10/04/2024, 09:18 AM UTC
台积电携手Amkor，将在亚利桑那提供先进封测服务TSMC Partners with Amkor to Provide Advanced Packaging and Testing Services in Arizona
➀ 台积电与安靠签署合作备忘录，将在亚利桑那提供先进封装测试服务，以扩大当地半导体生态圈；➁ 台积电将采用安靠在亚利桑那皮奥里亚市新建厂的一站式先进封装测试服务，支持其客户，特别是凤凰城先进晶圆制造厂生产的芯片客户；➂ 通过台积电亚利桑那前段晶圆制造厂与安靠后段封测厂的紧密合作，将缩短整体产品的生产周期；➃ 双方将决定合作的封装技术，以满足共同客户的产能需求，例如台积电的整合型扇出（InFO）及CoWoS；➄ 此项协议突显了双方共同承诺支持客户在前端与后端制造的地域弹性要求，同时促进当地半导体制造生态圈的蓬勃发展。➀ TSMC and Amkor have signed a MoU to provide advanced packaging and testing services in Arizona to expand the local semiconductor ecosystem; ➁ TSMC will adopt Amkor's turnkey advanced packaging and testing services at its new facility in Peoria, Arizona, to support its customers, particularly those with advanced wafer fabrication plants in Phoenix; ➂ The partnership aims to shorten the overall product production cycle by closely collaborating between TSMC's front-end wafer manufacturing factory in Arizona and Amkor's nearby back-end packaging and testing factory; ➃ Both companies will decide on the packaging technology to meet the capacity demand of their common customers, such as TSMC's InFO and CoWoS; ➄ The agreement highlights the commitment of both companies to support customers' regional flexibility requirements in front-end and back-end manufacturing, while fostering the local semiconductor manufacturing ecosystem.
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