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October 18
- CEO Interview: Dr. Mehdi Asghari of SiLC Technologies➀ Dr. Mehdi Asghari discusses his entrepreneurial journey and SiLC Technologies' mission to enable machine vision similar to humans; ➁ SiLC's first fully integrated coherent LiDAR chip and its applications in robotics, mobility, and perimeter security; ➂ The challenges and opportunities in the AI and robotics industries, with a focus on the importance of coherent imaging for machine autonomy.
- Prioritize Short Isolation for Faster SoC Verification➀ The increasing complexity of SoC designs and the challenge of shorted nets in LVS verification; ➁ The challenges of traditional LVS verification and short debugging approaches; ➂ The benefits of the Calibre RVE Interactive Short Isolation (ISI) flow for efficient short isolation and debugging; ➃ The boost in designer productivity through integrated short isolation.
October 17
- The Perils of Aging, From a Semiconductor Device Perspective➀ An analysis of the recent issues with Intel's 13th and 14th Gen processors; ➁ Root cause identified as Vmin Shift Instability; ➂ Importance of precise analysis tools in preventing aging degradation.
- ASML's Downturn: Not a Surprise Amidst Industry Bifurcation and China's Spending Risk
➀ Investors are realizing the upcycle isn't as strong as stocks indicate.
➁ Industry bifurcation between AI and the rest of the industry continues.
➂ China's spending risk/overhang is now impacting the market.
➃ ASML's order decline indicates a more gradual recovery in the semiconductor industry.
➄ The AI sector remains strong while the majority of the chip industry is weak.
➅ Many investors mistakenly take AI's success as an indicator of the entire chip market.
➆ The chip industry is bifurcating into AI and non-AI sectors.
➇ China's spending is unsustainable and could lead to sanctions.
➈ The chip equipment industry is likely to follow ASML's downward trend.
➉ Investors should be more selective in chip stock investments.
- ASML surprise not a surprise (to us)- Bifurcation- Stocks reset- China headfake➀ Silicon Motion and DeepCool partner to develop high-performance cooling solutions; ➁ Noctua to release new cooling products in partnership with Agile Analog; ➂ Microchip unveils new X-Epic series for gaming and PC components.
October 16
- Mobile LLMs Aren’t Just About Technology. Realistic Use Cases Matter➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices
- Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub- 7nm ICs with Backside PDN➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.
October 15
- Navigating resistance extraction for the unconventional shapes of modern IC designs➀ The complexity of IC design due to the rise of IoT, image sensors, and 3DICs; ➁ Challenges in resistance extraction for non-Manhattan routing and unconventional shapes; ➂ The importance of accurate resistance extraction for design reliability and evolving fracturing techniques.
- Alchip Technologies Sets Another Record➀ Alchip Technologies has achieved record revenue, operating income, and net income in Q2 2024; ➁ Revenue from AI ASIC shipments and 5nm AI accelerators contributed significantly to the growth; ➂ Alchip's focus on high-performance ASICs and SoC design continues to pay off.
October 14
- Hearing Aids are Embracing Tech, and Cool➀ The rise in hearing loss among young adults and the global need for better hearing aids; ➁ The FDA's authorization for Apple AirPods Pro to be sold over the counter as a hearing aid; ➂ The trend towards AI-driven personalization in hearing aids and the role of Cadence Tensilica in supporting this technology.
October 11
- CEO Interview: Tobias Ludwig of LUBIS EDA➀ Tobias Ludwig discusses his journey in electronic design automation and the founding of LUBIS EDA; ➁ The challenges and inefficiencies in traditional formal verification processes; ➂ LUBIS EDA's innovative approach to automating and simplifying formal verification using AI techniques.
- How AI is Redefining Data Center Infrastructure: Key Innovations for the Future➀ AI is transforming data center infrastructure with innovations like advanced connectivity and chiplets; ➁ The shift to optical connectivity is enhancing performance and efficiency; ➂ Chiplet ecosystems are enabling scalable and cost-effective solutions for AI workloads.
October 10
- Navigating Frontier Technology Trends in 2024➀ The decline in technology equity investments in 2023 and the rise of generative AI; ➁ The importance of quantum technologies and their applications; ➂ The challenges and opportunities in the quantum ecosystem.
October 9
- EVs, Silicon Carbide & Soitec’s SmartSiC™: The High-Tech Spark Driving the Future (with a Twist!)➀ The rise of EV sales and the role of SiC in enhancing efficiency; ➁ The benefits of SiC in EV inverters and fast charging; ➂ Soitec's SmartSiC™ and its impact on sustainability and performance
- Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024➀ TSMC's 3DBlox framework addresses complexities in 3DIC design; ➁ Innovations in 2024 focus on simplifying 3D design challenges; ➂ TSMC's strategies for managing electrical and physical constraints in 3DIC systems.
October 8
- SPIE Monterey- ASML, INTC – High NA Readiness- Bigger Masks/Smaller Features➀ ASML's new CEO, Christophe Fouquet, discussed High NA EUV and the rapid adoption of the technology; ➁ Doubling the size of photomasks from 6″x6″ to 6″x12″ was proposed by Intel and supported by ASML; ➂ Intel has installed two High NA systems, showing significant improvement over standard EUV.
