➀ The expansion of TSMC's fabs in Arizona raises concerns in Taiwan about the potential loss of its 'Silicon Shield';

➁ TSMC has assured Taiwan that it will maintain the most advanced technology in Taiwan and that the foreign fabs are not the most advanced;

➂ The Taiwan government's approval is required for TSMC's foreign investments above $45.5 million.

➀ The launch of the Electronics Weekly CHIIPS podcast featuring an interview with Harriet Green.

➁ TSMC's $100bn investment in Arizona to avoid Trump Tariffs.

➂ ST pairing near-threshold logic with a Cortex-M33 core for energy-efficient microcontrollers.

➃ UK's Westcott Drone Test and Development Centre receives £1.4m funding for facility upgrades.

➀ The US Chips Act is under threat after President Trump's speech in Congress;

➁ Trump urged Congress to scrap the Act and use leftover funds for other purposes;

➂ Trump believes tariffs are a better way to support domestic chip-making and cited TSMC's $100 billion investment in Arizona fabs as an example.

➀ The investor community is in a state of uncertainty about Intel's future;

➁ TSMC's preference for building its own fabs over taking over Intel's has raised concerns;

➂ The US administration's view on Intel's capability to be a leading-edge domestic supplier is questioned.

➀ President Trump and CC Wei announced a $100 billion investment by TSMC in Arizona, bringing the total investment to $165 billion;

➁ The investment is expected to create thousands of high-paying jobs and support the progress of AI and smartphones;

➂ TSMC plans to build three more fabs and two more packaging plants in Arizona.

➀ TSMC announced a $100 billion investment plan in the US, including the construction of 5 new chip factories over the next few years;

➁ The new investment includes 3 chip manufacturing plants and 2 advanced packaging factories, as well as a large-scale R&D center in the US;

➂ Trump emphasized the importance of chip and semiconductor manufacturing within the US for national security;

➃ TSMC promises to create 40,000 construction jobs in the US over the next four years;

➄ TSMC began producing 4nm chips for US customers in Arizona and has agreed to produce 2nm chips in its second Arizona factory, set to start production in 2028.

➀ TSMC plans to start mass production of its A16 process node in Taiwan by 2026 and expand to Arizona by 2028.

➁ TSMC's new Arizona wafer fab has begun mass production, with the first one in the US achieving mass production.

➂ TSMC's new 2nm and A16 process nodes may be produced in the US earlier than previously planned.

➀ Dolphin Semiconductor has announced a collaboration with Ingenic, a key player in high-performance SoC design in China.

➁ The company will provide Low Dropout (LDO) regulators in TSMC 22nm technology for camera applications.

➂ This collaboration reinforces Dolphin Semiconductor's position as a trusted partner in power management IP solutions.

➀ TSMC is advancing its 2nm process node, aiming for a monthly production capacity of 50,000 to 80,000 wafers by the end of 2025.

➁ TSMC's 2nm process node is in an intensive trial production phase, with the Hsinchu Baoshan plant expected to produce 5,000 to 10,000 wafers monthly.

➂ If the second phase progresses smoothly, the monthly production capacity could reach up to 80,000 wafers before the end of the year.

➀ TSMC's 2nm process development is attracting attention, with market rumors suggesting that its monthly production capacity could reach 50,000 to 80,000 units by the end of the year;

➁ TSMC Chairman Wei Zhejia mentioned that Taiwan will continue to expand advanced process and packaging capacity, including the expansion of 3nm in Tainan and 2nm in Hsinchu and Kaohsiung;

➂ Market rumors suggest that TSMC's 2nm process is progressing rapidly and has entered the trial production stage, with an estimated monthly production capacity of 5,000 to 10,000 units at the Hsinchu Science Park factory.

➀ Taiwan's chip industry took 50 years of hard work to build, according to Wu Cheng-wen, head of Taiwan's National Science and Technology Council;

➁ Honda and Nissan cancelled their merger talks due to significant differences in expectations;

➂ Intel is in advanced talks to sell a majority stake in its FPGA unit Altera to Silverlake Partners.

➀ Apple has announced the iPhone 16e with its first in-house 5G modem, the Apple C1, made on TSMC's 4nm and 7nm nodes.

➁ The iPhone 16e is priced at $599 and features the A18 processor, offering excellent battery life.

➂ The new C1 modem is the most power-efficient baseband chip in an iPhone, with a combination of TSMC's 4nm and 7nm processes.

➀ Apple has introduced its first in-house developed 5G modem, the C1, six years after acquiring Intel's 5G modem business unit.

➁ The C1 is designed for the iPhone 16e, a mainstream smartphone, and promises high power efficiency and fast connectivity.

➂ Apple has not disclosed how the C1 achieves its power efficiency, but it is likely due to custom cores and TSMC's 4nm-class process technology.

➀ Intel principal engineer Joseph Bonetti argues against a rumored TSMC deal, stating that Intel's 18A process node is more advanced and nearing completion.

➁ Bonetti mentions that early adopters of Intel 18A include Microsoft and Amazon.

➂ He discusses the challenges facing Intel and the unprofitability of Intel Foundry Services (IFS) due to large investments and the lack of major external contracts.

➀ An Intel insider, Joseph Bonetti, disputes recent rumors about Intel's struggles and its potential partnership with TSMC, arguing that Intel is making significant progress in semiconductor manufacturing.

➁ Bonetti highlights Intel's 3nm and 2nm process technologies, noting that Intel 3 is already in production and the next-generation Intel 18A is nearing completion.

➂ He emphasizes Intel's lead in High-NA EUV lithography, which is crucial for 1nm-level advanced processes.

➃ Despite financial difficulties, Bonetti believes Intel Foundry will prove itself with its products and attract major customers like Microsoft and Amazon.

➄ He warns against giving TSMC control over Intel's wafer fabs, emphasizing the potential damage to Intel and the US leadership position.

➀ Intel principal engineer expresses concern over TSMC's potential takeover of Intel Foundry.

➁ He highlights Intel's 18A technology advantage and advancements in semiconductor manufacturing.

➂ Bonetti argues against the notion that TSMC engineers are necessary for Intel's latest process technologies.

➀ Siemens Digital Industries Software has introduced an automated and certified workflow for TSMC's InFO packaging technology.

➁ The workflow is driven by Innovator3D IC and includes Xpedition Package Designer software, HyperLynx DRC, and Calibre nmDRC technologies.

➂ Siemens Digital's svp AJ Incorvaia highlights the expansion of design avenues for customers.

➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；

➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；

➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。

➀ A deal between Intel and TSMC has been proposed by the new US administration;

➁ TSMC may take over the management of some or all of Intel's manufacturing sites;

➂ Speculations include the possibility of a joint venture between TSMC and Intel with U.S. chip design companies investing.

➀ Applied Materials reported lower-than-expected QTR guidance due to China market share loss.

➁ AMAT attributed the weakness to China export restrictions but analysts believe share loss is also a factor.

➂ Domestic Chinese semiconductor equipment makers are gaining market share, potentially reducing AMAT's sales.