1 year ago

TSMC Partners with Amkor to Provide Advanced Packaging and Testing Services in Arizona

➀ TSMC and Amkor have signed a MoU to provide advanced packaging and testing services in Arizona to expand the local semiconductor ecosystem; ➁ TSMC will adopt Amkor's turnkey advanced packaging and testing services at its new facility in Peoria, Arizona, to support its customers, particularly those with advanced wafer fabrication plants in Phoenix; ➂ The partnership aims to shorten the overall product production cycle by closely collaborating between TSMC's front-end wafer manufacturing factory in Arizona and Amkor's nearby back-end packaging and testing factory; ➃ Both companies will decide on the packaging technology to meet the capacity demand of their common customers, such as TSMC's InFO and CoWoS; ➄ The agreement highlights the commitment of both companies to support customers' regional flexibility requirements in front-end and back-end manufacturing, while fostering the local semiconductor manufacturing ecosystem.
AmkorTSMCsemiconductor
chinatimes
about 1 year ago

TSMC 2nm Wafer Prices Expected to Double

➀ TSMC's 2nm technology development is progressing smoothly with plans for the new Taichung Hsinchu Science Park to start production in 2025; ➁ The price of the 2nm wafer is expected to be doubled compared to the 4/5nm, potentially exceeding $30,000, reflecting its sole supply situation and pricing power; ➂ The high investment in advanced process nodes, such as the over $4 billion for 3nm research and development, shows the importance of key supply chains; ➃ The cost of constructing a 3nm factory is estimated to be at least $15 to $20 billion; ➄ The development of advanced processes is a lengthy and resource-intensive process, often requiring 7 to 10 years, with the 2nm process having its path confirmed since 2016 but only recently becoming clear in terms of trial production timelines; ➅ The new process architecture involves substantial engineering support from equipment, software, and material industries; ➆ TSMC is following in the footsteps of the national mountain, overcoming many early difficulties and meeting the localization requirements of the supply chain; ➇ With the 2nm process expected to be released in 2025, supply chain companies are expected to see significant profit growth; ➈ M31's IP research has already entered the 2nm process platform supporting smartphones and high-performance computing, and Liwang is also developing 2nm technology in collaboration with leading wafer fabs; ➈ Material companies like Zhongsha and Shengyang Semiconductor are involved in diamond disks and recycled wafers for the 2nm process, with recycled wafers having a value approximately 4.6 times that of 28nm, offering significant commercial opportunities.
TSMCadvanced technologysemiconductor
weixin
about 1 year ago

2nm, The Great Battle!

➀ TSMC has won the FinFET race, with all major advanced logic designs, even Intel's, manufactured on its N5 and N3 processes in Taiwan. Competitors are falling behind. Samsung has performed poorly since 7nm, with low yields, and Intel is still in the early stages of its recovery with Intel 4 and Intel 3 nodes; major customers have not ordered these nodes in large quantities. ➁ The future of TSMC's dominance is uncertain. FinFET cannot be scaled further, and SRAM miniaturization has stalled for several nodes. The industry is at a critical turning point, and leading logic must adopt two new paradigms in the next 2-3 years: gate-all-around (GAA) and backside power delivery (BSPDN). ➂ Intel's failure at the 10nm node and the loss of 3 years of lead were due to many factors, including the failure to adopt EUV and transitioning to cobalt metallization with an immature tool supply chain despite warnings from Applied Materials that their tools were not ready. GAA and BSPDN bring new opportunities to the foundry competition and could even open the door to new entrants in the field such as Rapidus, a 2nm foundry startup supported by the Japanese government. ➃ As capital expenditures for building advanced wafer fabs soar, this could mean that Samsung or Intel may be forced out of the competition. The article delves into these themes, discussing BSPDN technology, the front-end logic roadmaps of all four fabs, the competitiveness of their process technologies, and SRAM scaling, among others.
GAATSMCsemiconductor technology
wccftech
about 1 year ago

Dimensity 9400 Unit Price Estimated To Be 20 Percent Higher Thanks To TSMC’s 3nm ‘N3E’ Process, But Still Cheaper Than The Snapdragon 8 Gen 4

➀ The Dimensity 9400 is expected to be 20 percent more expensive due to TSMC's advanced 3nm 'N3E' process, but still cheaper than the Snapdragon 8 Gen 4; ➁ The estimated price of the Dimensity 9400 is rumored to be $155, while the Snapdragon 8 Gen 4 is expected to cost $190; ➂ The Dimensity 9400 is the first Android chip to use this advanced lithography, and its performance is expected to be impressive.
TSMC
techovedas
about 1 year ago

TSMC and Samsung Explore $100 Billion Chip Mega Factories in UAE

➀ TSMC and Samsung are in preliminary discussions with the UAE to establish massive chip manufacturing facilities valued at over $100 billion; ➁ The feasibility of building advanced manufacturing complexes has been assessed by executives from both companies; ➂ The projects are expected to be funded primarily by the UAE government with support from Abu Dhabi's sovereign wealth fund, Mubadala; ➃ The factories aim to bolster global chip production capacity for AI technologies; ➄ Concerns have been raised about the potential transfer of advanced chip technology to China.
SamsungTSMCsemiconductor