September 27
- Automating Reset Domain Crossing (RDC) Verification with Advanced Data Analytics➀ The complexity of SoC designs continues to rise, making RDC verification challenging; ➁ Data analytics techniques can automate RDC verification, reducing manual analysis and improving efficiency; ➂ Case study shows a significant reduction in RDC violations through data-driven analysis.
September 2
- Intel and Cadence Collaborate to Advance the All-Important UCIe Standard➀ Intel and Cadence collaborate to advance the UCIe standard, focusing on multi-die design and interoperability. ➁ The collaboration aims to address technical challenges in UCIe compliance and pre-silicon interoperability. ➂ The white paper details the strategies and technical advancements in building an open chiplet ecosystem.
August 27
- Analog Bits Momentum and a Look to the Future➀ Analog Bits is aggressively moving to advanced nodes, with new IP developments at 3nm and 2nm. ➁ The company continues to enhance its catalog with technologies like glitch detection, power management, and high-accuracy PVT sensors. ➂ The future may see Analog Bits integrating AI for adaptive control, enhancing system performance and power efficiency.
August 23
- Overcoming Verification Challenges of SPI NAND Flash Octal DDR➀ The automotive industry's demand for high-capacity, high-speed storage solutions has led to the adoption of SPI Octal DDR NAND Flash, which presents unique verification challenges. ➁ Traditional verification models for NOR Flash are inadequate for simulating the complex architecture of Octal SPI NAND devices. ➂ Cadence, in collaboration with Winbond, has developed an enhanced SPI NAND Flash Memory Model to address these challenges, ensuring reliable performance in automotive applications.
August 21
- Synopsys IP Processor Summit 2024➀ Synopsys will host the IP Processor Summit 2024 in Santa Clara, focusing on RISC-V solutions for IoT and automotive applications. ➁ The keynote speaker, Alexander Kocher, CEO of Quantauris, will discuss the benefits and challenges of RISC-V adoption. ➂ The event will provide in-depth information on ARC-V™ RISC-V processor IP and other related technologies.
August 20
- Weebit Nano is at the Epicenter of the ReRAM Revolution➀ Weebit Nano is leading the ReRAM revolution, addressing the limitations of flash memory. ➁ TSMC and other foundries are exploring and adopting ReRAM technology. ➂ ReRAM is gaining momentum in various applications, including AI and automotive.
August 15
- The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation➀ UCIe standardizes chiplet communication, lowering barriers and fostering innovation. ➁ It enables specialized and customized solutions by allowing mix-and-match of chiplets from various vendors. ➂ UCIe supports custom silicon for AI applications, enhancing performance and efficiency.
August 13
- Why Glass Substrates?➀ Glass substrates offer superior flatness and higher interconnect densities, potentially replacing organic substrates and silicon interposers. ➁ They provide better thermal matching with silicon dies and can handle higher chip densities. ➂ Challenges include brittleness, adhesion issues, and lack of industry standards.
August 11
- A Post-AI-ROI-Panic Overview of the Data Center Processing Market➀ The data center processing market shows robust growth, especially in processing, with a 20.3% increase. ➁ Nvidia dominates the market in terms of both revenue and profits, with a significant lead over competitors. ➂ The supply chain for AI GPUs has evolved, with memory supply becoming a critical component.
August 6
- 3D IC Design Ecosystem Panel at #61DAC➀ The panel discussed the challenges of power efficiency in AI and data centers, highlighting the need for 3D hybrid bonding for denser and more power-efficient interconnects. ➁ Intel Foundry emphasized a systems approach to integrating 3D IC products, aiming for CAD agnostic tool flows and System Technology Co-Optimization (STCO). ➂ Qualcomm focused on co-optimization and shift-left strategies, staying EDA vendor-agnostic to tackle multi-physics challenges.
August 5
- Mitigating AI Data Bottlenecks with PCIe 7.0➀ AI data bottlenecks are addressed with PCIe 7.0, offering higher bandwidth and lower latency. ➁ PCIe 7.0 supports system-level optimization and reduces data center power consumption. ➂ The integration of photonics into PCIe ensures its relevance and benefits for future AI advancements.
August 4
- Intel’s death spiral took another turn➀ Intel's latest earnings report indicates a deeper plunge into its financial woes, with revenue and gross margin missing guidance. ➁ The company is making tough decisions, including headcount reduction and capital expenditure cuts, to address its financial challenges. ➂ Intel is also leveraging creative financing strategies, such as the Semiconductor Co-Investment Program, to support its manufacturing expansion plans.
- LRCX Good but not good enough results, AMAT Epic failure and Slow Steady Recovery➀ Lam Research reported good financial results but provided a softer guidance, leading to investor disappointment. ➁ Applied Materials' request for CHIPS Act funding for their Epic facility seems to have been denied. ➂ The semiconductor industry is expected to recover steadily, but at a slower pace than previous cycles, influenced by factors like AI and HBM, as well as declining margins from Chinese customers.
August 2
- Easy-Logic and Functional ECOs at #61DAC1. Easy-Logic introduced the GTECH design flow at #61DAC, simplifying the functional ECO process for ASIC designs; 2. The EasylogicECO tool allows for smaller ECO patch sizes and faster runtimes, improving success rates in metal ECO projects; 3. Easy-Logic, recognized as a top 10 EDA vendor, continues to expand its influence with over 40 global customers and four ECO tools.