➀ Ex-Intel CEO Pat Gelsinger advises Japan's Rapidus to develop unique differentiating technologies beyond production efficiency to compete with TSMC.
➁ Rapidus plans to integrate wafer fabrication and advanced packaging at the same facility for faster cycles, though full automation will not be available immediately from 2027.
➂ The company aims to begin 2nm test production with GAA transistors and establish a chiplets R&D center, utilizing ASML EUV lithography tools for future HBM and 3D packaging.