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Digitimes 重点报道台湾半导体行业新闻

May 1

  • China Breaks EUV Light Source Barrier, Builds New Experimental Platform

    ➀ China has achieved a breakthrough in semiconductor research by establishing a fully functional EUV light source experimental platform;

    ➁ The Shanghai Institute of Optics and Fine Mechanics has reached a peak energy conversion efficiency of 3.42% in their EUV development efforts;

    ➂ This progress underscores China's commitment to technological independence despite increasing US export restrictions;

    ➃ China has become ASML's largest single market, accounting for 36.1% of total sales.

  • Samsung Exits HBM2E Market, Focuses on HBM3E and HBM4

    ➀ Samsung Electronics is reducing production of DDR4 memory and scaling back its HBM2E business to focus on HBM3E and HBM4 products.

    ➁ Analysts believe this move is a response to the rise of Chinese firms in mature-process memory, forcing Samsung to retreat from segments with intense low-cost competition.

    ➂ Samsung is aiming to pass Nvidia's HBM3E certification to boost production and gain early leadership in the emerging HBM4 market.

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